Electronic device module and method of manufacturing the same
An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.
1. An electronic device module comprising:
a substrate;
at least one first component and at least one second component disposed on one surface of the substrate;
a sealing portion comprising a first sealing portion and a second sealing portion, wherein the first sealing portion and the second sealing portion are separated by a shielding portion,
wherein the second sealing portion has the at least one second component embedded therein, and disposed on the substrate,
wherein the first sealing portion is disposed outside of the second sealing portion, between the at least one first component and the substrate; and
a connection terminal disposed to penetrate through the first sealing portion,
wherein the at least one first component is bonded to the connection terminal by a conductive adhesive,
wherein the sealing portion comprises an insulation material, and
wherein a top surface of the first sealing portion and a top surface of the shielding portion disposed between the first sealing portion and the second sealing portion are a same distance from the one surface of the substrate.
2. The electronic device module of claim 1 , further comprising a shielding portion disposed on a surface of the second sealing portion.
3. The electronic device module of claim 1 , wherein the at least one first component is electrically connected to the substrate through the connection terminal.
4. The electronic device module of claim 3 , wherein the first sealing portion height is substantially equal to a height of the connection terminal.
5. The electronic device module of claim 1 , further comprising:
an antenna disposed on another surface of the substrate.
6. The electronic device module of claim 5 , wherein the antenna is disposed in an area opposing an area in which the first sealing portion is disposed.
7. The electronic device module of claim 1 , further comprising a third sealing portion disposed on the one surface of the substrate, and having a height greater than a height of the first sealing portion and equal to or less than a height of the second sealing portion.
8. The electronic device module of claim 2 , further comprising:
a ground electrode on the substrate,
wherein the shielding portion is connected to the ground electrode
where the shielding portion separates the first sealing portion from the second sealing portion.
9. The electronic device module of claim 8 , wherein the top surface of the shielding portion between the first sealing portion and the second sealing portion is coplanar with the top of the first sealing portion.
10. The electronic device module of claim 4 , wherein the at least one first component is separated from the first sealing portion by a height of the conductive adhesive.
11. The electronic device module of claim 2 , further comprising a fourth sealing portion disposed on the one surface of the substrate, and having a second component of the at least one second component embedded therein, the fourth sealing portion being spaced apart from the first sealing portion and the second sealing portion.
12. The electronic device module of claim 11 , wherein the fourth sealing portion has a stepped portion of which a height is reduced towards the second sealing portion.
13. The electronic device module of claim 11 , wherein, in the fourth sealing portion, a height of a portion adjacent to the second sealing portion is equal to twice a spaced distance from the second sealing portion or less.
14. The electronic device module of claim 11 , wherein the shielding portion is extended to a surface of the fourth sealing portion.
15. An electronic device module comprising:
a sealing portion comprising a first sealing portion and a second sealing portion, wherein the first sealing portion and the second sealing portion are separated by a shielding portion;
a first electronic component disposed on a conductive adhesive on a connection terminal disposed to penetrate through the first sealing portion and electrically connected to the substrate through the first sealing portion; and
a second electronic component embedded in the second sealing portion,
wherein the sealing portion comprises an insulation material, and
wherein a top surface of the first sealing portion and a top surface of the shielding portion disposed between the first sealing portion and the second sealing portion are a same distance from the one surface of the substrate.
16. The electronic device module of claim 15 , further comprising a shielding portion disposed on the second sealing portion and electrically connected to a ground electrode on the substrate,
wherein the shielding portion separates the first sealing portion from the second sealing portion.
17. The electronic device module of claim 16 , further comprising an antenna disposed on a second surface of the substrate opposing the first sealing portion.
18. The electronic device module of claim 15 , further comprising:
a third sealing portion disposed on the first surface of the substrate; and
a third electronic component embedded in the third sealing portion,
wherein the shielding portion is disposed on the third sealing portion, and
wherein the second sealing portion is isolated from the third sealing portion by the shielding portion.