Gas delivery system for high pressure processing chamber
A high-pressure processing system for processing a layer on a substrate includes a first chamber, a support to hold the substrate in the first chamber, a second chamber adjacent the first chamber, a foreline to remove gas from the second chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, a gas delivery system configured to increase the pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, an exhaust system comprising an exhaust line to remove gas from the first chamber, and a common housing surrounding both the first gas delivery module and the second gas delivery module.
1. A high-pressure processing system for processing a layer on a substrate, the system comprising:
a first chamber;
a support configured to hold the substrate in the first chamber;
a second chamber adjacent the first chamber;
a foreline configured to remove gas from the second chamber;
a vacuum processing system configured to lower a pressure within the second chamber to near vacuum;
a valve assembly between the first chamber and the second chamber and configured to isolate the first chamber from the second chamber;
a gas delivery system configured to introduce one or more gases into the first chamber and to increase a pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, the gas delivery system including:
a first gas delivery module configured to deliver a first gas at a first pressure that is at least 10 atmospheres; and
a second gas delivery module configured to deliver the first gas or a second gas of different composition at a second pressure that is less than the first pressure but greater than 1 atmosphere;
a controller configured to operate the gas delivery system and the valve assembly;
a first exhaust system comprising an exhaust line and configured to remove gas from the first chamber;
a common housing surrounding both the first gas delivery module and the second gas delivery module; and
a second exhaust system configured to remove gas from the common housing.
2. The system of claim 1 , wherein the second exhaust system is configured to direct gas from the common housing to the foreline.
3. The system of claim 1 , further comprising first and second delivery lines coupling the first and second gas delivery modules to the first chamber, and a containment enclosure configured to divert gas leaking from the first and second delivery lines to the foreline.
4. The system of claim 3 , wherein the common housing is fluidically isolated from the containment enclosure.
5. A high-pressure processing system for processing a layer on a substrate, the system comprising:
a first chamber;
a support configured to hold the substrate in the first chamber;
a second chamber substantially surrounding the first chamber;
a foreline configured to remove gas from the second chamber;
a vacuum processing system configured to lower a pressure within the second chamber to near vacuum;
a valve assembly between the first chamber and the second chamber and configured to isolate the first chamber from the second chamber; and
a gas delivery system configured to introduce one or more gases into the first chamber and to increase a pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, the gas delivery system including:
a first gas delivery module configured to deliver a first gas at a first pressure that is at least 10 atmospheres; and
a second gas delivery module configured to deliver the first gas or a second gas of different composition at a second pressure that is less than the first pressure but greater than 1 atmosphere;
an exhaust system comprising an exhaust line and configured to remove gas from the first chamber; and
a controller configured to:
operate the valve assembly to isolate the first chamber from the second chamber;
operate the second gas delivery module to raise the first chamber from a pressure below 1 atmosphere to the second pressure;
operate the first gas delivery module to raise the first chamber from the second pressure to the first pressure when the second gas delivery module is isolated from the first chamber.
6. The system of claim 5 , wherein the first gas delivery module comprises a pump configured to increase pressure of the first gas before the first gas is delivered to the first chamber.
7. The system of claim 6 , wherein the second gas delivery module uses a mass flow controller, a liquid flow meter or a liquid flow controller to direct the gas to the first chamber.
8. The system of claim 5 , further comprising a first pressure sensor in the first chamber and a second pressure sensor in the second chamber.
9. The system of claim 8 , wherein the controller is further configured to:
cause the exhaust system to reduce pressure in the first chamber;
cause the vacuum processing system to reduce pressure in the second chamber;
compare measurements from the first pressure sensor and the second pressure sensor; and
control the exhaust system and the vacuum processing system such that a pressure in the first chamber is higher than a pressure in the second chamber.