Method for producing a power electronics system

1. A method for producing a power electronics system having a cooling device, a switching device, a terminal device, a capacitor device and a control device, comprising the following production steps:

a) providing a cooling device with a plurality of first positioning cutouts and a plurality of second positioning cutouts and said first positioning cutouts and the second positioning cutouts are on a first surface of the cooling device and said first surface is opposite a plurality of extending air-cooled heat sink members;

b) providing the switching device with a substrate and a first mounting device, which has a plurality of first positioning devices, and wherein in the production step b) of providing, the substrate is arranged in a first cutout in the first mounting device, and further comprises conducting a step of fixing the substrate in the first cutout wherein the step of fixing is performed by means of an adhesive electrically insulating material;

c) providing the terminal device with a second mounting device, which has a plurality of second positioning devices;

d) arranging the switching device on the cooling device, wherein the first positioning devices are arranged in respectively assigned first positioning cutouts;

e) arranging the terminal device on the cooling device, wherein the respective second positioning devices are arranged in the respectively assigned second positioning cutouts;

f) positioning the capacitor device on said substrate and said switching device wherein said capacitor device includes a plurality of capacitors and a contact bus bar has a plurality of contact elements extending through second cutouts of the first mounting device for electrically contacting the substrate; and

g) positioning a plurality of load connection elements, for conducting alternating voltage potential, attached to the second mounting device and each said load connection element having a contact area for making simultaneous electrical contact with a respective conductor track of the substrate; and

wherein the first mounting device of the switching device has a second cutout, which opens up a bounded sub-area opening of the substrate on a side remote from the cooling device.

2. The method, according to claim 1 , wherein:

the capacitor device has a contact element for making contact with the substrate of the switching device.

3. The method, according to claim 1 , wherein:

at least one further component is selected from the group consisting of: a control device, one or more internal electrical connecting elements, one or more internal load terminal elements, and a housing.

4. The method, according to claim 1 , wherein:

one of the switching device or the control device forms a structural unit with the capacitor device.

5. The method, according to claim 4 , wherein:

said one of the switching device or the control device forming said structural unit with the capacitor device are arranged relative to one another by means of a plurality of third positioning cutouts and a plurality of third positioning devices.

6. The method according to claim 1 , wherein:

the respective positioning devices of the respective first mounting device and the second mounting device is in the form of a pin or a screw.

7. The method, according to claim 1 , wherein:

the respective positioning cutout is in the form of a hole without an internal thread or in the form of a hole with an internal thread.

8. The method, according to claim 1 , wherein:

the terminal device has an external load terminal element.

9. The method, according to claim 8 , wherein:

the external load terminal element passes through the cooling device.

10. The method, according to claim 8 , wherein:

the external load terminal element protrudes from the terminal device parallel or perpendicular to the cooling device.