IP Library Granted Patent US 10,439,000
Granted Patent B2
US 10,439,000 · App. 16/184,465 · Granted Oct 8, 2019

Chalcogenide memory device components and composition

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Quick Facts
Patent No.
US 10,439,000
App. No.
16/184,465
Granted
Oct 8, 2019
Kind
B2
Abstract

Systems, devices, and methods related to or that employ chalcogenide memory components and compositions are described. A memory device, such as a selector device, may be made of a chalcogenide material composition. A chalcogenide material may have a composition that includes one or more elements from the boron group, such as boron, aluminum, gallium, indium, or thallium. A selector device, for instance, may have a composition of selenium, arsenic, and at least one of boron, aluminum, gallium, indium, or thallium. The selector device may also be composed of germanium or silicon, or both. The relative amount of boron, aluminum, gallium, indium, or thallium may affect a threshold voltage of a memory component, and the relative amount may be selected accordingly. A memory component may, for instance have a composition that includes selenium, arsenic, and some combination of germanium, silicon, and at least one of boron, aluminum, gallium, indium, or thallium.

Claims (32)

1. A composition of matter, comprising:

selenium in an amount greater than or equal to 40% by weight, relative to a total weight of the composition;

arsenic in an amount ranging from 10% to 35% by weight, relative to the total weight of the composition;

silicon in an amount ranging from 1% to 15% by weight, relative to the total weight of the composition; and

at least one element selected from a group consisting of boron, aluminum, gallium, indium, and thallium in an amount ranging from 0.15% to 35% by weight, relative to the total weight of the composition.

2. The composition of claim 1 , further comprising:

germanium in an amount ranging from 1% to 20% by weight, relative to the total weight of the composition.

3. The composition of claim 2 , further comprising:

silicon, wherein a combination of the silicon, the germanium, and the at least one element selected from the group consisting of boron, aluminum, gallium, indium, and thallium is an amount greater than or equal to 20% by weight, relative to the total weight of the composition.

4. The composition of claim 1 , wherein the selenium is in an amount greater than or equal to 45% by weight, relative to the total weight of the composition.

5. The composition of claim 1 , wherein the arsenic is in an amount ranging from 12% to 32% by weight, relative to the total weight of the composition.

6. The composition of claim 1 , wherein the at least one element selected from the group consisting of boron, aluminum, gallium, indium, and thallium is an amount ranging from 0.15% to 24% by weight, relative to the total weight of the composition.

7. The composition of claim 1 , wherein a threshold voltage drift of the composition is less than or equal to 250 millivolts after three days at a temperature of 90 degrees Celsius.

8. The composition of claim 1 , wherein a glass transition temperature of the composition is greater than 280 degrees Celsius.

9. A composition of matter, comprising:

selenium;

arsenic; and

a combination of silicon, germanium, and at least one element selected from a group consisting of boron, aluminum, gallium, indium, and thallium, wherein the combination is in an amount greater than or equal to 20% by weight, relative to a total weight of the composition.

10. The composition of claim 9 , wherein:

the selenium is in an amount greater than or equal to 40% by weight, relative to the total weight of the composition;

the arsenic is in an amount ranging from 10% to 35% by weight, relative to the total weight of the composition; and

the at least one element selected from the group consisting of boron, aluminum, gallium, indium, and thallium is in an amount ranging from 0.15% to 35% by weight, relative to the total weight of the composition.

11. The composition of claim 10 , wherein the germanium is in an amount ranging from 1% to 20% by weight, relative to the total weight of the composition.

12. The composition of claim 10 , wherein the silicon is in an amount ranging from 1% to 15% by weight, relative to the total weight of the composition.

13. The composition of claim 9 , wherein the selenium is in an amount greater than or equal to 45% by weight, relative to the total weight of the composition.

14. The composition of claim 9 , wherein the arsenic is in an amount ranging from 12% to 32% by weight, relative to the total weight of the composition.

15. The composition of claim 10 , wherein:

the selenium is in an amount greater than or equal to 40% by weight, relative to the total weight of the composition;

the arsenic is in an amount ranging from 10% to 35% by weight, relative to the total weight of the composition; and

the at least one element selected from the group consisting boron, aluminum, gallium, indium, or thallium is in an amount ranging from 1% to 12% by weight, relative to the total weight of the composition.

16. The composition of claim 15 , wherein the germanium is in an amount ranging from 8% to 20% by weight, relative to the total weight of the composition.

17. The composition of claim 15 , wherein the silicon is in an amount ranging from 1% to 10% by weight, relative to the total weight of the composition.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051026/0568 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050718/0764 →
SUPPLEMENT NO. 11 TO PATENT SECURITY AGREEMENT Recorded Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048082/0860 →
SUPPLEMENT NO. 2 TO PATENT SECURITY AGREEMENT Recorded Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048082/0889 →