IP Library › Granted Patent US 10,546,623
Granted Patent B2
US 10,546,623 · App. 16/195,199 · Granted Jan 28, 2020

Resistive memory device having memory cell array and system including the same

Inventors: Jaeho Lee (Seoul, KR); Jaeyoon Sim (Pohang-si, KR); Kyeongjun Lee (Pohang-si, KR)
Assignees: SAMSUNG ELECTRONICS CO., LTD.; POSTECH ACADEMY-INDUSTRY FOUNDATION
G11C11/1655G11C11/1657G11C11/1673G11C11/1675G11C11/54
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Quick Facts
Patent No.
US 10,546,623
App. No.
16/195,199
Granted
Jan 28, 2020
Kind
B2
Abstract

A resistive memory device includes a memory cell array in which a plurality of memory cells are arranged. Each of the plurality of memory cells includes a variable resistor comprising a first end connected to a bit line, and a second end, a row transistor connected between a row source line and the second end of the variable resistor, the row transistor being selectable by a row word line, and a column transistor connected between a column source line and the second end of the variable resistor, the column transistor being selectable by a column word line. Based on the row transistor being selected, first data is written or second data is read in a row direction of the memory cell array, and based on the column transistor being selected, the first data is written or the second data is read in a column direction of the memory cell array.

Claims (45)

1. A resistive memory device comprising:

a memory cell array in which a plurality of memory cells are arranged in a matrix,

wherein each of the plurality of memory cells comprises:

a variable resistor comprising a first end connected to a bit line, and a second end;

a row transistor connected between a row source line and the second end of the variable resistor, wherein the row transistor is selectable by a row word line; and

a column transistor connected between a column source line and the second end of the variable resistor, wherein the column transistor is selectable by a column word line,

wherein, based on the row transistor being selected, first data is written or second data is read in a row direction of the memory cell array, and

wherein, based on the column transistor being selected, the first data is written or the second data is read in a column direction of the memory cell array.

2. The resistive memory device of claim 1 , further comprising a row sense amplifier connected to the row source line,

wherein, based on the row transistor being selected by the row word line, a logic value that is stored in the variable resistor is identified using the row sense amplifier.

3. The resistive memory device of claim 1 , wherein the second data is read in the row direction of any one or any combination of first memory cells that are arranged along the row word line and connected to the row word line, among the plurality of memory cells.

4. The resistive memory device of claim 1 , further comprising a column sense amplifier connected to the column source line,

wherein, based on the column transistor being selected by the column word line, a logic value that is stored in the variable resistor is identified using the column sense amplifier.

5. The resistive memory device of claim 1 , wherein the second data is read in the column direction of any one or any combination of second memory cells that are arranged along the column word line and connected to the column word line, among the plurality of memory cells.

6. The resistive memory device of claim 1 , further comprising a write driver connected between the row source line and the bit line,

wherein, based on the row transistor being selected by the row word line, a logic value that is stored in the variable resistor is changed or maintained, based on a voltage applied to the row source line and the bit line by the write driver.

7. The resistive memory device of claim 1 , wherein, based on the column transistor being selected by the column word line, a logic value that is stored in the variable resistor is changed or maintained, based on a voltage applied to the column source line and the bit line.

8. The resistive memory device of claim 1 , wherein a first gate of the column transistor has a first width greater than a second width of a second gate of the row transistor, and

a negative voltage is applied to either one or both of the first end and the second end of the variable resistor.

9. The resistive memory device of claim 1 , wherein the resistive memory device is any one or any combination of ferroelectric random access memory (FRAM), magnetoresistive random access memory (MRAM), nano-floating gate memory (NFGM), phase-change random access memory (PRAM), resistive random access memory (RRAM), static random access memory (SRAM), and flash memory.

10. The resistive memory device of claim 1 , wherein the variable resistor stores at least one logic value, wherein each of the at least one logic value corresponds to a bit.

11. A system comprising:

a resistive memory device comprising a memory cell array in which a plurality of memory cells are arranged in a matrix;

a memory controller configured to control the resistive memory device;

an input/output device configured to receive first data to be written to the resistive memory device, and output second data that is read from the resistive memory device; and

a processor configured to control the memory controller and the input/output device,

wherein each of the plurality of memory cells comprises:

a variable resistor comprising a first end connected to a bit line, and a second end;

a row transistor connected between a row source line and the second end of the variable resistor, wherein the row transistor is selectable by a row word line; and

a column transistor connected between a column source line and the second end of the variable resistor, wherein the column transistor is selectable by a column word line,

wherein, based on the row transistor being selected, the first data is written or the second is read in a row direction of the memory cell array, and

wherein, based on the column transistor being selected, the first data is written or the second data is read in a column direction of the memory cell array.

12. The system of claim 11 , wherein the resistive memory device further comprises a row sense amplifier connected to the row source line,

wherein, based on the row transistor being selected by the row word line, a logic value that is stored in the variable resistor is identified using the row sense amplifier.

13. The system of claim 11 , wherein the second data is read in the row direction of any one or any combination of first memory cells that are arranged along the row word line and connected to the row word line, among the plurality of memory cells.

14. The system of claim 11 , wherein the resistive memory device further comprises a column sense amplifier connected to the column source line,

wherein, based on the column transistor being selected by the column word line, a logic value that is stored in the variable resistor is identified using the column sense amplifier.

15. The system of claim 11 , wherein the second data is read in the column direction of any one or any combination of second memory cells that are arranged along the column word line and connected to the column word line, among the plurality of memory cells.

16. The system of claim 11 , wherein the resistive memory device further comprises a write driver connected between the row source line and the bit line,

wherein, based on the row transistor being selected by the row word line a logic value that is stored in the variable resistor is changed or maintained, based on a voltage applied to the row source line and the bit line by the write driver.

17. The system of claim 11 , wherein, based on the column transistor being selected by the column word line, a logic value that is stored in the variable resistor is changed or maintained, based on a voltage applied to the column source line and the bit line.

18. The system of claim 11 , wherein a first gate of the column transistor has a first width greater than a second width of a second gate of the row transistor, and

a negative voltage is applied to either one or both of the first end and the second end of the variable resistor.

19. The system of claim 11 , wherein the resistive memory device is any one or any combination of ferroelectric random access memory (FRAM), magnetoresistive random access memory (MRAM), nano-floating gate memory (NFGM), phase-change random access memory (PRAM), resistive random access memory (RRAM), static random access memory (SRAM), and flash memory.

20. The system of claim 11 , wherein the variable resistor stores at least one logic value, wherein each of the at least one logic value corresponds to a bit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2018
From: LEE, JAEHO; SIM, JAEYOON; LEE, KYEONGJUN
To: SAMSUNG ELECTRONICS CO., LTD.; POSTECH ACADEMY-INDUSTRY FOUNDATION
Reel/Frame 047546/0689 →
Priority Claims (1)
KR 10-2018-0045743 · Apr 19, 2018 · national
Continuity (1)
Related Publication 20190325933A1 · Oct 24, 2019