Access devices to correlated electron switch
Subject matter disclosed herein may relate to programmable fabrics including correlated electron switch devices.
1. A method comprising:
forming one or more first layers comprising a metal oxide to provide a correlated electron switch (CES); and
forming one or more second layers between a third layer and the one or more first layers to provide a first access device to the CES, wherein the third layer comprises a metal layer to provide a first terminal of the CES,
wherein the one or more first layers and the one or more second layers are formed from a correlated electron material (CEM), and wherein at least one of the one or more first layers is p-type doped, and
wherein the CES comprises a bulk switch in which a majority of CEM forming the one or more first layers is switchable from an insulative/higher impedance state to a conductive/lower impedance state, or from a conductive/lower impedance state to an insulative/higher impedance state.
2. The method of claim 1 , and further comprising forming one or more fourth layers between a fifth layer and the one or more first layers to provide a second access device to the CES, wherein the fifth layer comprises a metal layer to provide a second terminal of the CES.
3. The method of claim 1 , wherein the one or more second layers comprise a metal oxide.
4. The method of claim 1 , wherein the one or more second layers comprise a polysilicon.
5. The method of claim 1 , wherein the third layer is formed over the one or more second layers.
6. The method of claim 1 , wherein at least one of the one or more second layers is n-type doped or p-type doped.
7. The method of claim 6 , wherein at least one of the one or more second metallic oxide layers comprises the CEM in an intrinsic state.
8. A device comprising:
one or more first layers to comprise a metallic oxide comprising a correlated electron switch (CES);
one or more terminals; and
one or more second layers disposed between a first terminal of the one or more terminals and the one or more first layers to provide a first access device to the CES, the first access device comprising a metal-insulator-metal (MIM) diode, a tunnel diode or a varistor, or a combination thereof.
9. The device of claim 8 , wherein the CES to be responsive to application of a first voltage across the one or more first metallic oxide layers while maintaining a first current through the one or more first layers to place the CES in a high impedance or insulative state;
wherein the CES to be responsive to application of a second voltage across the one or more first metal oxide layers while maintaining a second current through the one or more first layers to place the memory state of the CES element in a low impedance or conductive state; and
wherein the memory state of the CES element to be detectable based, at least in part, on a measured current through the access device responsive to application of a third voltage across the one or more first layers.
10. The device of claim 8 , wherein the device to comprise a correlated electron random access memory (CeRAM) element in a crosspoint memory array.
11. The device of claim 8 , wherein at least one of the one or more second layers to comprise zinc oxide doped with bismuth.
12. The device of claim 8 , wherein the one or more first layers and the one or more second layers to be formed from a correlated electron material (CEM), and wherein at least one of the one or more first layers to be p-type doped, wherein the CES to comprise a bulk switch in which a majority of material forming the CES is switchable from an insulative/higher impedance state to a conductive/lower impedance state, or from a conductive/lower impedance state to an insulative/higher impedance state.
13. The device of claim 12 , wherein at least one of the one or more second metallic oxide layers to comprise the CEM in an intrinsic state.
14. The device of claim 12 , wherein at least one of the one or more second metallic oxide layers to be n-type doped.
15. The device of claim 8 , and further comprising one or more third layers disposed between a second terminal of the one or more terminals and the one or more first layers to form provide a second access device to the CES.
16. The device of claim 15 , wherein at least one of the one or more first metallic oxide layers to be p-type doped, wherein at least one of the one or more second metallic oxide layers to be n-type doped and wherein at least one of the one or more third layers comprise the CEM in an intrinsic state.
17. The device of claim 15 , wherein the one or more first metal oxide layers to be separated from the one or more second metallic oxide layers by a first metallic layer, and wherein the one or more first layers to be separated from the one or more third layers by a second metallic layer.
18. The device of claim 15 , wherein at least one of the one or more first layers to comprise a correlated electron material (CEM) in an intrinsic state, and wherein at least one of the one or more second layers and at least one of the one or more third layers to be n-type doped.
19. The device of claim 15 , wherein at least one of the one or more first layers to be p-type doped, and wherein at least one of the one or more second layers and at least one of the one or more third layers to comprise a correlated electron material (CEM) in an intrinsic state.
20. The device of claim 15 , wherein at least one of the one or more first layers to be p-type doped, wherein at least one of the one or more second layers and at least one of the one or more third layers to be n-type doped.
21. A device comprising:
one or more first layers to comprise a metallic oxide comprising a correlated electron switch (CES);
one or more terminals;
one or more second layers disposed between a first terminal of the one or more terminals and the one or more first layers to provide a first access device to the CES; and
one or more third layers disposed between a second terminal of the one or more terminals and the one or more first layers to provide a second access device to the CES.
22. The device of claim 21 , wherein the one or more first layers to be p-type doped, wherein the one or more second layers to be n-type doped, and wherein the one or more third layers to comprise a correlated electron material in an intrinsic state.
23. The device of claim 21 , wherein the one or more first layers to be p-type doped, and wherein the one or more second layers and the one or more third layers to comprise a correlated electron material in an intrinsic state.
24. The device of claim 21 , wherein the one or more first layers to comprise a correlated electron material in an intrinsic state, and wherein the one or more second layers and the one or more third layers to be n-type doped.