IP Library Granted Patent US 10,801,128
Granted Patent B2
US 10,801,128 · App. 16/196,246 · Granted Oct 13, 2020

SiC epitaxial growth apparatus

Inventors: Yasunori Motoyama (Tokyo, JP); Yoshishige Okuno (Chiba, JP); Yoshikazu Umeta (Chichibu, JP); Keisuke Fukada (Chichibu, JP)
Assignee: SHOWA DENKO K.K.
C30B25/105C23C16/46C30B25/12C30B29/36
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Quick Facts
Patent No.
US 10,801,128
App. No.
16/196,246
Granted
Oct 13, 2020
Kind
B2
Abstract

A SiC epitaxial growth apparatus includes: a susceptor having a mounting surface on which a wafer is placable; a heater which is provided apart from the susceptor on a side opposite to the mounting surface of the susceptor; and an annular radiation member which is in contact with a back surface of the susceptor opposite to the mounting surface and is located at a position which is overlapped with an outer peripheral portion of the wafer placed on the susceptor in a plan view, in which the radiation member has a higher emissivity than that of the susceptor and has an exposed portion as viewed from the heater.

Claims (25)

1. A SiC epitaxial growth apparatus comprising:

a susceptor having a mounting surface on which a wafer is placable;

a heater which is provided apart from the susceptor on a side opposite to the mounting surface of the susceptor; and

an annular radiation member which is in contact with a back surface of the susceptor opposite to the mounting surface, and is located at a position which is overlapped with an outer peripheral portion of the wafer placed on the susceptor in a plan view,

wherein the radiation member has a higher emissivity than that of the susceptor and has an exposed portion when viewed from the heater.

2. The SiC epitaxial growth apparatus according to claim 1 ,

wherein the heater and the wafer placed on the susceptor are disposed concentrically with each other, and a radial distance between an outer peripheral end of the heater and an outer peripheral end of the wafer placed on the susceptor is 1/12 or less of a diameter of the wafer in the plan view.

3. The SiC epitaxial growth apparatus according to claim 1 ,

wherein the radiation member and the wafer placed on the susceptor are disposed concentrically with each other, and a radial distance between an outer peripheral end of the radiation member and an outer peripheral end of the wafer placed on the susceptor is ⅙ or less of a diameter of the wafer in the plan view.

4. The SiC epitaxial growth apparatus according to claim 1 ,

wherein the emissivity of the radiation member is 1.5 times or more the emissivity of the susceptor.

5. The SiC epitaxial growth apparatus according to claim 1 , further comprising:

a center supporting element which supports a center portion of the susceptor from the back surface.

6. The SiC epitaxial growth apparatus according to claim 5 ,

wherein a radial width of the radiation member is 1/10 or more and ⅓ or less of a radius of the wafer placed on the susceptor.

7. The SiC epitaxial growth apparatus according to claim 1 ,

wherein the radiation member is engaged with the susceptor.

8. The SiC epitaxial growth apparatus according to claim 1 , further comprising:

an outer periphery supporting element which supports an outer peripheral end portion of the susceptor from the back surface.

9. The SiC epitaxial growth apparatus according to claim 8 ,

wherein a radial width of the radiation member is 1/200 or more and ⅕ or less of a radius of the wafer placed on the susceptor.

10. The SiC epitaxial growth apparatus according to claim 8 ,

wherein the radiation member is sandwiched and held between the susceptor and the outer periphery supporting element such that a portion of the radiation member is exposed as viewed from the heater.

11. The SiC epitaxial growth apparatus according to claim 1 ,

wherein an unevenness is formed on a surface of the radiation member on the heater side.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2018
From: MOTOYAMA, YASUNORI; OKUNO, YOSHISHIGE; UMETA, YOSHIKAZU; FUKADA, KEISUKE
To: SHOWA DENKO K.K.
Reel/Frame 047556/0363 →