IP Library › Granted Patent US 11,597,042
Granted Patent B2
US 11,597,042 · App. 16/196,754 · Granted Mar 7, 2023

Printable surface treatment for aluminum bonding

Inventors: Michael Riley Vinson (Sunnyvale, CA); Calvin Chen (Daly City, CA); Divyakant P Kadiwala (Fremont, CA); Sunity K Sharma (Fremont, CA)
Assignee: Averatek Corporation
B23K35/362C09D11/03C09D11/033C09D11/06C09D11/38B05D7/14B05D2202/25B05D2401/20B23K2103/10
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Quick Facts
Patent No.
US 11,597,042
App. No.
16/196,754
Granted
Mar 7, 2023
Kind
B2
Abstract

Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.

Claims (17)

1. A method of bonding a copper metal to aluminum, comprising:

depositing a printable composition on the copper metal to form a coated copper surface, wherein the printable composition comprises (i) an aqueous solvent or a mixed aqueous solvent, ii) a fatty acid and (iii) an organic amine, and wherein the printable composition does not include a metal, wherein the copper metal is brought into near contact with an aluminum surface before the step of depositing the printable composition; and

coupling the coated copper surface directly to the aluminum surface, wherein at least one of the copper surface or the aluminum surface comprises part of an electronic component.

2. The method of claim 1 , wherein depositing is performed using a printing technique.

3. The method of claim 2 , wherein the printing technique is selected from the group consisting of screen printing, pad printing, inkjet printing, stencil printing, and gravure printing.

4. The method of claim 1 , further comprising a step of curing the coated non-aluminum surface at a reduced pressure.

5. The method of claim 1 , wherein coupling is performed by a technique selected from the group consisting of welding, ultrasonic welding, and soldering.

6. The method of claim 1 , wherein the printable composition has a viscosity between 1.1 cP and 10,000 cP.

7. The method of claim 6 , wherein the organic amine is selected from the group consisting of an ethanolamine and a dodecylamine.

8. The method of claim 1 , wherein the fatty acid is palmitic acid or a salt of palmitic acid.

9. The method of claim 1 , wherein the printable composition is in the form of a gel or cream.

10. The method of claim 1 , wherein the printable composition comprises an amine hydrofluoride in an aqueous solvent that does not include an organic solvent, and that is formulated as a gel.

11. The method of claim 1 , wherein the printable composition comprises a mixture of two or more components selected from the group consisting of fatty acids, salts of fatty acids, amine fluorides, amine acid fluorides, and amine tetrafluoroborates in an aqueous solution that does not include an organic solvent, and that is formulated as a gel.

12. The method of claim 1 , wherein the printable composition comprises a mixture of two or more components selected from the group consisting of fatty acids, salts of fatty acids, amine fluorides, amine acid fluorides, and amine tetrafluoroborates in an aqueous solution, wherein rheology is adjusted for a printing technique by the addition of an organic cosolvent.

13. The method of claim 12 , wherein the organic cosolvent is selected from the group consisting of a hydrocarbon, a halogenated hydrocarbon, and an alcohol.

14. The method of claim 12 , wherein the organic cosolvent is selected from the group consisting of saturated, partially unsaturated, or unsaturated hydrocarbons having between 6 and 20 carbons.

15. The method of claim 4 , wherein the reduced pressure is less than 100 kPa.

Assignments (3)
SECURITY INTEREST Recorded Jan 6, 2026
From: AVERATEK CORPORATION NKA LQDX, INC.
To: ARES FINANCIAL, LLC
Reel/Frame 073381/0760 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2024
From: AVERATEK CORPORATION
To: TAIYO AMERICA, INC.
Reel/Frame 066115/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2019
From: VINSON, MICHAEL RILEY; CHEN, CALVIN; KADIWALA, DIVYAKANT P; SHARMA, SUNITY K
To: AVERATEK CORPORATION
Reel/Frame 048323/0756 →
Continuity (3)
Continuation In Part PCTUS2018026300 · Apr 5, 2018
Provisional Application 62482092 · Apr 5, 2017
Related Publication 20190152002A1 · May 23, 2019