IP Library › Granted Patent US 10,782,474
Granted Patent B2
US 10,782,474 · App. 16/197,845 · Granted Sep 22, 2020

Detachable optical connectors for optical chips comprising a connector support and methods of fabricating the same

Inventors: Lars Martin Otfried Brusberg (Corning, NY); Douglas Llewellyn Butler (Painted Post, NY); Michael de Jong (Colleyville, TX); Alan Frank Evans (Beaver Dams, NY); Andreas Matiss (Berlin, DE); James Scott Sutherland (Corning, NY)
Assignee: Corning Research & Development Corporation
G02B6/122G02B6/136G02B6/30G02B6/3885G02B6/403G02B6/4292G02B6/3883G02B6/3893G02B6/421
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Quick Facts
Patent No.
US 10,782,474
App. No.
16/197,845
Granted
Sep 22, 2020
Kind
B2
Abstract

Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.

Claims (59)

1. An optical assembly comprising:

an optical chip comprising:

a surface;

an edge extending from the surface; and

at least one chip waveguide proximate the surface and terminating at the edge;

a waveguide support comprising a chip coupling surface;

at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip;

a connector support comprising:

a first portion coupled to the optical chip; and

a second portion coupled to the waveguide support; and

a ferrule comprising:

a first ferrule surface and a second ferrule surface; and

at least one bore extending from the first ferrule surface, wherein:

the waveguide support is coupled to the ferrule and extends from the second ferrule surface; and

the at least one waveguide is disposed within the at least one bore of the ferrule such that a first end of the at least one waveguide is exposed at the first ferrule surface of the ferrule and a second end of the at least one waveguide is exposed at the chip coupling surface of the waveguide support.

2. The optical assembly of claim 1 , wherein:

the first portion of the connector support is coupled to the surface of the optical chip;

the second portion of the connector support comprises a first tab and a second tab;

the first tab and the second tab define a notch;

the first tab and the second tab are coupled to the edge of the optical chip such that the at least one chip waveguide is exposed within the notch; and

the chip coupling surface of the waveguide support is disposed within the notch such that the second portion of the connector support is coupled to a surface of the waveguide support, a first edge of the waveguide support, and a second edge of the waveguide support.

3. The optical assembly of claim 2 , wherein the first portion is orthogonal to the second portion.

4. The optical assembly of claim 1 , wherein the first portion comprises at least one cutout region.

5. The optical assembly of claim 1 , wherein:

the edge of the optical chip comprises at least one chip bore; and

the second portion of the connector support comprises at least one connector bore aligned with the at least one chip bore.

6. The optical assembly of claim 1 , wherein:

the waveguide support comprises a first surface and a second surface that is opposite the first surface;

a portion of the first surface of the waveguide support is angled at an angle out of a parallel plane with respect to the second surface of the waveguide support;

the first portion of the connector support is coupled to the surface of the optical chip; and

the second portion of the connector support is coupled to the first surface of the connector support.

7. The optical assembly of claim 6 , wherein the second portion of the connector support is angled at the angle of the first surface of the connector support.

8. The optical assembly of claim 6 , wherein the waveguide support comprises a support portion and a cover portion coupled to the support portion.

9. The optical assembly of claim 8 , wherein:

the support portion comprises at least one groove disposed on a waveguide support surface opposite the first surface;

the at least one waveguide is disposed within the at least one groove; and

the cover portion is disposed on the waveguide support first surface of the waveguide support.

10. The optical assembly of claim 9 , wherein:

the second surface of the waveguide support is defined by the support portion; and

the first surface of the waveguide support is defined by the cover portion.

11. The optical assembly of claim 9 , wherein:

the first surface of the waveguide support is defined by the support portion; and

the second surface of the waveguide support is defined by the cover portion.

12. The optical assembly of claim 9 , wherein the connector support comprises a channel between the first portion and the second portion.

13. The optical assembly of claim 1 , wherein the connector support is coupled to the optical chip and the waveguide support by an adhesive.

14. The optical assembly of claim 1 , wherein the edge of the optical chip is coupled to the chip coupling surface of the waveguide support by an adhesive.

15. The optical assembly of claim 1 , wherein the connector support has a coefficient of thermal expansion with is within five percent of a coefficient of thermal expansion of a substrate material of the optical chip.

16. The optical assembly of claim 1 , wherein the waveguide support comprises a glass material.

17. The optical assembly of claim 1 , wherein:

the ferrule comprises a thermoset material or a thermoplastic material; and

the waveguide support comprises a glass material.

18. The optical assembly of claim 1 , wherein:

the ferrule comprises an opening at the second ferrule surface;

a portion of the waveguide support is disposed within the opening of the ferrule; and

the waveguide support comprises:

a support portion; and

a cover portion coupled to the support portion, wherein at least one of the support portion and the cover portion comprises at least one groove, and the at least one waveguide is disposed within the at least one groove.

19. The optical assembly of claim 18 , wherein a length of the cover portion of the waveguide support is greater than a length of the support portion of the waveguide support.

20. The optical assembly of claim 18 , wherein the at least one waveguide comprises an optical fiber, and at least a portion of the optical fiber disposed within the at least one groove.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2019
From: BRUSBERG, LARS MARTIN OTFRIED; BUTLER, DOUGLAS LLEWELLYN; DE JONG, MICHAEL; EVANS, ALAN FRANK; MATISS, ANDREAS; SUTHERLAND, JAMES SCOTT
To: CORNING RESEARCH & DEVELOPMENT CORPORATION
Reel/Frame 048869/0019 →
Continuity (3)
Continuation In Part PCTUS2018022091 · Mar 13, 2018
Provisional Application 62472025 · Mar 16, 2017
Related Publication 20190094460A1 · Mar 28, 2019
Cited By (6)
US 1,094,314 US 12,306,448 US 12,321,017 US 12,379,549 US 12,669,656 US 12,717,094