IP Library Granted Patent US 10,586,905
Granted Patent B2
US 10,586,905 · App. 16/198,154 · Granted Mar 10, 2020

Resin package and light-emitting device

Inventors: Yuta Horikawa (Anan, JP); Takuya Miki (Tokushima, JP); Shoichi Ishikawa (Tokushima, JP); Ryosuke Wakaki (Tokushima, JP)
Assignee: NICHIA CORPORATION
H01L33/62H01L25/0753H01L33/486H01L23/49541H01L23/49548H01L23/49838
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,586,905
App. No.
16/198,154
Granted
Mar 10, 2020
Kind
B2
Abstract

A resin package includes: a resin portion, a first lead having an upper surface and an end surface, a second lead having an upper surface and disposed opposite the first lead, and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. In a top view, the upper surface of the first lead includes a first groove overlapping a first side of the bottom surface, a second groove overlapping a second side of the bottom surface, a third groove overlapping a third side of the bottom surface, and one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead.

Claims (37)

1. A resin package comprising:

a resin portion;

a first lead having an upper surface and an end surface;

a second lead having an upper surface and disposed opposite the first lead; and

a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion;

wherein, in a top view, the bottom surface of the recess includes:

a first side extending along the first lead and the second lead,

a second side located opposite to the first side and extending along the first lead and the second lead,

a third side that connects the first side and the second side, and

a fourth side located opposite to the third side;

wherein, in a top view, the upper surface of the first lead includes:

a first groove overlapping the first side,

a second groove overlapping the second side,

a third groove overlapping the third side, and

one or more fourth grooves extending from a portion of the third groove to an end surface of the first lead facing the second lead;

wherein the first groove, the second groove, the third groove, and the fourth groove are continuous; and

wherein a part of the resin portion is disposed on the first groove, the second groove, the third groove, and the fourth groove.

2. The resin package according to claim 1 ,

wherein a trough hole is formed in the end surface of the first lead; and

wherein the one or more fourth grooves are continuous with the through hole.

3. The resin package according to claim 1 ,

wherein the first lead has a first wire-connecting region between the first groove and the end surface of the first lead; and

wherein, in a top view, a width of the first groove is greater than a width of the second groove in a direction along the end surface of the first lead.

4. The resin package according to any one of claim 1 , wherein the one or more fourth grooves comprise a plurality of fourth grooves.

5. The resin package according to any one of claim 1 ,

wherein the first lead further includes, in a top view:

a first outer groove located outside the first groove,

a second outer groove located outside the second groove, and

a third outer groove located outside the third groove, and

wherein the first outer groove, the second outer groove, and the third outer groove are located between outer lateral surfaces of the resin package and the lateral surfaces of the recess.

6. The resin package according to any one of claim 1 ,

wherein the first groove includes, in a top view, a depressed portion on a peripheral surface of the first groove, the recess being recessed from the peripheral surface toward the third groove.

7. A light-emitting device comprising:

the resin package according to claim 1 ; and

a first light-emitting element and a second light-emitting element that are disposed in the recess;

wherein the first light-emitting element is mounted on a first element-mounting region defined by the first groove, the third groove, and the one or more fourth grooves on the upper surface of the first lead; and

wherein the second light-emitting element is mounted on a second element-mounting region defined by the second groove, the third groove, and the one or more fourth grooves on the upper surface of the first lead.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2018
From: HORIKAWA, YUTA; MIKI, TAKUYA; ISHIKAWA, SHOICHI; WAKAKI, RYOSUKE
To: NICHIA CORPORATION
Reel/Frame 047564/0417 →
Priority Claims (1)
JP 2017-228484 · Nov 29, 2017 · national
Continuity (1)
Related Publication 20190165233A1 · May 30, 2019