IP Library Granted Patent US 10,325,884
Granted Patent B2
US 10,325,884 · App. 16/199,460 · Granted Jun 18, 2019

Apparatuses and methods for scalable memory

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Quick Facts
Patent No.
US 10,325,884
App. No.
16/199,460
Granted
Jun 18, 2019
Kind
B2
Abstract

Apparatuses and methods are provided for scalable memory. An example apparatus comprises a logic component, a plurality of memory components adjacent to and coupled to one another and the logic component, a plurality of memory component programmable delay lines (PDLs), of the plurality of memory component PDLs associated with a respective one of the plurality of memory components, and a logic component programmable delay line (LPDL) coupled to the logic component and each of the plurality of memory component PDLs.

Claims (57)

1. A method, comprising:

receiving a shared strobe signal and a plurality of strobe select signals to a memory component associated with a memory component stack;

determining a particular memory component among the stack of memory components to be activated based, at least in part, on the shared strobe signal and the plurality of strobe select signals; and

activating the particular memory component among the stack of memory components in response to the determination that the particular memory component is to be activated.

2. The method of claim 1 , further comprising:

activating, for at least one memory component associated with the memory component stack, a memory component programmable delay line (PDL) that is coupled to the at least one memory component, such that a delay signal associated with the memory component PDL has a delay value;

activating a strobe signal line associated with the shared strobe signal such that the shared strobe signal has a first frequency value; and

adjusting the delay signal associated with the memory component PDL for each memory component of the memory component stack.

3. The method of claim 2 , wherein adjusting the delay signal comprises increasing the delay value for each successive memory component of the memory component stack.

4. The method of claim 1 , further comprising:

activating at least one of the strobe select signals at a first time value; and

activating the shared strobe signal at a second time value, wherein

the first time value is associated with an earlier point in time than the second time value.

5. The method of claim 1 , further comprising:

activating the shared strobe signal and the plurality of strobe select signals concurrently; and

providing a matched delay signal path such that the shared strobe signal and the plurality of strobe select signals are received by respective memory components of the memory component stack concurrently.

6. The method of claim 1 , further comprising receiving the shared strobe signal and the plurality of strobe select signals according to a clock signal.

7. The method of claim 6 , further comprising:

providing the clock signal while the shared strobe signal and the plurality of strobe select signals are activated; and

stopping the clock signal in response to a determination that the shared strobe signal and the plurality of strobe select signals are not activated.

8. The method of claim 1 , further comprising controlling, by a voltage regulation component, actuation of the shared strobe signal and the plurality of strobe select signals.

9. An apparatus, comprising:

a stacked memory system, wherein the stacked memory system is configured to:

receive, by a memory component associated with the stacked memory system, a shared strobe signal and a plurality of strobe select signals;

determine a particular memory component associated with the stacked memory system to be activated based, at least in part, on the shared strobe signal and the plurality of strobe select signals; and

activate the particular memory in response to the determination that the particular memory component is to be activated.

10. The apparatus of claim 9 , wherein the stacked memory system is further configured to:

activate, for at least one memory component associated with the stacked memory system, a memory component programmable delay line (PDL) that is coupled to the at least one memory component, such that a delay signal associated with the memory component PDL has a delay value;

activate a strobe signal line associated with the shared strobe signal such that the shared strobe signal has a first frequency value; and

adjust the delay signal associated with the memory component PDL for each memory component of the stacked memory system.

11. The apparatus of claim 9 , wherein the stacked memory system is further configured to:

activate at least one of the strobe select signals at a first time value; and

activate the shared strobe signal at a second time value.

12. The apparatus of claim 9 , wherein the stacked memory system is further configured to:

activate the shared strobe signal and the plurality of strobe select signals concurrently; and

provide a matched delay signal path such that the shared strobe signal and the plurality of strobe select signals are received by respective memory components of the stacked memory system concurrently.

13. The apparatus of claim 9 , wherein the stacked memory system is further configured to:

receive, by the memory component associated with the stacked memory system, the shared strobe signal and the plurality of strobe select signals according to a clock signal;

provide the clock signal while the shared strobe signal and the plurality of strobe select signals are activated; and

stop the clock signal in response to a determination that the shared strobe signal and the plurality of strobe select signals are not activated.

14. A system, comprising:

a logic component coupled to a memory component stack, wherein the logic component is configured to:

generate a shared strobe signal and a plurality of strobe select signals;

transfer the shared strobe signal and the plurality of strobe select signals to the memory component stack; and

a memory component stack coupled to the logic component and comprising a plurality of memory components, wherein the memory component stack is configured to:

determine a particular memory component among the stack of memory components to be activated based, at least in part, on the shared strobe signal and the plurality of strobe select signals; and

activate the particular memory component among the stack of memory components in response to the determination that the particular memory component is to be activated.

15. The system of claim 14 , wherein the logic component is further configured to:

activate a memory component programmable delay line (PDL) coupled to at least one memory component in the memory component stack such that a delay signal associated with the memory component PDL has a delay value; and

adjust the delay signal associated with the memory component PDL for memory components in the memory component stack.

16. The system of claim 15 , wherein the logic component is further configured to adjust a value associated with the delay signal by increasing the value associated with the delay signal for each successive memory component in the memory component stack.

17. The system of claim 14 , wherein the logic component is further configured to transfer the shared strobe signal and the plurality of strobe select signals to the memory component stack concurrently.

18. The system of claim 14 , wherein the memory component stack further comprises a voltage regulation component, and wherein the voltage regulation component is configured to control actuation of the shared strobe signal and the plurality of strobe select signals for the memory component.

19. The system of claim 14 , wherein the logic component is configured to:

generate at least one of the strobe select signals at a first time; and

generate the shared strobe signal at a second time.

20. The system of claim 14 , wherein the logic component is further configured to provide a matched delay signal path such that the shared strobe signal and the plurality of strobe select signals are received by respective memory components of the memory component stack concurrently.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051026/0568 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050718/0764 →
SUPPLEMENT NO. 11 TO PATENT SECURITY AGREEMENT Recorded Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048082/0860 →
SUPPLEMENT NO. 2 TO PATENT SECURITY AGREEMENT Recorded Jan 16, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048082/0889 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2018
From: LIN, FENG; WAN, YUANZHONG
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047579/0235 →