Isolated data transfer system
Methods and apparatus for providing data transfer with a drive coil to transmit information, a receive coil magnetically coupled to the drive coil, and a first magnetoresistive sensor proximate the receive coil to detect information from the receive coil. In embodiments, the drive and receive coils are separated by an isolation material. In embodiments, a signal isolator IC packages includes transmit and receive coils and a magnetic field sensing element coupled to the receive coil.
1. A system, comprising:
a drive coil to transmit information;
a receive coil magnetically coupled to the drive coil for receiving the information from the drive coil; and
a first magnetic field sensing element proximate the receive coil to detect the information from the receive coil, wherein the receive coil includes a first narrowed portion for concentrating magnetic field generated by the current through the receive coil on the first magnetic field sensing element.
2. The system according to claim 1 , further including a second magnetic field sensing element, wherein the receive coil includes a second narrowed portion, wherein the second magnetic field sensing element is proximate the second narrowed portion.
3. The system according to claim 2 , wherein the first and second narrowed regions are located for coupling to the first and second magnetic field sensing elements differentially, which has a bridge configuration.
4. The system according to claim 1 , wherein the first narrowed portion is located outside of an area of the drive coil.
5. The system according to claim 1 , further including a die to support the first magnetic field sensing element.
6. The system according to claim 5 , wherein the die supports the drive and receive coils.
7. The system according to claim 5 , wherein the die incudes circuitry to process information from the first magnetic field sensing element.
8. The system according to claim 1 , wherein the receive coil has one turn.
9. The system according to claim 1 , wherein the receive coil has less than five turns.
10. The system according to claim 1 , wherein the drive coil includes first and second coils coupled in series.
11. The system according to claim 1 , wherein the receive coil is connected to ground.
12. The system according to claim 1 , wherein the first magnetic field sensing element comprises a GMR element.
13. The system according to claim 1 , wherein the first magnetic field sensing element comprises a TMR element.
14. The system according to claim 1 , wherein the drive coil is isolated from the receive coil and the magnetic field sensing element.
15. The system according to claim 14 , wherein the isolation comprises electrical and/or galvanic isolation.
16. A signal isolator IC package, comprising:
a drive coil to transmit information;
a receive coil magnetically coupled to the drive coil for receiving the information from the drive coil; and
a first magnetic field sensing element proximate the receive coil to detect the information from the receive coil,
wherein the receive coil includes a first narrowed portion for concentrating magnetic field generated by the current through the receive coil on the first magnetic field sensing element.
17. The IC package according to claim 16 , further including isolation between the drive coil and receive coil.
18. The IC package according to claim 16 , further including a second magnetic field sensing element, wherein the receive coil includes a second narrowed portion, wherein the second magnetic field sensing element is proximate the second narrowed portion.
19. The IC package according to claim 18 , wherein the first and second narrowed portions are located for coupling to the first magnetic field sensing element, which has a bridge configuration.
20. The IC package according to claim 16 , wherein the first narrowed portion is located outside of an area of the drive coil.
21. The IC package according to claim 16 , further including a die to support the first magnetic field sensing element.
22. The IC package according to claim 16 , further including a transistor bridge coupled to the drive coil.
23. The IC package according to claim 16 , further including first and second die separated by a barrier region.
24. The IC package according to claim 23 , wherein the transistor bridge is disposed on the first die and the drive and receive coils are disposed on the second die.
25. The IC package according to claim 24 , wherein the first magnetic field sensing element sensor is disposed on the second die.
26. The IC package according to claim 22 , wherein the transistor bridge is coupled to a first input pin and the first magnetic field sensing element is coupled to a first output pin.
27. A method, comprising:
employing a drive coil to transmit information;
employing a receive coil magnetically coupled to the drive coil for receiving the information from the drive coil; and
employing a first magnetic field sensing element proximate the receive coil to detect the information from the receive coil,
wherein the receive coil includes a first narrowed portion for concentrating magnetic field generated by the current through the receive coil on the first magnetic field sensing element.
28. The method according to claim 27 , further including employing a second magnetic field sensing element, wherein the receive coil includes a second narrowed portion, wherein the second magnetic field sensing element is proximate the second narrowed portion.
29. The method according to claim 28 , wherein the first and second narrowed portions are located for coupling to the first and second magnetic field sensing elements differentially, which has a bridge configuration.