Methods of processing semiconductor devices
View Patent ↗Methods of processing a semiconductor device include providing a patterned mask over a major surface of a substrate and comprising at least one opening exposing a conductive structure, and depositing particles of material by direct material deposition adjacent and in contact with an edge wall of the mask adjacent the at least one opening to form a supplemental mask over the major surface of the substrate. Other methods of processing semiconductor devices include depositing particles of material by direct material deposition adjacent a conductive structure at an intersection of the conductive structure and a surface of a substrate.
1. A method, comprising:
on an exposed surface of a semiconductor structure, the exposed surface exhibiting a topography, applying another material to the exposed surface using direct material deposition to reduce an irregularity of the topography of the exposed surface, the direct material deposition comprising expelling droplets or other particles of the another material from at least one nozzle, the another material to be expelled having a viscosity in a range from about 0.1 cP to about 1000 cP.
2. The method of claim 1 , wherein the topography comprises an opening at least partially through a material of the semiconductor structure, and wherein applying the another material comprises applying the another material within the opening.
3. The method of claim 2 , wherein applying the another material comprises substantially filling the opening with the another material.
4. The method of claim 3 , wherein applying the another material comprises forming a surface of the another material to be approximately coplanar with a major surface of the material.
5. The method of claim 2 , further comprising covering the material with the another material.
6. The method of claim 1 , wherein applying the another material comprises forming structures on the semiconductor structure to form or alter a flow path of a flowable material to be directed across the semiconductor structure.
7. The method of claim 6 , further comprising directing the flowable material across the semiconductor structure in the flow path.
8. The method of claim 7 , wherein directing the flowable material across the semiconductor structure in the flow path comprises directing an encapsulant material across the semiconductor structure.
9. The method of claim 1 , further comprising removing at least a portion of the semiconductor structure while leaving the another material on the semiconductor structure.
10. The method of claim 1 , wherein applying another material to the exposed surface using direct material deposition comprises covering a bondline of the semiconductor structure.
11. The method of claim 1 , wherein applying another material to the exposed surface using direct material deposition comprises forming a mask over a surface of the semiconductor structure.
12. The method of claim 1 , wherein applying another material to the exposed surface using direct material deposition comprises depositing the expelled droplets or other particles of the another material in an additive manufacturing process.
13. A method, comprising:
applying a material to an exposed surface of a semiconductor structure using direct material deposition, the direct material deposition comprising expelling the material from at least one nozzle, the material to be expelled having a viscosity in a range from about 0.1 cP to about 1000 cP, the semiconductor structure comprising another material over a substrate; and
removing at least a portion of the another material from the substrate.
14. The method of claim 13 , wherein removing at least a portion of the another material from the substrate comprises forming a flow path on the substrate.
15. The method of claim 14 , further comprising directing an encapsulant material across the substrate in the flow path.
16. The method of claim 13 , wherein applying a material to an exposed surface of a semiconductor structure using direct material deposition comprises covering the another material with the material.
17. The method of claim 13 , wherein applying a material to an exposed surface of a semiconductor structure using direct material deposition comprises applying the material to an exposed surface of the substrate.
18. The method of claim 13 , wherein applying a material to an exposed surface of a semiconductor structure using direct material deposition comprises changing a topography of the semiconductor structure.
19. The method of claim 13 , wherein removing at least a portion of the another material from the substrate comprises removing substantially all the another material from the substrate.
20. The method of claim 13 , wherein applying a material to an exposed surface of a semiconductor structure using direct material deposition comprises applying the another material on a surface of the substrate within an opening in the another material.
21. The method of claim 20 , wherein applying a material to an exposed surface of a semiconductor structure using direct material deposition comprises substantially filling the opening with the material.