Electronic package and method for manufacturing the same
This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.
1. An electronic package, comprising:
a first substrate including an antenna structure and at least one limiter provided at an edge of the first substrate, wherein the first substrate is defined with a first surface, a second surface opposite to the first surface, and side faces adjoining the first surface and the second surface, with at least one notch interconnecting the first surface with the second surface to be formed on the side faces of the first substrate, and a wall of the notch being stepped to serve as the limiter;
a second substrate including one or more circuit layers, the first substrate being stacked on top of the second substrate via a plurality of conductive components; and
at least a support body formed between the first substrate and the second substrate and extending to be in contact with the limiter to hold the first substrate and the second substrate in place, wherein the support body is free from being electrically connected with the first substrate and the second substrate.
2. The electronic package of claim 1 , wherein the support body is engaged in the notch.
3. The electronic package of claim 1 , wherein the first substrate has an insulating protective layer that serves as the first surface of the first substrate.
4. The electronic package of claim 1 , wherein the first substrate has a bump provided on the first surface of the first substrate and along an edge of the notch.
5. The electronic package of claim 1 , wherein the support body protrudes from a side face of the first substrate.
6. The electronic package of claim 1 , wherein the support body is formed by a thermosetting adhesive.
7. The electronic package of claim 1 , further comprising an electronic component provided on the second substrate.
8. The electronic package of claim 7 , wherein the second substrate includes a first side and a second side opposite to the first side, with the first substrate stacked on the first side of the second substrate and the electronic component provided on the second side of the second substrate.
9. The electronic package of claim 1 , wherein the second substrate further includes an antenna portion in communication with the antenna structure through electromagnetic induction.
10. The electronic package of claim 1 , wherein the first substrate is narrower than the second substrate.
11. A method for manufacturing an electronic package, comprising:
providing a first substrate including an antenna structure and at least one limiter provided at an edge of the first substrate, wherein the first substrate is defined with a first surface, a second surface opposite to the first surface, and side faces adjoining the first surface and the second surface, with at least one notch interconnecting the first surface with the second surface to be formed on the side faces of the first substrate, and a wall of the notch being stepped to serve as the limiter;
stacking the first substrate on top of a second substrate having circuit layers via a plurality of conductive components; and
forming between the first substrate and the second substrate at least a support body extending to be in contact with the limiter to hold the first substrate and the second substrate in place, wherein the support body is free from being electrically connected with the first substrate and the second substrate.
12. The method of claim 11 , wherein the support body is engaged in the notch.
13. The method of claim 11 , wherein the first substrate has an insulating protective layer that serves as the first surface of the first substrate.
14. The method of claim 11 , wherein the first substrate has a bump provided on the first surface of the first substrate and along an edge of the notch.
15. The method of claim 11 , wherein the support body protrudes from a side face of the first substrate, and the support body is formed by a thermosetting adhesive.
16. The method of claim 11 , wherein forming the support body includes:
dispensing the thermosetting adhesive between the first substrate and the second substrate for the thermosetting adhesive to be in contact with the first substrate and the second substrate; and
curing the thermosetting adhesive to form the support body.
17. The method of claim 11 , further comprising providing an electronic component on the second substrate.
18. The method of claim 17 , wherein the second substrate includes a first side and a second side opposite to the first side, with the first substrate stacked on the first side of the second substrate and the electronic component provided on the second side of the second substrate.
19. The method of claim 11 , wherein the second substrate further includes an antenna portion in communication with the antenna structure through electromagnetic induction.
20. The method of claim 11 , wherein the first substrate is narrower than the second substrate.