Some embodiments disclose a gate stack having a gate (e.g., polysilicon (poly) material) horizontally between shallow trench isolations (STIs), a tungsten silicide (WSix) material over the gate and the STIs, and a tungsten silicon nitride (WSiN) material on a top surface of the WSix material. Some embodiments disclose a gate stack having a gate between STIs, a first WSix material over the gate and the STIs, a WSiN interlayer material on a top surface of the first WSix material, and a second WSix material on a top surface of the WSiN interlayer material. Additional embodiments are disclosed.
1. A memory device comprising:
a memory array; and
a peripheral transistor coupled to the memory array, the peripheral transistor comprising:
a gate between shallow trench isolations (STIs) and directly contacting the STIs, a height of the gate being different from a height of the STIs;
a tungsten silicide (WSix) material on a top surface of the gate and top surfaces of the STIs; and
a tungsten silicon nitride (WSiN) material on a top surface of the WSix material.
2. The memory device of claim 1 , wherein the memory device comprises a three dimensional (3D) NAND flash memory device, a planar non-volatile memory device, or a volatile memory device.
3. The memory device of claim 1 , wherein the peripheral transistor further comprises a dielectric material over the WSiN material, and wherein the dielectric material comprises tetraethyl orthosilicate (TEOS).
4. The memory device of claim 1 , wherein the peripheral transistor further comprises a channel under the gate, and wherein the channel comprises silicon.
5. The memory device of claim 4 , wherein the peripheral transistor further comprises a gate oxide between the gate and the channel.
6. The memory device of claim 1 , wherein the STIs comprise silicon oxide, and wherein the gate comprises a polysilicon (poly) material.
7. A memory device comprising:
a memory array; and
a peripheral transistor coupled to the memory array, the peripheral transistor comprising:
a gate between shallow trench isolations (STIs) and directly contacting the STIs, a height of the gate being different from a height of the STIs;
a first tungsten silicide (WSix) material on a top surface of the gate and top surfaces of the STIs;
a tungsten silicon nitride (WSiN) interlayer material on a top surface of the first WSix material; and
a second WSix material on a top surface of the WSiN interlayer material.
8. The memory device of claim 7 , wherein the memory device comprises a three dimensional (3D) NAND flash memory device, a planar nonvolatile memory device, or a volatile memory device.
9. The memory device of claim 7 , wherein the peripheral transistor further comprises a tetraethyl orthosilicate (TEOS) material over the second WSix material.
10. The memory device of claim 7 , wherein the peripheral transistor further comprises:
a channel under the gate; and
a gate oxide between the gate and the channel.
11. A three dimensional (3D) NAND memory device comprising:
a NAND memory array; and
a peripheral transistor coupled to the NAND memory array, the peripheral transistor comprising:
a gate between first and second dielectric materials and directly contacting the first and second dielectric materials, the gate including a height different from a height of each of the first and second dielectric materials;
a silicide material on a top surface of the gate and on top surfaces of the first and second dielectric materials; and
a combination of metal and silicon nitride material on a top surface of the silicide material.
12. The 3D NAND memory device of claim 11 , further comprising a second silicide material on a top surface of the combination of the metal and silicon nitride material.
13. The 3D NAND memory device of claim 11 , wherein the silicide material comprises tungsten silicide (WSix).
14. The 3D NAND memory device of claim 13 , wherein the combination of metal and silicon nitride comprises tungsten silicon nitride (WSiN).
15. The 3D NAND memory device of claim 14 , wherein the second silicide material comprises tungsten silicide (WSix).
16. The 3D NAND memory device of claim 14 , further comprising an oxide extending over the WSiN material.
17. The 3D NAND memory device of claim 11 , wherein the first and second dielectric materials comprise silicon oxide.
18. The 3D NAND memory device of claim 11 , wherein the peripheral transistor further comprises a gate oxide under the gate and between the first and second dielectric materials and directly contacting the first and second dielectric materials.
19. The 3D NAND memory device of claim 11 , wherein the peripheral transistor further comprises a channel under the gate oxide and between the first and second dielectric materials, the channel directly contacting the first and second dielectric materials.