IP Library › Granted Patent US 11,482,826
Granted Patent B2
US 11,482,826 · App. 16/202,192 · Granted Oct 25, 2022

Optical processing apparatus, optical processing method, and optically-processed product production method

Inventor: Asato Tamura (Kanagawa, JP)
Assignee: RICOH COMPANY, LTD.
H01S3/0085G02B27/09H01S3/0071H01S3/08086H01S3/134
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Quick Facts
Patent No.
US 11,482,826
App. No.
16/202,192
Granted
Oct 25, 2022
Kind
B2
Abstract

An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

Claims (49)

1. An optical processing apparatus, comprising:

a first light-emitter to emit a first process light to a focal point set inside an object to be processed; and

a second light-emitter to emit a second process light with a light-absorbing wavelength for plasma or gas generated inside the object to be processed, by the first process light,

wherein the second process light has a shape of beam different from a shape of beam of the first process light inside the object to be processed.

2. The optical processing apparatus according to claim 1 ,

wherein the second light-emitter starts irradiating the gas or the plasma with the second process light after the first process light has started irradiation and before or during a period of time in which the plasma or the gas exists inside the object to be processed due to the first process light.

3. The optical processing apparatus according to claim 2 ,

wherein the second light-emitter starts emitting the second process light within a range of 20 picoseconds later to 2000 picoseconds later after the first process light is emitted.

4. The optical processing apparatus according to claim 1 ,

wherein the second light-emitter stops emitting the second process light after or during a period of time in which the plasma or the gas exists inside the object to be processed due to the first process light.

5. The optical processing apparatus according to claim 1 ,

wherein the second light-emitter emits the second process light during a period of time in which the object to be processed is not irradiated with the first process light.

6. The optical processing apparatus according to claim 1 ,

wherein the second process light has a wavelength longer than a wavelength of the first process light.

7. The optical processing apparatus according to claim 1 ,

wherein the second process light has a wavelength λ, in which absorption coefficient α IB that satisfies an equation

α IB =1.37×10 −35 λ 3 n e 2 T e −1/2

is equal to or greater than 20 cm −1 , where n e denotes electron density and T e denotes electron temperature.

8. The optical processing apparatus according to claim 1 ,

wherein the second process light has a wavelength equal to or longer than 700 nanometers.

9. The optical processing apparatus according to claim 1 , further comprising

a laser beam source to emit a pulsed laser beam having a prescribed pulse width,

wherein the first light-emitter irradiates the object to be processed with some of the pulsed laser beam output from the laser beam source as the first process light, and

wherein the second light-emitter irradiates the object to be processed with remaining ones of the pulsed laser beam output from the laser beam source as the second process light, in a delayed manner.

10. The optical processing apparatus according to claim 9 ,

wherein the first light-emitter and the second light-emitter irradiate the object to be processed with each of the first process light and the second process light, using a same light-concentrating unit in common.

11. The optical processing apparatus according to claim 1 ,

wherein the second light-emitter emits the second process light to a focal point set inside the object to be processed.

12. The optical processing apparatus according to claim 1 ,

wherein the second process light has a depth of focus equal to or smaller than 200 micrometers.

13. The optical processing apparatus according to claim 1 ,

wherein at least one of the first process light and the second process light is a pulsed laser beam having a pulse width equal to or smaller than 20 picoseconds.

14. The optical processing apparatus according to claim 1 ,

wherein the second process light has a circular shape of beam inside the object to be processed.

15. The optical processing apparatus according to claim 1 , further comprising a beam-shape changer to change a shape of beam of the second process light.

16. The optical processing apparatus according to claim 15 ,

wherein the beam-shape changer chronologically changes the shape of beam of the second process light with a prescribed frequency.

17. A method of processing light, the method comprising:

emitting a first process light to a focal point set inside an object to be processed, using a first light-emitter; and

emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitter,

wherein the second process light has a shape of beam different from a shape of beam of the first process light inside the object to be processed.

18. A method of producing an optically-processed product, the method comprising:

emitting a first process light to a focal point set inside an object to be processed, using a first light-emitter; and

emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitter,

wherein the second process light has a shape of beam different from a shape of beam of the first process light inside the object to be processed.

19. An optical processing apparatus, comprising:

a first light-emitter to emit a first process light to a focal point set inside an object to be processed; and

a second light-emitter to emit a second process light with a light-absorbing wavelength for plasma or gas generated inside the object to be processed, by the first process light, and

a beam-shape changer to change a shape of beam of the second process light.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2018
From: TAMURA, ASATO
To: RICOH COMPANY, LTD.
Reel/Frame 047601/0778 →
Priority Claims (1)
JP JP2018-003228 · Jan 12, 2018 · national
Continuity (1)
Related Publication 20190221985A1 · Jul 18, 2019