Display device and manufacturing method thereof

1. A display device comprising:

a substrate comprising:

a display area comprising pixels, the pixels comprising emitting layers; and

a non-display area disposed outside the display area;

a thin film encapsulation layer disposed on the substrate;

a cover layer overlapping an edge of the thin film encapsulation layer such that the cover layer is disposed on an edge of the display area and in the non-display area; and

a touch unit disposed on the thin film encapsulation layer and the cover layer,

wherein the cover layer comprises a light blocking material, and

wherein the cover layer does not overlap the emitting layers of the pixels.

2. The display device of claim 1 , wherein:

the thin film encapsulation layer is thinner at the edge of the thin film encapsulation layer than at a center of the thin film encapsulation layer; and

heights of upper surfaces of the thin film encapsulation layer and the cover layer from the surface of the substrate are substantially equivalent, the upper surfaces being substantially flat.

3. The display device of claim 2 , wherein:

the touch unit comprises touch electrodes and touch wires connected to the touch electrodes; and

the cover layer overlaps the touch wires.

4. The display device of claim 3 , further comprising:

a driving voltage line and spacers disposed in the non-display area,

wherein, in a view perpendicular to the surface of the substrate, the cover layer overlaps the driving voltage line, and

wherein, in the view perpendicular to the substrate of the substrate, the cover layer overlaps a first spacer among the spacers and is spaced apart from a second spacer among the spacers.

5. The display device of claim 4 , wherein:

the thin film encapsulation layer comprises inorganic insulating layers and at least one organic insulating layer; and

in a direction perpendicular to the surface of the substrate, the inorganic insulating layers of the thin film encapsulation layer are disposed between the cover layer and the substrate.

6. The display device of claim 4 , wherein:

the thin film encapsulation layer comprises inorganic insulating layers and at least one organic insulating layer; and

in a direction perpendicular to the surface of the substrate, the organic insulating layer and the cover layer are disposed between at least two of the inorganic insulating layers of the thin film encapsulation layer.

7. A display device comprising:

a substrate comprising:

a display area comprising pixels, the pixels comprising transistors and emitting layers; and

a non-display area disposed outside the display area;

a thin film encapsulation layer disposed on the substrate;

a first cover layer disposed on the thin film encapsulation layer and in the non-display area;

a second cover layer disposed on the thin film encapsulation layer and in the display area such that the second cover layer is laterally adjacent to the first cover layer; and

a touch unit disposed on the first cover layer and the second cover layer,

wherein the first cover layer comprises a light blocking material without overlapping the transistors and the emitting layers of the pixels, and

wherein the second cover layer is at least translucent.

8. The display device of claim 7 , wherein upper surfaces of the first cover layer and the second cover layer have substantially equivalent heights from a surface of the substrate, the upper surfaces being substantially flat.

9. The display device of claim 8 , wherein:

the touch unit comprises touch electrodes and touch wires connected to the touch electrodes;

the first cover layer overlaps the touch wires; and

the second cover layer overlaps the touch electrodes.

10. The display device of claim 9 , further comprising:

a driving voltage line and spacers disposed in the non-display area,

wherein:

the first cover layer overlaps the driving voltage line;

in a direction perpendicular to the surface of the substrate, the first cover layer overlaps a first spacer among the spacers; and

in the direction perpendicular to the surface of the substrate, the first cover layer is spaced apart from a second spacer among the spacers.

11. A method of manufacturing a display device, comprising:

forming a thin film encapsulation layer on a substrate, the substrate comprising:

a display area comprising pixels, the pixels comprising emitting layers; and

a non-display area disposed outside the display area;

forming a cover layer overlapping an edge of the thin film encapsulation layer, the cover layer being formed on an edge of the display area and in the non-display area, the cover layer not overlapping the emitting layers of the pixels; and

forming a touch unit on the thin film encapsulation layer and the cover layer,

wherein forming the cover layer comprises:

stacking an organic material comprising a light blocking material; and

performing a photolithography process.

12. The method of claim 11 , wherein:

the thin film encapsulation layer is thinner at the edge of the thin film encapsulation layer than at a center of the thin film encapsulation layer; and

upper surfaces of the thin film encapsulation layer and the cover layer are formed to have substantially equivalent heights from the surface of the substrate, the upper surfaces being formed to be substantially flat.

13. The method of claim 12 , wherein:

forming the touch unit comprises forming touch electrodes on the substrate and touch wires connected to the touch electrodes; and

the cover layer is formed to overlap the touch wires.

14. The method of claim 13 , further comprising:

forming a driving voltage line and spacers in the non-display area,

wherein, in a direction perpendicular to the surface of the substrate, the cover layer is formed to overlap the driving voltage line, overlap a first spacer among the spacers, and be spaced apart from a second spacer among the spacers.

15. The method of claim 11 , wherein:

the thin film encapsulation layer is formed comprising inorganic insulating layers and at least one organic insulating layer; and

in a direction perpendicular to a surface of the substrate, the cover layer and the at least one organic insulating layer are disposed between at least two of the inorganic insulating layers.

16. A method of manufacturing a display device, comprising:

forming a thin film encapsulation layer on a substrate, the substrate comprising:

a display area comprising pixels, the pixels comprising transistors and emitting layers; and

a non-display area disposed outside the display area;

forming a first cover layer on the thin film encapsulation layer and in the non-display area without overlapping the transistors and the emitting layers of the pixels;

forming a second cover layer on the thin film encapsulation layer and in the display area such that the second cover layer is formed laterally adjacent to the first cover layer; and

forming a touch unit on the first cover layer and the second cover layer,

wherein forming the first cover layer comprises:

stacking an organic material comprising a light blocking material; and

performing a photolithography process, and

wherein the second cover layer is formed of an at least translucent organic material.

17. The method of claim 16 , wherein forming the second cover layer comprises stacking, via inkjet printing, an organic material in a region surrounded by the first cover layer.

18. The method of claim 17 , wherein upper surfaces of the first cover layer and the second cover layer are formed to have substantially equivalent heights from a surface of the substrate, the upper surfaces being formed to be substantially flat.

19. The method of claim 18 , wherein:

forming the touch unit comprises forming touch electrodes and touch wires connected to the touch electrodes;

the first cover layer is formed to overlap the touch wires; and

the second cover layer is formed to overlap the touch electrodes.

20. The method of claim 19 , further comprising:

forming a driving voltage line and spacers in the non-display area,

wherein, in a direction perpendicular to the surface of the substrate, the cover layer is formed to overlap the driving voltage line, overlap a first spacer among the spacers, and be spaced apart from a second spacer among the spacers.