Backplane substrate including in-cell type touch panel, liquid crystal display device using the same, and method of manufacturing the same
The present invention is for a backplane substrate including an in-cell type touch panel advantageous to reducing the number of masks and the number of processes, a liquid crystal display device including the same, and a method of manufacturing the same, includes a plurality of interlayer dielectric layers disposed above a drain electrode of a thin film transistor are simultaneously patterned after forming a sensing line and a common electrode.
1. A method of manufacturing a backplane substrate including an in-cell type touch panel, comprising:
preparing a substrate comprising a plurality of pixels in a matrix;
providing a thin film transistor at each pixel of the substrate;
forming a first interlayer dielectric layer to cover the thin film transistor;
forming a sensing line on the first interlayer dielectric layer;
forming a second interlayer dielectric layer on the first interlayer dielectric layer to cover the sensing line;
forming a common electrode at each block including some pixels of a plurality of pixels, to overlap the sensing line;
forming a third interlayer dielectric layer to cover the common electrode;
forming a first interlayer contact hole passing through the third interlayer dielectric layer, the second interlayer dielectric layer, and the first interlayer dielectric layer to expose a part of the thin film transistor at each pixel, and a second interlayer contact hole corresponding to a sidewall of the common electrode adjacent to an overlapping part of the sensing line and the common electrode, the second interlayer contact hole passing through the third interlayer dielectric layer and the second interlayer dielectric layer to expose the sensing line; and
forming a pixel electrode connected to the thin film transistor through the first interlayer contact hole, and a connection pattern connected to the sensing line through the second interlayer contact hole.
2. The method of manufacturing the backplane substrate including the in-cell type touch panel according to claim 1 , wherein, in forming the common electrode, the common electrode includes a first opening hole spaced from the pixel electrode and a second opening hole having a size equal to or greater than the second interlayer contact hole.
3. The method of manufacturing the backplane substrate including the in-cell type touch panel according to claim 2 , wherein:
the first opening hole is larger than a connection region of the pixel electrode and the thin film transistor, and
the connection pattern is in contact with an edge of the second opening hole.