Method and system for mixed mode wafer inspection
Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
1. A method for providing field-to-field based wafer inspection comprising:
receiving one or more inspection results of a wafer, wherein the one or more inspection results include one or more images of a selected region of the wafer, the one or more images including three or more fields, each of the three or more fields included in a common die, each of the three or more fields including one or more repeating structures within the common die;
generating a reference field image by combining the three or more fields of the inspection results, each of the three or more fields included in the common die, wherein a noise floor of the reference field is lower than a noise floor of any of the three or more fields; and
comparing one or more fields to the generated reference field image in order to identify an occurrence of one or more defects in the one or more fields.
2. The method of claim 1 , wherein the combining the three or more fields of the inspection results comprises:
combining the three or more fields of the inspection results with one or more ensemble-based pixel processing procedures.
3. The method of claim 2 , wherein the ensemble-based pixel processing procedures comprises:
at least one of median processing, arithmetic averaging, geometric averaging, weighted averaging and unbiased best linear estimation.
4. The method of claim 1 , wherein the compared one or more fields are acquired from the received one or more inspection results.
5. The method of claim 1 , wherein the compared one or more fields are acquired from an additional one or more inspection results.
6. The method of claim 1 , wherein the comparing one or more fields to the generated reference field in order to identify an occurrence of one or more defects in the one or more fields comprises:
calculating a difference between a set of pixel values of the one or more fields and a corresponding set of pixel values of the generated reference field image.
7. The method of claim 1 , wherein at least one of the three or more fields of the generated reference field image and the one or more fields compared to the generated reference field image include a repeating set of cells.
8. The method of claim 1 , wherein at least one of the three or more fields of the generated reference field image and the one or more fields compared to the generated reference field image comprise:
two or more fields having a regular spacing along at least one of a first direction and a second direction perpendicular to the first direction.
9. The method of claim 1 , wherein at least one of the three or more fields of the generated reference field image and the one or more fields compared to the generated reference field image comprise:
two or more fields having an irregular spacing along at least one of a first direction and a second direction perpendicular to the first direction.