Displaying apparatus having light emitting device, method of manufacturing the same and method of transferring light emitting device
A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.
1. A displaying apparatus, comprising:
a panel substrate;
a plurality of light emitting devices arranged on the panel substrate; and
at least one connection tip disposed on one surface of each of the light emitting devices,
wherein each of the light emitting devices comprises:
a light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer and an active layer interposed between the first and second conductivity type semiconductor layers; and
first and second electrode pads disposed on the light emitting structure, and
wherein the at least one connection tip is formed of material with a light transmittance of at least 90%.
2. The displaying apparatus of claim 1 , wherein the at least one connection tip is disposed on the light emitting structure, and is disposed between the first and second electrode pads.
3. The displaying apparatus of claim 2 , wherein a thickness of the at least one connection tip is smaller than a thicknesses of the first and second electrode pads.
4. The displaying apparatus of claim 1 , wherein the at least one connection tip is disposed on an opposite side of the light emitting structure opposite to the first and second electrode pads.
5. The displaying apparatus of claim 4 , wherein the at least one connection tip contacts the first conductivity type semiconductor layer.
6. The displaying apparatus of claim 1 , wherein:
a plurality of connection tips are disposed on each of the light emitting devices, and
the plurality of connection tips arranged on each of the light emitting devices are disposed asymmetrically to at least one alignment direction of the light emitting devices arranged on the panel substrate.
7. The displaying apparatus of claim 6 , wherein:
the at least one connection tip comprises three connection tips arranged in a triangular shape,
one of the three connection tips is disposed along a first row, and
the other two connection tips are disposed along another row adjacent to the first row.
8. The displaying apparatus of claim 7 , wherein:
the at least one connection tip further comprises a connection tip disposed at a center of the light emitting device, and
the connection tip disposed at the center of the light emitting device is disposed in the triangle shape formed by the three connection tips.
9. The displaying apparatus of claim 8 , wherein the connection tips have right triangular shapes.
10. The displaying apparatus of claim 9 , wherein the connection tip disposed at the center of the light emitting device is disposed in a different direction from that of the other connection tips.
11. The displaying apparatus of claim 6 , wherein the plurality of connection tips have different thicknesses.
12. The displaying apparatus of claim 1 , wherein an area ratio of the connection tip to a planar area of the light emitting device is 1.2% or less.
13. The displaying apparatus of claim 1 , wherein the first electrode pad is electrically connected to the first conductivity type semiconductor layer through a via-hole formed in the second conductivity type semiconductor layer and the active layer.
14. The displaying apparatus of claim 1 , wherein the light emitting device further comprises an insulation layer covering the second conductivity type semiconductor layer and side surfaces of the first conductivity type semiconductor layer.
15. The displaying apparatus of claim 14 , wherein:
the light emitting device further comprises an ohmic-layer disposed on the second conductivity type semiconductor layer, and
the insulation layer covers the ohmic-layer and side surfaces of the first conductivity type semiconductor layer.
16. The displaying apparatus of claim 1 , further comprising:
bumps electrically connected to the light emitting devices;
a base substrate disposing opposite to the bumps and transmitting light emitted from the light emitting devices;
a step adjustment layer disposed between the bumps and the light emitting devices to cover the light emitting devices; and
an adhesive layer disposed between the base substrate and the light emitting devices to adhere the light emitting devices to the base substrate,
wherein the step adjustment layer and the adhesive layer cover side surfaces of the light emitting device.
17. The displaying apparatus of claim 16 , further comprising: a protection layer covering side surfaces of the bumps and the step adjustment layer.
18. The displaying apparatus of claim 16 , wherein the connection tips are buried in the adhesive layer.
19. The displaying apparatus of claim 16 , wherein the base substrate has irregularities on a surface thereof.
20. The displaying apparatus of claim 16 , further comprising: a light blocking layer disposed between the adhesive layer and the base substrate, wherein the light blocking layer has a window transmitting light generated in the light emitting device, and a width of the window is smaller than that of the light emitting device.