IP Library › Granted Patent US 10,858,541
Granted Patent B2
US 10,858,541 · App. 16/208,983 · Granted Dec 8, 2020

Curable composition

Inventors: Michael Mulzer (Marlborough, MA); Yusuke Matsuda (Glen Mills, PA)
Assignee: Rohm and Haas Electronic Materials LLC
C09D183/12C08G77/06C08G77/14C08G77/18C08G77/80C08J3/24C08J7/04C08J7/0427C08K5/0025C09D7/63C09D7/67C09D7/68C09D183/06C08G77/46C08J2367/02C08J2379/08C08J2483/04
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Quick Facts
Patent No.
US 10,858,541
App. No.
16/208,983
Granted
Dec 8, 2020
Kind
B2
Abstract

A curable composition comprising an epoxy-siloxane oligomer comprising as polymerized units one or more difunctional silane monomers of formula (1) and one or more trifunctional silane monomers of formula (2) in a mole ratio of 95:5 to 10:30 Si(R 1 )(R 2 )(Y 1 ) 2   (1) SiR 3 (Y 2 ) 3   (2) wherein R 1 , R 2 , and R 3 are independently chosen from a C 5-20 -aliphatic group comprising an oxirane ring fused to an alicyclic ring, C 1-20 -alkyl, C 6-30 -aryl group, and a C 5-20 -aliphatic group having one or more heteroatoms; each Y 1 and Y 2 is independently chosen from halogen, C 1-4 -alkoxy, and —O—C 1-4 -acyl group; wherein at least one of R 1 , R 2 , and R 3 is a C 5-20 -aliphatic group comprising an oxirane ring fused to an alicyclic ring; (b) organic particles having an average diameter of 50 to 250 nm; (c) a reactive carrier having one or more epoxy moieties or oxetane moieties; (d) a curing agent; and (e) one or more organic solvents, and methods of forming cured coatings using such compositions are described.

Claims (13)

1. A composition comprising: (a) 5 to 85 wt % of an epoxy-siloxane oligomer comprising as polymerized units one or more difunctional silane monomers of formula (1) and one or more trifunctional silane monomers of formula (2) in a mole ratio of 95:5 to 10:30

Si(R 1 )(R 2 )(Y 1 ) 2   (1)

SiR 3 (Y 2 ) 3   (2)

wherein R 1 , R 2 , and R 3 are independently chosen from a C 5-20 -aliphatic group comprising an oxirane ring fused to an alicyclic ring, C 1-20 -alkyl, C 6-30 -aryl group, and a C 5-20 -aliphatic group having one or more heteroatoms; each Y 1 and Y 2 is independently chosen from halogen, C 1-4 -alkoxy, and —O—C 1-4 -acyl group; wherein at least one of R 1 , R 2 , and R 3 is a C 5-20 -aliphatic group comprising an oxirane ring fused to an alicyclic ring; (b) 1 to 20 wt % of organic particles having an average diameter of 50 to 250 nm; (c) 3 to 50 wt % of a reactive carrier having one or more epoxy moieties or oxetane moieties; (d) 0.5 to 8 wt % of a curing agent; and (e) 1 to 60 wt % of one or more organic solvents.

2. The composition of claim 1 wherein the organic particles are core-shell rubber nanoparticles.

3. The composition of claim 1 wherein the reactive carrier comprises at least two epoxycyclohexane groups or at least two oxetane rings.

4. The composition of claim 1 wherein at least one of R 1 , R 2 , and R 3 is a C 5-20 -aliphatic group comprising an oxirane ring fused to an alicyclic ring having 5 or 6 carbon atoms.

5. The composition of claim 1 wherein the curing agent is a cationic photoinitiator.

6. The composition of claim 1 wherein the composition further comprises one or more additives selected from the group consisting of adhesion promoters, leveling agents, defoaming agents, anti-static agents, anti-blocking agents, UV absorbers, optical whitening agents, anti-fingerprint additives, and scratch resistance additives.

7. A method comprising: (a) providing a flexible substrate; and (b) disposing a layer of a coating composition of claim 1 on the flexible substrate; and (c) curing the layer of the coating composition.

8. The method of claim 7 wherein the flexible substrate is selected from the group consisting of polyimide substrates, polyethylene-terephthalate substrates, polyethylene naphthalate substrates, polycarbonate substrates, poly(methyl methacrylate) substrates, polyethylene substrates, polypropylene substrates, and combinations thereof.

9. The method of claim 7 wherein the curing step comprises thermal curing, photocuring, or a combination thereof.

10. The method of claim 7 wherein the cured coating composition has an elongation to break of >4% at a film thickness of 5 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2019
From: MULZER, MICHAEL; MATSUDA, YUSUKE
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 048135/0467 →
Continuity (2)
Provisional Application 62607656 · Dec 19, 2017
Related Publication 20190185710A1 · Jun 20, 2019