Fin field effect transistor (FinFET) device structure with insulating structure over fin isolation structure and method for forming the same
A method for forming a FinFET device structure is provided. The method for forming a FinFET device structure includes forming a fin structure and a fin isolation structure over a substrate, and forming a metal stack over the fin structure and the fin isolation structure. The method for forming a FinFET device structure also includes partially removing the metal stack so that a top surface of the fin isolation structure is exposed, and forming a dielectric material over the metal stack and covering the top surface of the fin isolation structure. The method for forming a FinFET device structure further includes patterning the dielectric material and the metal stack to form a metal gate structure and an insulating structure over the metal gate structure.
1. A method for forming a fin field effect transistor (FinEET) device structure, comprising:
forming a fin structure and a fin isolation structure over a substrate;
forming a metal stack over the fin structure and the fin isolation structure;
partially removing the metal stack so that a top surface of the fin isolation structure is exposed;
forming a dielectric material over the metal stack and covering the top surface of the fin isolation structure; and
patterning the dielectric material and the metal stack to form a metal gate structure and an insulating structure over the metal gate structure.
2. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 1 , further comprising:
forming an isolation structure over the substrate, wherein the fin isolation structure is separated from the substrate by the isolation structure.
3. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 2 , further comprising:
forming an inter-layer dielectric (ILD) structure over the fin structure, the fin isolation structure and the isolation structure after the metal gate structure is formed.
4. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 1 , further comprising:
forming a high-k dielectric layer between the fin structure and the metal stack and between the fin isolation structure and the metal stack, wherein a portion of the high-k dielectric layer is removed during the step of partially removing the metal stack, and the dielectric material penetrates through the high-k dielectric layer to directly contact the top surface of the fin isolation structure.
5. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 1 , wherein the insulating structure further comprises an extending portion separating the metal gate structure from another metal gate structure.
6. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 1 , further comprising:
forming a recess in the fin structure after the metal gate structure is formed; and
forming a source/drain (S/D) structure in the recess.
7. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 1 , further comprising:
forming gate spacers covering sidewalls of the metal gate structure and sidewalls of the fin structure after the metal gate structure is formed.
8. A method for forming a fin field effect transistor (FinFET) device structure,
forming a fin structure and a fin isolation structure over a substrate;
forming a metal stack over the fin structure and the fin isolation structure;
forming an opening in the metal stack to expose a top surface of the fin isolation structure;
forming a dielectric material over the metal stack and extending into the opening; and
patterning the dielectric material and the metal stack to form an insulating structure over metal gate structures, wherein the metal gate structures are separated by an extending portion of the insulating structure.
9. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 8 , further comprising:
forming an isolation structure over the substrate, wherein a lower portion of the fin structure is surrounded by the isolation structure, and the fin isolation structure is formed over the isolation structure and adjacent to the fin structure.
10. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 8 , wherein the dielectric material is in direct contact with the top surface of the fin isolation structure.
11. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 8 , wherein an upper portion of the fin isolation structure is surrounded by the extending portion of the insulating structure.
12. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 8 , wherein the opening has a first width, and a ratio of a depth of the opening to the first width is in a range from about 0.0005 to about 2.5.
13. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 8 , wherein the opening has a second width, and a ratio of a depth of the opening to the second width is in a range from about 0.0625 to about 20.
14. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 8 , further comprising:
forming gate spacers covering sidewalls of the metal gate structures after the metal gate structures are formed.
15. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 14 , wherein the gate spacers extend over sidewalls of the extending portion of the insulating structure.
16. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 14 , wherein sidewalls of the fin structure and sidewalls of the fin isolation structure are covered by the gate spacers.
17. The method for forming the fin field effect transistor (FinFET) device structure as claimed in claim 8 , further comprising:
forming a source/drain (S/D) structure adjacent to the metal gate structures after the metal gate structures and the insulating structure are formed;
forming an etch stop layer covering the S/D structure and the top surface of the fin isolation structure; and
forming an inter-layer dielectric (ILD) structure over the etch stop layer.
18. A fin field effect transistor (FinFET) device structure, comprising:
a fin structure formed over a substrate;
an isolation structure formed over the substrate, wherein the fin structure protrudes from the isolation structure;
a fin isolation structure formed over the isolation structure;
a metal gate structure formed over the fin structure and the fin isolation structure;
an insulating structure formed over the metal gate structure, wherein an extending portion of the insulating structure is in direct contact with the fin isolation structure; and
a gate spacer formed over a sidewall of the metal structure and a sidewall of the extending portion, wherein the sidewall of the metal gate structure is coplanar with the sidewall of the extending portion.
19. The fin field effect transistor (FinFET) device structure as claimed in claim 18 , wherein the metal gate structure further comprises:
a high-k dielectric layer;
a metal stack formed over the high-k dielectric layer; and
a metal cap layer formed over the metal stack, wherein a bottommost surface of the metal cap layer is in direct contact with a topmost surface of the metal stack.
20. The fin field effect transistor (FinFET) device structure as claimed in claim 18 , wherein a width of the extending portion is greater than a width of the fin isolation structure, and a portion of the extending portion is sandwiched between the high-k dielectric layer and the fin isolation structure.