Method of manufacturing a coil component
A manufacturing method of a coil component includes: forming a plating resist on an internal insulating layer; forming a coil pattern and a lead pattern connected to the coil pattern and at least partially having a thickness smaller than that of the coil pattern by plating; removing the plating resist; and stacking a magnetic sheet on the internal insulating layer to form a body.
1. A method of manufacturing a coil component, the method comprising:
forming a plating resist on an internal insulating layer;
forming a coil pattern and a lead pattern connected to the coil pattern by plating, wherein at least a portion of the lead pattern has a thickness smaller than that of the coil pattern;
removing the plating resist; and
stacking a magnetic sheet on the internal insulating layer to form a body,
wherein the plating resist includes:
an opening pattern corresponding to the coil pattern;
a hollow pattern corresponding to the lead pattern and being in communication with the opening pattern; and
a cover portion at least partially covering the hollow pattern.
2. The manufacturing method of claim 1 , wherein the cover portion extends parallel to a surface of the internal insulating layer and is spaced apart from the internal insulating layer.
3. The manufacturing method of claim 2 , wherein the forming of the plating resist includes:
stacking a dry film on the internal insulating layer; and
performing exposure on the dry film several times while changing an exposure region.
4. The manufacturing method of claim 3 , wherein the performing of exposure on the dry film several times includes:
performing exposure on a first region of the dry film using a first exposure energy; and
performing exposure on a second region of the dry film using a second exposure energy lower than the first exposure energy.
5. The manufacturing method of claim 1 , further comprising, before the forming of the plating resist on the internal insulating layer, forming a seed layer on the internal insulating layer.
6. The manufacturing method of claim 5 , further comprising, after the removing of the plating resist, selectively removing the seed layer so as to form a seed pattern corresponding to the coil pattern and the lead pattern.
7. The manufacturing method of claim 1 , wherein the forming of the plating resist on the internal insulating layer includes:
forming a seed pattern corresponding to the coil pattern and the lead pattern on the internal insulating layer; and
forming the plating resist on the internal insulating layer on which the seed pattern is formed.
8. The manufacturing method of claim 7 , wherein the forming of the coil pattern and the lead pattern by plating is performed by an anisotropic plating.
9. The manufacturing method of claim 1 , wherein the forming of the coil pattern and the lead pattern by plating is performed by an anisotropic plating.
10. A method of manufacturing a coil component, the method comprising:
forming a plating resist on an internal insulating layer;
forming a coil pattern and a lead pattern connected to the coil pattern by plating, wherein at least a portion of the lead pattern has a thickness smaller than that of the coil pattern;
removing the plating resist; and
stacking a magnetic sheet on the internal insulating layer to form a body,
wherein the forming of the plating resist on the internal insulating layer includes:
forming a seed pattern corresponding to the coil pattern and the lead pattern on the internal insulating layer; and
forming the plating resist on the internal insulating layer on which the seed pattern is formed.