Cooling devices including jet cooling with an intermediate mesh and methods for using the same
View Patent ↗An assembly includes a substrate including a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices, a mesh coupled to the base portion, the mesh defining a plurality of pores aligned with the plurality of jet paths, and a heat-generating device coupled to the mesh opposite the base portion, the heat-generating device defining a bottom surface that is oriented transverse to the plurality of jet paths.
1. An assembly comprising:
a substrate comprising a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices;
a mesh coupled to the base portion, the mesh defining a plurality of apertures aligned with the plurality of jet paths;
a heat-generating device coupled to the mesh opposite the base portion, the heat-generating device defining a bottom surface that is oriented transverse to the plurality of jet paths; and
an intermediate layer positioned on the bottom surface of the heat-generating device, the intermediate layer intersecting the plurality of j et paths, wherein the intermediate layer comprises a phase-change material selected to transition from one phase to another phase at a temperature that corresponds to an operating temperature of the heat-generating device.
2. The assembly of claim 1 , wherein a span of each orifice of the plurality of orifices of the base portion is different than a span of each of the apertures of the plurality of apertures of the mesh.
3. The assembly of claim 1 , wherein the mesh is spaced apart from the base portion in a vertical direction extending between the base portion and the heat-generating device.
4. The assembly of claim 1 , wherein the mesh comprises a planar portion defining the plurality of apertures, and wherein the planar portion of the mesh is adjacent to and in contact with an outlet face of the base portion of the substrate.
5. The assembly of claim 1 , wherein the mesh comprises a planar portion defining the plurality of apertures, and a plurality of engagement portions extending outward from the planar portion in a vertical direction extending between the substrate and the heat-generating device.
6. The assembly of claim 1 , further comprising an electrically-insulating layer positioned on the mesh.
7. The assembly of claim 1 , further comprising a porous layer positioned on the mesh.
8. The assembly of claim 7 , further comprising an electrically-insulating layer positioned on the porous layer.
9. An electronics assembly comprising:
a substrate comprising a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices;
a mesh coupled to the base portion, the mesh defining a plurality of apertures aligned with the plurality of jet paths;
a power electronics device electrically coupled to the substrate through the mesh; and
an intermediate layer positioned on a bottom surface of the power electronics device, the intermediate layer intersecting the plurality of jet paths.
10. The electronics assembly of claim 9 , wherein the bottom surface of the power electronics device is oriented transverse to the plurality of jet paths.
11. The electronics assembly of claim 9 , wherein a span of each orifice of the plurality of orifices of the base portion is different than a span of each aperture of the plurality of apertures of the mesh.
12. The electronics assembly of claim 9 , wherein the mesh is spaced apart from the base portion in a vertical direction extending between the base portion and the power electronics device.
13. The electronics assembly of claim 9 , wherein the mesh comprises a planar portion defining the plurality of apertures, and wherein the planar portion of the mesh is adjacent to and in contact with an outlet face of the base portion of the substrate.
14. The electronics assembly of claim 9 , further comprising a plurality of posts positioned between the base portion and the mesh in a vertical direction extending between the base portion and the power electronics device and electrically coupling the mesh to the power electronics device.
15. The electronics assembly of claim 9 , further comprising an electrically-insulating layer positioned on the mesh.
16. The electronics assembly of claim 15 , further comprising a porous layer positioned on the mesh, wherein the electrically-insulating layer is positioned over the porous layer.
17. The electronics assembly of claim 9 , wherein the intermediate layer comprises a phase-change material selected to transition from one phase to another phase at a temperature that corresponds to an operating temperature of the power electronics device.
18. The assembly of claim 1 , wherein the plurality of jet paths extend through the plurality of apertures of the mesh.
19. The electronics assembly of claim 9 , wherein the plurality of jet paths extend through the plurality of apertures of the mesh.