IP Library › Granted Patent US 11,240,574
Granted Patent B2
US 11,240,574 · App. 16/216,725 · Granted Feb 1, 2022

Networked speaker system with audio network box

Inventors: James R. Milne (Ramona, CA); Gregory Carlsson (Santee, CA); Tomohiro Koyata (San Diego, CA); Tonni Sandager Larsen (San Diego, CA)
Assignee: Sony Corporation
H04R1/00H04L12/2856H04L12/40117H04R3/00H04W88/12H04R2420/07H04R2420/09
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Quick Facts
Patent No.
US 11,240,574
App. No.
16/216,725
Granted
Feb 1, 2022
Kind
B2
Abstract

An audio network box is provided as a master for a networked speaker system. The audio box can be configured with different combinations of modules to provide functionality as may be desired by an end user. The modules may include a power over Ethernet module, a wireless communication module/access point (AP) module, and an analog speaker module.

Claims (14)

1. An assembly comprising:

at least one housing;

at least one network interface in the housing configured to exchange data with a wide area network;

the housing comprising plural regions for configuring the assembly with plural modules; and plural modules engaged with respective regions in the housing, the modules comprising:

at least one system on a chip (SoC) module comprising at least one controller, the SoC module being configured to perform n-channel rendering, identifying a number of speakers in an audio system and configure the speakers automatically based at least on part on speaker model, frequency range of a speaker, the SoC module being further configured to synchronize the speakers in the audio system; and

at least one analog module configured to provide analog signals to an analog speaker.

2. The assembly of claim 1 , wherein the modules further comprise:

at least one wireless module configured to wirelessly communicate with one or more audio speakers;

and at least one power over Ethernet (PoE) module configured to supply power and audio data to at least one speaker.

3. The assembly of claim 1 , wherein the modules further comprise:

at least one wireless module configured to wirelessly communicate with one or more audio speakers.

4. The assembly of claim 1 , wherein the modules further comprise: at least one power over Ethernet (PoE) module configured to supply power and audio data to at least one speaker.

5. The assembly of claim 1 , wherein at least one of the plural modules is implemented by a circuit card.

6. The assembly of claim 1 , wherein at least one of the plural modules is implemented by a chip.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2018
From: MILNE, JAMES R.; CARLSSON, GREGORY; KOYATA, TOMOHIRO; LARSEN, TONNI SANDAGER
To: SONY CORPORATION
Reel/Frame 047828/0650 →
Continuity (1)
Related Publication 20200186899A1 · Jun 11, 2020
Cited By (1)
US 12,470,854