Integrated circuit device with source/drain barrier
Various examples of an integrated circuit device and a method for forming the device are disclosed herein. In an example, a method includes receiving a workpiece that includes a substrate, and a device fin extending above the substrate. The device fin includes a channel region. A portion of the device fin adjacent the channel region is etched, and the etching creates a source/drain recess and forms a dielectric barrier within the source/drain recess. The workpiece is cleaned such that a bottommost portion of the dielectric barrier remains within a bottommost portion of the source/drain recess. A source/drain feature is formed within the source/drain recess such that the bottommost portion of the dielectric barrier is disposed between the source/drain feature and a remainder of the device fin.
1. A device comprising:
a fin disposed on a substrate, wherein the fin has a first sidewall surface and an opposing second sidewall surface;
a first source/drain feature disposed on the fin such that the first source/drain feature physically contacts the first sidewall surface of the fin; and
a first dielectric barrier disposed under and interfacing with the first source/drain feature such that the first dielectric barrier prevents the first source/drain feature from interfacing with the substrate below the first dielectric barrier, wherein the first dielectric layer includes remnants of an etchant, and
wherein a side surface of the first source/drain feature is free of the first dielectric barrier.
2. The device of claim 1 , wherein the side surface of the first source/drain feature physically contacts the first sidewall surface of the fin.
3. The device of claim 1 , wherein a channel region extends from the first sidewall surface to the second sidewall surface.
4. The device of claim 1 , further comprising:
a second source/drain feature disposed on the fin such that the second source/drain feature physically contacts the second sidewall surface of the fin; and
a second dielectric barrier disposed under and interfacing with the second source/drain feature such that the second dielectric barrier prevents the second source/drain feature from interfacing with the substrate below the second dielectric barrier.
5. The device of claim 4 , wherein the first dielectric barrier is spaced apart from the second dielectric barrier.
6. The device of claim 1 , wherein the first dielectric barrier has a convex top surface.
7. The device of claim 1 , further comprising a gate stack wrapping around the fin.
8. A device comprising:
a semiconductor fin disposed over a substrate, the semiconductor fin having a first side surface, an opposing second side surface, and a channel region extending from the first side surface to the second side surface;
a first source/drain feature disposed on the semiconductor fin and physically contacting the first side surface of the semiconductor fin;
a first dielectric barrier disposed between a bottom portion of the first source/drain feature and the substrate, wherein the first dielectric barrier includes remnants of a photoresist material; and
a second source/drain feature disposed on the semiconductor fin.
9. The device of claim 8 , wherein the second source/drain feature physically contacts the second side surface of the semiconductor fin.
10. The device of claim 8 , further comprising a second dielectric barrier disposed between a bottom portion of the second source/drain feature and the substrate.
11. The device of claim 8 , wherein the first dielectric barrier has a planarized top surface.
12. The device of claim 8 , further comprising a shallow trench isolation structure disposed on the substrate, wherein the shallow trench isolation structure has a topmost surface at a first height above the substrate, and
wherein the bottom portion of the first dielectric barrier is positioned at a second height that is below the first height of the topmost surface of the shallow trench isolation structure.
13. The device of claim 8 , further comprising a shallow trench isolation structure disposed on the substrate, wherein the shallow trench isolation structure has a topmost surface at a first height above the substrate, and
wherein the bottom portion of the first dielectric barrier is positioned at a second height that is above the first height of the topmost surface of the shallow trench isolation structure.
14. A method comprising:
removing a portion of a fin structure to form a recess in the fin structure, wherein a dielectric barrier is formed in the recess during the removing of the portion of the fin structure, wherein the dielectric barrier includes remnants of the fin structure;
removing a first portion of the dielectric barrier such that a second portion of the dielectric barrier remains in the recess after the removing of the first portion of the dielectric barrier; and
forming a source/drain feature within the recess on the second portion of the dielectric barrier.
15. The method of claim 14 , wherein removing the first portion of the dielectric barrier includes performing a first treatment process and a second treatment process, the second treatment process different than the first treatment process.
16. The method of claim 14 , wherein the second portion of the dielectric barrier is disposed between the source/drain feature and a substrate, and
wherein the fin structure is disposed on the substrate.
17. The method of claim 14 , further comprising forming a metal gate structure over the fin structure.
18. The method of claim 14 , wherein removing the first portion of the dielectric barrier exposes a channel region of the fin structure.
19. The method of claim 18 , wherein forming the source/drain feature within the recess includes forming the source/drain feature directly on the channel region such that the source/drain feature physically contacts the channel region of the fin structure.
20. The method of claim 14 , wherein the dielectric barrier is formed in the recess during the removing of the portion of the fin structure includes forming the dielectric barrier from an etchant used during an etching process performed during the removing of the portion of the fin structure.