Plating apparatus and plating method
A plating apparatus includes a plating tank and a plating unit that performs electrolytic plating on an object. The plating unit includes a workpiece passage region including a partition wall that allows passage of the plating solution but does not allow passage of the object, the workpiece passage region passing the object from above toward below, an injection unit that injects the plating solution from below toward above, a mixing unit that mixes the plating solution injected by the injection unit and the object to be plated passing through the workpiece passage region, an anode outside the workpiece passage region, a cathode inside the workpiece passage region including a hollow region through which a mixed fluid of the plating solution and the object to be plated passes from below toward above, and a guidance unit that guides the mixed fluid to the workpiece passage region.
1. A plating apparatus comprising:
a plating tank in which a plating solution is stored; and
a plating unit provided in the plating tank to perform electrolytic plating on an object to be plated; wherein
the plating unit includes:
a workpiece passage region in which at least a portion of the workpiece passage region is surrounded by a partition wall that allows passage of the plating solution but does not allow passage of the object to be plated, the object to be plated being passed from above toward below in the workpiece passage region;
an injector that injects the plating solution from below toward above;
a mixer above the injector and below the workpiece passage region to mix the plating solution injected by the injector and the object to be plated passing through the workpiece passage region;
an anode outside the workpiece passage region;
a cathode inside the workpiece passage region and including a hollow region through which a mixed fluid of the plating solution and the object to be plated mixed by the mixer passes from below toward above; and
a guide that guides the mixed fluid passing through the hollow region of the cathode to the workpiece passage region;
the guide includes a plating solution passage that allows the passage of the plating solution but does not allow the passage of the object to be plated; and
the guide is structured such that a top opening of the guide is larger than a bottom opening of the guide and side surfaces of the guide extend from the top opening to the bottom opening of the guide.
2. The plating apparatus according to claim 1 , wherein
the partition wall surrounds the cathode;
the anode surrounds the partition wall; and
the cathode, the partition wall, and the anode are concentrically disposed.
3. The plating apparatus according to claim 1 , wherein the partition wall, the mixer, the cathode, and the guide define an integral unit that is able to be separated from the plating apparatus.
4. The plating apparatus according to claim 1 , wherein the partition wall has a cylindrical or substantially cylindrical shape.
5. The plating apparatus according to claim 1 , wherein the partition wall is made of a mesh.
6. The plating apparatus according to claim 1 , wherein the injector includes a circular line, a pump, and a filter.
7. The plating apparatus according to claim 1 , wherein
the mixer has a truncated cone shape including a top surface and a bottom surface; and
the top surface has a diameter that is larger than a diameter of bottom surface.
8. The plating apparatus according to claim 1 , wherein the cathode includes a metal pipe.
9. The plating apparatus according to claim 1 , wherein the guide includes a truncated cone having a truncated cone shape and disposed below the plating solution passage.
10. The plating apparatus according to claim 1 , wherein
the partition wall includes an upper portion and a lower portion; and
the upper portion and the lower portion do not have liquid permeability.