Capacitor component having secondary phase material contained in external electrode thereof

1. A capacitor component comprising:

a body including a dielectric layer and an internal electrode exposed from an end surface of the body; and

an external electrode disposed on the end surface of the body,

wherein the external electrode comprises:

an electrode layer connected to the internal electrode and disposed on the end surface of the body;

a plating layer disposed on the electrode layer and disposed on the end surface of the body; and

a secondary phase material disposed at a boundary between the plating layer and the electrode layer and disposed on the end surface of the body,

the secondary phase material contains sulfur (S), and

the sulfur (S) is contained in the secondary phase material as a compound with at least one selected from the group consisting of tin (Sn), copper (Cu), nickel (Ni), barium (Ba), aluminum (Al), silicon (Si), and oxygen (O).

2. The capacitor component of claim 1 , wherein the secondary phase material occupies 2 to 50 area % of the boundary between the electrode layer and the plating layer.

3. The capacitor component of claim 1 , wherein the electrode layer includes a conductive metal and a glass.

4. The capacitor component of claim 3 , wherein the conductive metal includes at least one selected from the group consisting of copper (Cu), palladium (Pd), and silver (Ag).

5. The capacitor component of claim 1 , wherein the electrode layer includes a sintered electrode layer, including a conductive metal and a glass, and a conductive resin layer, disposed on the sintered electrode layer, including a conductive metal and a resin.

6. The capacitor component of claim 5 , wherein the conductive metal contained in the sintered electrode layer includes at least one selected from the group consisting of copper (Cu), palladium (Pd), and silver (Ag).

7. The capacitor component of claim 5 , wherein the conductive metal contained in the conductive resin layer includes at least one selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and the resin contained in the conductive resin layer includes an epoxy-based resin.

8. The capacitor component of claim 1 , wherein the plating layer includes a first plating layer and a second plating layer disposed on the first plating layer, and

the first plating layer includes at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), and silver (Ag), and the second plating layer includes tin (Sn).

9. The capacitor component of claim 8 , wherein the electrode layer has a thickness of 1 to 10 micrometers, the first plating layer has a thickness of 1 to 5 micrometers, and the second plating layer has a thickness of 1 to 5 micrometers.

10. The capacitor component of claim 1 , wherein the dielectric layer has a thickness of 0.4 micrometer or less, and the internal electrode has a thickness of 0.4 micrometer or less.

11. The capacitor component of claim 1 , wherein the internal electrode includes first and second internal electrodes,

the body includes a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and cover portions disposed above and below the capacitance forming portion, and

each of the cover portions has a thickness of 20 micrometers or less.

12. The capacitor component of claim 1 , the capacitor component having a length of 0.4 millimeter or less and a width of 0.2 millimeter or less.

13. The capacitor component of claim 1 , wherein the external electrode extends from the end surface of the body onto a side surface of the body connected to the end surface, and

the secondary phase material is disposed also on the side surface of the body.

14. A capacitor component comprising:

a body including a dielectric layer and an internal electrode exposed from an end surface of the body; and

an external electrode disposed on the end surface of the body,

wherein the external electrode comprises:

an electrode layer connected to the internal electrode and disposed on the end surface of the body;

a plating layer disposed on the electrode layer and disposed on the end surface of the body; and

a plurality of first patterns, made of a secondary phase material containing sulfur (S), disposed on the end surface of the body, and disposed between the electrode layer and the plating layer and spaced apart from each other, and

the sulfur (S) is contained in the secondary phase material as a compound with at least one selected from the group consisting of tin (Sn), copper (Cu), nickel (Ni), barium (Ba), aluminum (Al), silicon (Si), and oxygen (O).

15. The capacitor component of claim 14 , wherein the electrode layer includes a conductive metal and a glass.

16. The capacitor component of claim 14 , wherein the electrode layer includes a sintered electrode layer, including a conductive metal and a glass, and a conductive resin layer, disposed on the sintered electrode layer, including a conductive metal and a resin.

17. The capacitor component of claim 14 , wherein the dielectric layer has a thickness of 0.4 micrometer or less, and the internal electrode has a thickness of 0.4 micrometer or less.

18. The capacitor component of claim 14 , wherein the plurality of first patterns are randomly distributed between the electrode layer and the plating layer.

19. The capacitor component of claim 14 , wherein the external electrode extends from the end surface of the body onto a side surface of the body connected to the end surface,

the electrode layer extends from the end surface of the body onto a side surface of the body connected to the end surface;

the plating layer extends from the end surface of the body onto a side surface of the body connected to the end surface; and

the capacitor component further comprises a plurality of second patterns, made of the secondary phase material containing sulfur (S), disposed on the side surface of the body, and disposed between the electrode layer and the plating layer and spaced apart from each other.