Thermo-electric heat pump systems
The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.
1. A thermal protection system, relating to thermally protecting temperature-sensitive goods, comprising:
a vessel configured to contain the temperature sensitive goods;
a stack of at least four thermoelectric unit layers in thermal conduction with the vessel and capable of active use of the Peltier effect, each thermoelectric unit layer having a cold side and a hot side;
an energy source operably connected to each thermoelectric unit layer, wherein the energy source is suitable to provide a current, the stack of at least four thermoelectric unit layers being configured so that each individual thermoelectric unit layer has a ratio of input current to maximum available current (I/Imax) of 0.35 or less at a steady-state, when a change in temperature (ΔT) of the stack of at least four thermoelectric unit layers at opposing ends of the stack of at least four thermoelectric unit layers is about 40° C. and heat removal (Q) is about 0 Watts;
a heat sink thermally connected to the stack of at least four thermoelectric unit layers;
a microcontroller operatively associated with the energy source to direct current from the energy source to the stack of at least four thermoelectric unit layers; and
a plurality of relays configured to electrically connect the at least four thermoelectric unit layers according to at least a first and second mode, wherein at least two of the at least four thermoelectric unit layers are electrically connected in series in the first mode.
2. The thermal protection system of claim 1 , wherein the temperature sensitive goods comprise: embryos, oocytes, cell cultures, tissue cultures, chondrocytes, nucleic acids, bodily fluids, bovine semen, organs, plant tissues, pharmaceuticals, vaccines, and chemicals.
3. The thermal protection system of claim 1 , wherein the heat sink comprises a capacity in a range of 35 to 45 Watts.
4. The thermal protection system of claim 1 , wherein the heat sink and the stack of at least four thermoelectric unit layers are configured such that at steady-state the heat sink has a temperature that does not exceed 30% of a heat sink maximum temperature rating.
5. The thermal protection system of claim 1 , wherein the stack of at least four thermoelectric unit layers is configured to minimize a temperature rise or drop on the heat sink at steady-state so that the temperature rise or drop on the heat sink does not exceed 3° C.
6. The thermal protection system of claim 1 , wherein each thermoelectric unit layer comprises substantially a same size and substantially a same heat pumping capability.
7. The thermal protection system of claim 1 , wherein the stack of at least four thermoelectric unit layers is configured to operate when a temperature outside the stack of at least four thermoelectric unit layers is in a range of −30° C. to 60° C.
8. The thermal protection system of claim 2 , wherein each thermoelectric unit layer comprises at least 127 coupled pairs of thermoelectric units.
9. A thermal protection system, relating to thermally protecting temperature-sensitive goods, comprising:
a vessel configured to contain the temperature sensitive goods;
a stack of at least four thermoelectric unit layers in thermal conduction with the vessel and capable of active use of the Peltier effect, each thermoelectric unit layer having a cold side and a hot side;
an energy source operably connected to each thermoelectric unit layer, wherein the energy source is suitable to provide a current, the stack of at least four thermoelectric unit layers being configured so that each individual thermoelectric unit layer has a ratio of input current to maximum available current (I/Imax) of 0.18 or less at a steady-state, when a change in temperature (ΔT) of the stack of at least four thermoelectric unit layers at opposing ends of the stack of at least four thermoelectric unit layers is about 20° C. and heat removal Q is about 0 Watts;
a heat sink thermally connected to the stack of at least four thermoelectric unit layers;
a microcontroller operatively associated with the energy source to direct current from the energy source to the stack of at least four thermoelectric unit layers; and
a plurality of relays configured to electrically connect the at least four thermoelectric unit layers according to at least a first and second mode, wherein at least two of the at least four thermoelectric unit layers are electrically connected in series in the first mode.
10. The thermal protection system of claim 9 , wherein the temperature sensitive goods comprise: embryos, oocytes, cell cultures, tissue cultures, chondrocytes, nucleic acids, bodily fluids, bovine semen, organs, plant tissues, pharmaceuticals, vaccines, and chemicals.
11. The thermal protection system of claim 9 , wherein the heat sink comprises a capacity in a range of 35 to 45 Watts.
12. The thermal protection system of claim 9 , wherein the heat sink and the stack of at least four thermoelectric unit layers are configured such that at steady-state the heat sink has a temperature that does not exceed 30% of a heat sink maximum temperature rating.
13. The thermal protection system of claim 9 , wherein the stack of at least four thermoelectric unit layers is configured to minimize a temperature rise or drop on the heat sink at steady-state so that the temperature rise or drop on the heat sink does not exceed 3° C.
14. The thermal protection system of claim 9 , wherein each thermoelectric unit layer comprises substantially a same size and substantially a same heat pumping capability.
15. The thermal protection system of claim 9 , wherein each thermoelectric unit layer comprises at least 127 coupled pairs of thermoelectric units.
16. A thermal protection system, relating to thermally protecting temperature-sensitive goods, comprising:
a vessel configured to contain the temperature sensitive goods;
a stack of at least four thermoelectric unit layers in thermal conduction with the vessel and capable of active use of the Peltier effect, each thermoelectric unit layer having a cold side and a hot side;
an energy source operably connected to each thermoelectric unit layer, wherein the energy source is suitable to provide a current such that a ratio of input current to a maximum available current (I/Imax) of each individual thermoelectric unit layer is 0.35 or less at steady-state;
a microcontroller operatively associated with the energy source to direct current from the energy source to the stack of at least four thermoelectric unit layers; and
a plurality of relays configured to electrically connect the at least four thermoelectric unit layers according to at least a first and second mode, wherein at least two of the at least four thermoelectric unit layers are electrically connected in series in the first mode.
17. The thermal protection system of claim 16 , wherein at least two of the at least four thermoelectric unit layers are electrically connected in parallel in the second mode.
18. The thermal protection system of claim 16 , wherein each thermoelectric unit layer comprises substantially a same size and substantially a same heat pumping capability.
19. The thermal protection system of claim 16 , wherein the energy source is suitable to provide the current such that when a change in temperature (ΔT) between opposing ends of the stack of at least four thermoelectric unit layers is less than or equal to about 40° C. at a steady-state, the heat removal (Q) is about 0 Watts.