Semiconductor arrangements and methods of manufacturing the same

1. A semiconductor arrangement, comprising:

a substrate comprising a base substrate, a first semiconductor layer disposed on the base substrate, and a second semiconductor layer disposed on the first semiconductor layer;

a first fin structure and a second fin structure formed on the substrate and extending in the same straight line, each of the first fin structure and the second fin structure comprising at least portions of the second semiconductor layer;

a first isolation part formed around the first fin structure and the second fin structure on opposite sides of the straight line;

a first Fin Field Effect Transistor (FinFET) formed on the substrate based on the first fin structure and a second FinFET formed on the substrate based on the second fin structure, wherein the first FinFET comprises a first gate stack formed on the first isolation part and intersecting the first fin structure, and the second FinFET comprises a second gate stack formed on the first isolation part and intersecting the second fin structure; and

a second isolation part between the first fin structure and the second fin structure and intersecting the first fin structure and the second fin structure to isolate the first fin structure and the second fin structure from each other, wherein the second isolation part extends in parallel with at least one of the first gate stack and the second gate stack.

2. The semiconductor arrangement of claim 1 , wherein the first isolation part has a top surface below a top surface of the second semiconductor layer or below a bottom surface of the second semiconductor layer.

3. The semiconductor arrangement of claim 1 , wherein in a vertical section taken along the straight line, the second isolation part comprises an upper portion and a lower portion which is expanded with respect to a bottom end of the upper portion.

4. The semiconductor arrangement of claim 3 , wherein in the vertical section, the upper portion of the second isolation part has a top end expanded with respect to the bottom end thereof.

5. The semiconductor arrangement of claim 4 , further comprising:

a third isolation part extending along the first fin structure under the portion of the second semiconductor layer in the first fin structure and/or a fourth isolation part extending along the second fin structure under the portion of the second semiconductor layer in the second fin structure.

6. The semiconductor arrangement of claim 5 , wherein the third isolation part and the fourth isolation part have respective top surfaces coplanar with the step.

7. The semiconductor arrangement of claim 3 , wherein the lower portion of the second isolation part forms a step with respect to the bottom end of the upper portion, wherein the step is coplanar with a bottom surface of the second semiconductor layer.

8. The semiconductor arrangement of claim 3 , wherein the second isolation part penetrates the second semiconductor layer downwards, wherein a portion of the second isolation part directly under the first fin structure has a top surface abutting a bottom surface of the second semiconductor layer, and a portion of the second isolation part directly under the second fin structure has a top surface abutting the bottom surface of the second semiconductor layer.

9. The semiconductor arrangement of claim 3 , wherein in a direction in which the straight line extends, a portion of the second isolation part directly under the first fin structure extends to a position of a source/drain region of the first FinFET, and a portion of the second isolation part directly under the second fin structure extends to a position of a source/drain region of the second FinFET.

10. The semiconductor arrangement of claim 9 , further comprising:

a further semiconductor layer which is at least partially embedded into a corresponding one of the fin structures on respective opposite sides of the first gate stack and/or the second gate stack, wherein the first FinFET and/or the second FinFET comprise respective source/drain regions at least partially formed in the further semiconductor layer,

wherein the further semiconductor layer of at least one of the first FinFET and the second FinFET has a stack structure.

11. The semiconductor arrangement of claim 3 , further comprising:

a third isolation part extending along the first fin structure under the portion of the second semiconductor layer in the first fin structure and/or a fourth isolation part extending along the second fin structure under the portion of the second semiconductor layer in the second fin structure.

12. The semiconductor arrangement of claim 11 , wherein

in the vertical section taken along the straight line, the third isolation part is centrically aligned with the first gate stack in a vertical direction; and/or

in the vertical section taken along the straight line, the fourth isolation part is centrically aligned with the second gate stack in the vertical direction.

13. The semiconductor arrangement of claim 11 , wherein

a top surface of the third isolation part abuts a bottom surface of the portion of the second semiconductor layer in the first fin structure; and/or

a top surface of the fourth isolation part abuts a bottom surface of the portion of the second semiconductor layer in the second fin structure.

14. The semiconductor arrangement of claim 11 , wherein

the third isolation part extends to positions of source/drain regions of the first FinFET in a direction in which the straight line extends; and/or

the fourth isolation part extends to positions of source/drain regions of the second FinFET in the direction in which the straight line extends.

15. The semiconductor arrangement of claim 3 , wherein in the vertical section taken along the straight line, the lower portion and the upper portion of the second isolation part are centrically aligned in a vertical direction.

16. The semiconductor arrangement of claim 15 , further comprising:

a first spacer on sidewalls of the first gate stack;

a second spacer on sidewalls of the second gate stack; and

a dummy spacer between the first spacer and the second spacer, wherein the second isolation part is self-aligned to a space defined by the dummy spacer.

17. The semiconductor arrangement of claim 3 , further comprising an insulating thin layer formed at least on sidewalls of the upper portion of the second isolation part.

18. The semiconductor arrangement of claim 1 , further comprising an insulating thin layer formed at least on a part of sidewalls of the second isolation part.

19. An electronic device, comprising the semiconductor arrangement according to claim 1 .

20. The electronic device according to claim 19 , wherein the electronic device comprises a smart phone, a computer, a tablet, an artificial intelligence device, a wearable device, or a mobile power supply.

21. A semiconductor arrangement, comprising:

a substrate;

a first fin structure and a second fin structure formed on the substrate and extending in the same straight line;

a first isolation part formed on the substrate and around the first fin structure and the second fin structure on opposite sides of the straight line;

a first Fin Field Effect Transistor (FinFET) formed on the substrate based on the first fin structure and a second FinFET formed on the substrate based on the second fin structure, wherein the first FinFET comprises a first gate stack formed on the first isolation part and intersecting the first fin structure, and the second FinFET comprises a second gate stack formed on the first isolation part and intersecting the second fin structure; and

a second isolation part between the first fin structure and the second fin structure and intersecting the first fin structure and the second fin structure to isolate the first fin structure and the second fin structure from each other, wherein the second isolation part extends in parallel with at least one of the first gate stack and the second gate stack, and the second isolation part has a lower portion expanded with respect to an upper portion thereof,

wherein in a vertical section taken along the straight line, the lower portion and the upper portion of the second isolation part are centrically aligned in a vertical direction.

22. The semiconductor arrangement of claim 21 , wherein the lower portion of the second isolation part has a hollow structure.

23. The semiconductor arrangement of claim 21 , wherein the second isolation part has an insulating thin layer at least on sidewalls of the upper portion thereof.

24. The semiconductor arrangement of claim 21 , further comprising:

a first spacer on sidewalls of the first gate stack;

a second spacer on sidewalls of the second gate stack; and

a dummy spacer between the first spacer and the second spacer, wherein the second isolation part is self-aligned to a space defined by the dummy spacer.

25. The semiconductor arrangement of claim 24 , wherein the lower portion of the second isolation part is substantially centrically aligned with respect to the space defined by the dummy spacer.

26. The semiconductor arrangement of claim 24 , wherein in a top view, the lower portion of the second isolation part is symmetrical with respect to a longitudinally extending line of the space defined by the dummy spacer.

27. The semiconductor arrangement of claim 24 , wherein the first gate stack and the second gate stack are recessed with respect to the first gate spacer and the second gate spacer respectively, and the semiconductor arrangement further comprises dielectric layers disposed on top of the first gate stack and the second gate stack inside the first gate spacer and the second gate spacer, respectively.

28. The semiconductor arrangement of claim 21 , further comprising:

a further semiconductor layer which is at least partially embedded into a corresponding one of the fin structures on respective opposite sides of the first gate stack and/or the second gate stack, wherein the first FinFET and/or the second FinFET comprise respective source/drain regions at least partially formed in the further semiconductor layer.