Carrier structure and micro device structure
A carrier structure suitable for transferring or supporting a plurality of micro devices including a carrier and a plurality of transfer units is provided. The transfer units are disposed on the carrier. Each of the transfer units includes a plurality of transfer parts. Each of the transfer parts has a transfer surface. Each of the micro devices has a device surface. The transfer surfaces of the transfer parts of each of the transfer units are connected to the device surface of corresponding micro device. The area of each of the transfer surfaces is smaller than the area of the device surface of the corresponding micro device. A micro device structure using the carrier structure is also provided.
1. A micro device structure, comprising:
a carrier structure, comprising:
a carrier; and
a plurality of transfer units disposed on the carrier, wherein each of the transfer units comprises a plurality of transfer parts, the transfer parts include an electrical insulation material, and each of the transfer parts has a transfer surface; and
a plurality of micro devices, wherein each of the micro devices has a device surface, each of the transfer units is located between the carrier and one of the micro devices, the plurality of transfer surfaces of the transfer parts of each of the transfer units are temporarily connected to the device surface of one of the micro devices for transferring the micro device onto a target substrate, and an area of each of the transfer surfaces is smaller than an area of the device surface of one of the micro devices,
wherein the carrier has a carrier surface and a plurality of grooves, the grooves are located on the carrier surface of the carrier, and the transfer parts are respectively disposed in the grooves.
2. The micro device structure of claim 1 , wherein a ratio of the area of each of the transfer surfaces to the area of the device surface of the corresponding micro device is between 0.2 and 0.8.
3. The micro device structure of claim 1 , wherein a Young's modulus of each of the transfer parts is less than a Young's modulus of the carrier and a Young's modulus of the corresponding micro device.
4. The micro device structure of claim 1 , wherein an overlapped area of the transfer surface of one of the transfer parts of each of the transfer units and the device surface of the corresponding micro device is greater than an overlapped area of the transfer surface of another transfer part and the device surface of the corresponding micro device.
5. The micro device structure of claim 1 , wherein an orthographic projection of the transfer parts of each of the transfer units on the carrier is defined as a transfer region, and a ratio of the area of the transfer region to the area of the device surface of the corresponding micro device is greater than or equal to 0.5 and less than or equal to 1.5.
6. The micro device structure of claim 1 , wherein any two adjacent transfer units have a first spacing, any two adjacent micro devices have a second spacing, and a ratio of the first spacing to the second spacing is between 0.5 and 1.5.
7. The micro device structure of claim 6 , wherein a ratio of the first spacing to a width of each of the micro devices is less than or equal to 0.5.
8. The micro device structure of claim 1 , wherein the transfer surface of each of the transfer parts is aligned with the carrier surface.
9. The micro device structure of claim 1 , wherein the transfer surface of each of the transfer parts is protruded from the carrier surface.
10. The micro device structure of claim 9 , wherein a ratio of a height of the transfer part protruded from the carrier surface to a height of the transfer part is less than or equal to 0.8.
11. The micro device structure of claim 1 , wherein each of the transfer parts further has a connection surface connected to the carrier, and a roughness of each of the transfer surfaces is greater than a roughness of the corresponding connection surface.
12. The micro device structure of claim 1 , wherein each of the transfer units has at least one housing space, and the transfer parts of each of the transfer units surround at least one corresponding housing space.
13. The micro device structure of claim 12 , wherein the transfer units are connected to one another.
14. The micro device structure of claim 1 , wherein there is a gap between any two of the transfer parts.
15. The micro device structure of claim 1 , wherein there is a gap between the carrier and each of the micro devices.
16. The micro device structure of claim 1 , wherein each of the device surface is connected with a plurality of the transfer surfaces.
17. The micro device structure of claim 1 , wherein each of the micro devices connects to the carrier structure only with the device surface thereof, and each of the device surfaces is parallel to the transfer surface.
18. A carrier structure suitable for transferring or supporting a plurality of micro devices, the carrier structure comprising:
a carrier; and
a plurality of transfer units disposed on the carrier, wherein each of the transfer units comprises a plurality of transfer parts, the transfer parts include an electrical insulation material, and each of the transfer parts has a transfer surface, wherein each of the micro devices has a device surface, each of the transfer units is located between the carrier and one of the micro devices, the plurality of transfer surfaces of the transfer parts of each of the transfer units are temporarily connected to the device surface of one of the micro devices for transferring the micro device onto a target substrate, and an area of each of the transfer surfaces is smaller than an area of the device surface of one of the micro devices,
wherein the carrier has a carrier surface and a plurality of grooves, the grooves are located on the carrier surface of the carrier, and the transfer parts are respectively disposed in the grooves.
19. The carrier structure of claim 18 , wherein the transfer surface of each of the transfer parts is aligned with the carrier surface.
20. The carrier structure of claim 18 , wherein the transfer surface of each of the transfer parts is protruded from the carrier surface.
21. The carrier structure of claim 20 , wherein a ratio of a height of the transfer part protruded from the carrier surface to a height of the transfer part is less than or equal to 0.8.
22. The carrier structure of claim 18 , wherein each of the transfer parts further has a connection surface connected to the carrier, and a roughness of each of the transfer surfaces is greater than a roughness of the corresponding connection surface.
23. The carrier structure of claim 18 , wherein each of the transfer units has at least one housing space, and the transfer parts of each of the transfer units surround at least one corresponding housing space.
24. The carrier structure of claim 23 , wherein the transfer units are connected to one another.
25. The carrier structure of claim 18 , wherein there is a gap between any two of the transfer parts.
26. The carrier structure of claim 18 , wherein each of the micro devices connects to the carrier structure only with the device surface thereof, and each of the device surfaces is parallel to the transfer surface.