IP Library Granted Patent US 11,631,515
Granted Patent B2
US 11,631,515 · App. 16/224,953 · Granted Apr 18, 2023

Filter device and multiplexer

Inventor: Takao Mukai (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01F17/0013H01F27/292H03H7/1766H03H9/0004H03H9/0542H03H9/0557H03H9/0566H03H9/6483H03H9/725
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Quick Facts
Patent No.
US 11,631,515
App. No.
16/224,953
Granted
Apr 18, 2023
Kind
B2
Abstract

A filter device includes a first filter including series resonators and parallel resonators, a first inductor connected in parallel between a first terminal and the first filter, a second inductor provided in series between the first filter and a second terminal, and a third inductor provided in series in a channel connecting the parallel resonator and ground, the third inductor is incorporated in a multilayer substrate, the first filter is mounted on a main surface of the multilayer substrate and incorporated in a filter chip, and the first inductor and the second inductor are chip inductors including coil conductors and are mounted on the main surface of the multilayer substrate beside the filter chip so as to be adjacent to each other and such that coil axes thereof are orthogonal or substantially orthogonal to each other.

Claims (57)

1. A filter device comprising:

a first terminal and a second terminal;

a ladder first filter provided on a first channel connecting the first terminal and the second terminal and including a series resonator and a parallel resonator;

a first inductor connected in parallel to the first channel between the first terminal and the first filter;

a second inductor provided in series in the first channel between the first filter and the second terminal; and

a third inductor provided in series in a channel connecting the parallel resonator and ground; wherein

the third inductor is incorporated in a multilayer substrate that includes a plurality of base layers;

the first filter is mounted on a main surface of the multilayer substrate and incorporated in a filter chip;

the first inductor and the second inductor are chip inductors including coil conductors, and are respectively mounted on the main surface of the multilayer substrate beside the filter chip so as to be adjacent to each other and such that coil axes of the first inductor and the second inductor are orthogonal or substantially orthogonal to each other;

the first inductor and the second inductor are mounted on the multilayer substrate such that one of the coil axes is orthogonal or substantially orthogonal to the main surface of the multilayer substrate; and

the third inductor is a coil conductor pattern and is incorporated in the multilayer substrate such that a coil axis of the third inductor is orthogonal or substantially orthogonal to the main surface of the multilayer substrate.

2. The filter device according to claim 1 , wherein the plurality of base layers are ceramic base layers or resin base layers.

3. A multiplexer comprising:

the filter device according to claim 1 ;

a third terminal; and

a second filter provided on a second channel connecting the first terminal and the third terminal.

4. The multiplexer according to claim 3 , wherein a coupling coefficient between one of the first inductor or the second inductor and the third inductor is equal to or greater than about 0.006 and equal to or less than about 0.042.

5. The multiplexer according to claim 3 , wherein

the first filter includes another parallel resonator different from the parallel resonator connected to the third inductor;

a fourth inductor is provided in series in another channel connecting the another parallel resonator and ground; and

the fourth inductor is incorporated in the multilayer substrate.

6. The multiplexer according to claim 5 , wherein

the first inductor and the second inductor are mounted on the multilayer substrate such that one of the coil axes is orthogonal or substantially orthogonal to the main surface of the multilayer substrate; and

the fourth inductor is a coil conductor pattern and is incorporated in the multilayer substrate such that a coil axis of the fourth inductor is orthogonal or substantially orthogonal to the main surface of the multilayer substrate.

7. The multiplexer according to claim 5 , wherein a coupling coefficient between one of the first inductor or the second inductor and the fourth inductor is equal to or greater than about 0.006 and equal to or less than about 0.042.

8. The multiplexer according to claim 3 , wherein the filter device is an unbalanced filter.

9. The multiplexer according to claim 3 , wherein the filter device is a ladder filter.

10. The multiplexer according to claim 3 , wherein the filter device and the second filter are commonly connected to each other at a connection point.

11. The multiplexer according to claim 3 , wherein the second filter is a balanced filter.

12. The multiplexer according to claim 3 , wherein the second filter includes an elastic wave resonator and longitudinally coupled resonator elastic wave filter portions.

13. The multiplexer according to claim 3 , wherein the plurality of base layers are ceramic base layers or resin base layers.

14. A filter device comprising:

a first terminal and a second terminal;

a ladder first filter provided on a first channel connecting the first terminal and the second terminal and including a series resonator and a parallel resonator;

a first inductor connected in parallel to the first channel between the first terminal and the first filter;

a second inductor provided in series in the first channel between the first filter and the second terminal; and

a third inductor provided in series in a channel connecting the parallel resonator and ground; wherein

the third inductor is incorporated in a multilayer substrate that includes a plurality of base layers;

the first filter is mounted on a main surface of the multilayer substrate and incorporated in a filter chip;

the first inductor and the second inductor are chip inductors including coil conductors, and are respectively mounted on the main surface of the multilayer substrate beside the filter chip so as to be adjacent to each other and such that coil axes of the first inductor and the second inductor are orthogonal or substantially orthogonal to each other; and

a coupling coefficient between one of the first inductor or the second inductor and the third inductor is equal to or greater than about 0.006 and equal to or less than about 0.042.

15. A filter device comprising:

a first terminal and a second terminal;

a ladder first filter provided on a first channel connecting the first terminal and the second terminal and including a series resonator and a parallel resonator;

a first inductor connected in parallel to the first channel between the first terminal and the first filter;

a second inductor provided in series in the first channel between the first filter and the second terminal; and

a third inductor provided in series in a channel connecting the parallel resonator and ground; wherein

the third inductor is incorporated in a multilayer substrate that includes a plurality of base layers;

the first filter is mounted on a main surface of the multilayer substrate and incorporated in a filter chip;

the first inductor and the second inductor are chip inductors including coil conductors, and are respectively mounted on the main surface of the multilayer substrate beside the filter chip so as to be adjacent to each other and such that coil axes of the first inductor and the second inductor are orthogonal or substantially orthogonal to each other;

the first filter includes another parallel resonator different from the parallel resonator connected to the third inductor;

a fourth inductor is provided in series in another channel connecting the another parallel resonator and ground; and

the fourth inductor is incorporated in the multilayer substrate.

16. The filter device according to claim 15 , wherein

the first inductor and the second inductor are mounted on the multilayer substrate such that one of the coil axes is orthogonal or substantially orthogonal to the main surface of the multilayer substrate; and

the fourth inductor is a coil conductor pattern and is incorporated in the multilayer substrate such that a coil axis of the fourth inductor is orthogonal or substantially orthogonal to the main surface of the multilayer substrate.

17. The filter device according to claim 15 , wherein a coupling coefficient between one of the first inductor or the second inductor and the fourth inductor is equal to or greater than about 0.006 and equal to or less than about 0.042.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2019
From: WEINRIB, BEN, MR.; ELLIS, CHRISTIAN, MR.
To: ALTERNATIVE BALLISTICS, LP
Reel/Frame 049923/0224 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2018
From: MUKAI, TAKAO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 047814/0038 →
Priority Claims (1)
JP JP2016-126850 · Jun 27, 2016 · national
Continuity (2)
Continuation PCTJP2017020134 · May 30, 2017
Related Publication 20190131051A1 · May 2, 2019