Memory device and microelectronic package having the same
The invention provides a memory device and microelectronic package having the same. The microelectronic package comprises at least one memory device which is adapted to be stacked vertically with one another, and a processing device stacked vertically and adjacently with the at least one memory device and electrically connected to the conductive interconnects. Each of the memory devices comprises a substrate and a plurality of memory units. The substrate presents a front surface and a back surface. The memory units are formed on the front surface, each of which comprises a plurality of memory cells and a plurality of conductive interconnects electrically connected to the memory cells. In each of the memory units, the conductive interconnects contribute to a plurality of signal channels each of which is dedicated to transmit signals from the processing device to one of the memory units and vice versa.
1. A memory device, adapted to be stacked vertically with a processing device, comprising:
a substrate, presenting a front surface and a back surface; and
a plurality of memory units, formed on the front surface, each of which comprises a plurality of memory cells and a plurality of conductive interconnects electrically connected to the memory cells;
wherein in each of the memory units, the conductive interconnects contribute to a plurality of signal channels each of which is dedicated to transmit signals from an external interface to one of the memory units and vice versa.
2. The memory device according to claim 1 , wherein the conductive interconnects comprise a plurality of conductive contacts extending to the front surface of the substrate.
3. The memory device according to claim 2 , wherein the conductive interconnects comprise a plurality of through silicon vias extending to the back surface of the substrate.
4. The memory device according to claim 1 , wherein the memory device are adapted to wafer-to-wafer bonding.
5. The memory device according to claim 1 , wherein a bandwidth density ratio of 2 GBps/64 Mb or greater is presented.
6. The memory device according to claim 1 , wherein at least one of the memory units is served as redundant spare and operated for replacing a failure of another one of the memory units.
7. The memory device according to claim 6 , further comprising a failure indication unit to indicate the failure.
8. The memory device according to claim 7 , wherein the failure indication unit comprises a data storage space storing an address in relation to the failure.
9. The memory device according to claim 1 , wherein the memory units are divided by a plurality of scribelines and adapted to operate for providing a variable memory size which is an integer multiple of a unit size of the memory units.
10. The memory device according to claim 1 , wherein a plurality of power supply decoupling caps are placed within the scribelines.
11. The memory device according to claim 1 , wherein each of the memory units further comprises a decoder circuit and a local sensing amplifier.
12. A microelectronic package, comprising:
at least one memory device, adapted to be stacked vertically with one another, each of the at least one memory device comprising:
a substrate, presenting a front surface and a back surface; and
a plurality of memory units formed on the front surface, each of which comprises a plurality of memory cells and a plurality of conductive interconnects electrically connected to the memory cells;
a processing device, stacked vertically with the at least one memory device and electrically connected to the conductive interconnects;
wherein in each of the memory units, the conductive interconnects contribute to a plurality of signal channels each of which is dedicated to transmit signals from the processing device to one of the memory units and vice versa.
13. The microelectronic package according to claim 12 , wherein the conductive interconnects comprise a plurality of conductive contacts extending to the front surface of the substrate.
14. The microelectronic package according to claim 13 , wherein the conductive interconnects comprise a plurality of through silicon vias extending to the back surface of the substrate.
15. The microelectronic package according to claim 12 , wherein each of the signal channels is dedicated to transmit signals from the processing device to a vertical group of the memory units, comprising a plurality of the memory units overlapped along a vertical direction.
16. The microelectronic package according to claim 12 , wherein the memory device are adapted to wafer-to-wafer bonding or chip-on-wafer bonding.
17. The microelectronic package according to claim 12 , wherein the memory device and the processing device are front-to-back stacking.
18. The microelectronic package according to claim 12 , wherein the memory device and the processing device are front-to-front stacking.
19. The microelectronic package according to claim 12 , wherein a bandwidth density ratio of 2 GBps/64 Mb or greater is presented.
20. The microelectronic package according to claim 12 , wherein at least one of the memory units is served as redundant spare and operated for replacing a failure of another one of the memory units.
21. The microelectronic package according to claim 20 , wherein at least one of the memory device and the processing device further comprises a failure indication unit indicating the failure.
22. The microelectronic package according to claim 21 , wherein the failure indication unit comprises a data storage space storing an address in relation to the failure and a redundancy repair circuit performing redundancy replacement.
23. The microelectronic package according to claim 12 , wherein the memory units are divided by a plurality of scribelines and adapted to operate for providing a variable memory size which is an integer multiple of a unit size of the memory units.
24. The microelectronic package according to claim 12 , wherein a plurality of power supply decoupling caps are placed within the scribelines.
25. The microelectronic package according to claim 12 , wherein each of the memory units further comprises a decoder circuit and a local sensing amplifier.
26. The microelectronic package according to claim 12 , wherein the processing device further comprises a memory power supply.
27. The microelectronic package according to claim 12 , wherein the processing device further comprises neuro network artificial intelligence circuitry.