Electronic package
View Patent ↗An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.
1. An electronic package, comprising:
a first substrate including a first wiring layer and a first antenna portion electrically insulated from the first wiring layer;
a second substrate stacked on the first substrate and including a second wiring layer and a second antenna portion electrically insulated from the second wiring layer, wherein the first antenna portion and the second antenna portion are provided within a projected space of an active zone formed between the first substrate and the second substrate to allow inductive coupling between the first antenna portion and the second antenna portion, and wherein the second substrate includes a ground layer and an antenna feed line connecting the second antenna portion with the ground layer; and
an antenna component provided between the first substrate and the second substrate and attaching the first substrate to the second substrate, wherein the antenna component is provided within the active zone and is free from being electrically connected to the first wiring layer and the second wiring layer.
2. The electronic package of claim 1 , wherein an area between the first substrate and the second substrate is defined with the active zone and a conducting zone sequentially outward from a center thereof.
3. The electronic package of claim 2 , wherein the conducting zone is provided with a plurality of conductive elements configured for electrically connecting the first wiring layer and the second wiring layer.
4. The electronic package of claim 3 , wherein the conductive elements are free from being electrically connected with the first antenna portion and the second antenna portion.
5. The electronic package of claim 1 , wherein the antenna component is made of a material including metal.
6. The electronic package of claim 1 , wherein the antenna component is in a form of a bump.
7. The electronic package of claim 1 , wherein the first substrate includes an antenna trace provided in the active zone and connected with the antenna component.
8. The electronic package of claim 7 , wherein the antenna component and the antenna trace constitute a daisy chain structure or a resonator.
9. The electronic package of claim 1 , wherein the second substrate includes an antenna trace provided in the active zone and connected with the antenna component.
10. The electronic package of claim 9 , wherein the antenna component and the antenna trace constitute a daisy chain structure or a resonator.
11. The electronic package of claim 1 , further comprising an electronic component provided on the second substrate.
12. The electronic package of claim 1 , wherein the first substrate is an antenna board, and the second substrate is a wiring board.