IP Library Granted Patent US 11,084,190
Granted Patent B2
US 11,084,190 · App. 16/234,300 · Granted Aug 10, 2021

Foreign material cleaning system for compression molding

Inventor: Kean Tat Koh (Singapore, SG)
Assignee: Micron Technology, Inc.
B29C33/72B08B7/0028B29C43/32B29L2031/34
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,084,190
App. No.
16/234,300
Granted
Aug 10, 2021
Kind
B2
Abstract

The present technology relates to systems and methods for cleaning a compression molding system. In particular, a system including a first roller carrying a cleaning tape is provided. The system further includes a second roller configured to dispense the cleaning tape along a compression molding structure. The tape is removably adhered to the structure and subsequently removed, thereby removing foreign debris such as dust and/or other particles from the compression molding structure.

Claims (34)

1. A system for cleaning a compression molding structure, the system comprising:

a loading roller configured to carry and dispense a cleaning tape;

an unloading roller configured to attach to a first region of the cleaning tape and to move in a first direction from a first position adjacent to a first end portion of the compression molding structure to a second position adjacent to a second end portion of the compression molding structure, wherein moving from the first position to the second position dispenses the cleaning tape between the first end portion and the second end portion;

a vacuum support tube configured to releasably secure a second region of the dispensed cleaning tape adjacent to the first end portion; and

an attachment roller configured to apply pressure to at least a segment of the dispensed cleaning tape to removably adhere the segment to the compression molding structure.

2. The system of claim 1 , wherein the unloading roller is further configured to move from the second position to a third position closer to the compression molding structure and releasably secure the first region of the cleaning tape in a second fixed position.

3. The system of claim 2 , wherein, when the unloading roller is in the third position, the loading roller is tensioned to prevent the cleaning tape from being further dispensed.

4. The system of claim 1 , wherein the attachment roller is configured to removably adhere at least the segment of the dispensed cleaning tape to the compression molding structure by pressing a sticky surface of the dispensed cleaning tape against at least a portion of the compression molding structure.

5. The system of claim 1 , wherein the unloading roller is further configured to move in a second direction, and wherein moving in the second direction removes the dispensed cleaning tape removably adhered to the compression molding structure.

6. The system of claim 5 , wherein, when moving in the second direction, the unloading roller is configured to rotate such that at least a portion of the dispensed cleaning tape is wound around the unloading roller.

7. The system of claim 5 , wherein removing the dispensed cleaning tape from the compression molding structure removes debris attached to the compression molding structure.

8. The system of claim 5 , wherein the unloading roller is further configured to return to the first position and the vacuum support tube is further configured to release the releasably secured second region of the cleaning tape.

9. The system of claim 1 , wherein the loading roller has a first tension gauge and the unloading roller has a second tension gauge, and wherein the first and second tension gauges are configured to detect an abnormality during operation of the system.

10. The system of claim 1 , further comprising a support roller configured to position the dispensed cleaning tape adjacent to the first end portion.

11. A method for cleaning a compression molding structure, the method comprising:

providing a loading roller carrying a cleaning tape;

moving an unloading roller attached to a first region of the cleaning tape from a first position adjacent to a first end portion of the compression molding structure to a second position adjacent to a second end portion of the compression molding structure, wherein moving the unloading roller from the first position to the second position dispenses a segment of the cleaning tape along a length of the compression molding structure;

releasably securing a second region of the dispensed cleaning tape adjacent to the first end portion using a vacuum support tube;

removably adhering the segment of the cleaning tape to the compression molding structure by applying pressure to the segment with an attachment roller; and

removing the segment of cleaning tape removably adhered to the compression molding structure by moving the unloading roller from the second position towards the first position.

12. The method of claim 11 , wherein the segment of the cleaning tape is removably adhered to the compression molding structure by the unloading roller as the unloading roller moves from the first position to the second position.

13. The method of claim 11 , wherein the attachment roller moves along a first surface of the segment of the cleaning tape such that the attachment roller presses a second sticky surface of the cleaning tape against the compression molding structure.

14. The method of claim 11 , wherein moving the unloading roller from the second position towards the first position comprises rotating the unloading roller such that at least a portion of the segment of cleaning tape removed from the compression molding system is wound around the unloading roller.

15. A method for cleaning a compression molding structure, the method comprising:

providing a loading roller carrying a cleaning tape;

moving an unloading roller attached to a first region of the cleaning tape from a first position adjacent to a first end portion of the compression molding structure to a second position adjacent to a second end portion of the compression molding structure, wherein moving the unloading roller from the first position to the second position places a segment of the cleaning tape along a length of the compression molding structure;

releasably securing a second region of the cleaning tape adjacent to the first end portion using a vacuum support tube;

releasably securing the first region of the cleaning tape adjacent to the second end portion;

removably adhering the segment of the cleaning tape to the compression molding structure by applying pressure to the segment with an attachment roller; and

removing the segment of the cleaning tape removably adhered to the compression molding structure by moving the unloading roller from the second position towards the first position.

16. The method of claim 15 , wherein the first region of the cleaning tape is releasably secured adjacent to the second end portion of the compression molding structure by the unloading roller.

17. The method of claim 16 , further comprising releasing the second region of the cleaning tape releasably secured by the vacuum support tube.

18. The method of claim 15 , wherein the attachment roller removably adheres the segment of the cleaning tape to the compression molding structure by pressing a sticky surface of the cleaning tape against the compression molding structure.

19. The method of claim 15 , wherein removing the segment of cleaning tape removably adhered to the compression molding structure removes foreign debris attached to the compression molding structure.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
SUPPLEMENT NO. 12 TO PATENT SECURITY AGREEMENT Recorded Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2018
From: KOH, KEAN TAT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 049038/0376 →