Polyamide resin composition and molded article comprising the same
A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.
1. A polyamide resin composition comprising:
about 40 wt % to about 49 wt % of an aromatic polyamide resin comprising a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2:
wherein R 1 and R 3 are the same or different and are each independently a C 1 to C 6 hydrocarbon group or a halogen atom; R 2 and R 4 are the same or different and are each independently a C 6 to C 12 linear or branched alkylene group; and n 1 and n 2 are the same or different and are each independently an integer of 0 to 4;
about 4 wt % to about 12 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.;
about 5 wt % to about 15 wt % of an olefin-based copolymer; and
about 35 wt % to about 45 wt % of calcium carbonate,
wherein a weight ratio of the aromatic polyamide resin to the polyamide resin having a glass transition temperature of about 40° C. to about 120° C. ranges from about 4:1 to about 10:1, and
wherein the polyamide resin composition has a plating adhesive strength of about 13 N/cm to about 30 N/cm, as measured on an injection-molded specimen plated with a 30 μm thick chromium layer and having a size of 10 cm×10 cm×3.2 mm at a peeling rate of 50 mm/min using a tensile tester in accordance with JIS C6481.
2. The polyamide resin composition according to claim 1 , wherein the aromatic polyamide resin comprises about 60 mol % to about 80 mol % of the repeat unit represented by Formula 1 and about 20 mol % to about 40 mol % of the repeat unit represented by Formula 2.
3. The polyamide resin composition according to claim 1 , wherein the aromatic polyamide resin has a glass transition temperature of about 130° C. to about 150° C.
4. The polyamide resin composition according to claim 1 , wherein the polyamide resin having a glass transition temperature of about 40° C. to about 120° C. comprises an aliphatic polyamide resin, an amorphous polyamide resin, and/or an aromatic polyamide resin comprising an aliphatic dicarboxylic acid unit.
5. The polyamide resin composition according to claim 4 , wherein the aliphatic polyamide resin comprises polyamide 6, polyamide 11, polyamide 12, polyamide 46, polyamide 66, polyamide 610, polyamide 612, polyamide 1010, polyamide 1012, and/or polyamide 1212.
6. The polyamide resin composition according to claim 1 , wherein the olefin-based copolymer comprises an ethylene-α-olefin copolymer; and/or a modified ethylene-α-olefin copolymer obtained by graft polymerization of an α,β-unsaturated dicarboxylic acid and/or an α,β-unsaturated dicarboxylic acid derivative to the ethylene-α-olefin copolymer.
7. The polyamide resin composition according to claim 6 , wherein the α,β-unsaturated dicarboxylic acid and/or the α,β-unsaturated dicarboxylic acid derivative comprises maleic acid, maleic anhydride, maleic hydrazide, dichloromaleic anhydride, and/or fumaric acid.
8. The polyamide resin composition according to claim 1 , wherein the olefin-based copolymer comprises a maleic anhydride modified ethylene-octene copolymer.
9. The polyamide resin composition according to claim 1 , wherein the polyamide resin composition has a notched Izod impact strength of about 4 kgf cm/cm to about 12 kgf cm/cm, as measured on a ⅛″ thick specimen in accordance with ASTM D256.
10. The polyamide resin composition according to claim 1 , wherein the polyamide resin composition has a heat deflection temperature (HDT) of about 100° C. to about 150° C., as measured under a load of 18.56 kgf/cm 2 at a heating rate of 120° C./hr in accordance with ASTM D648.
11. A molded article comprising:
a base layer; and
a plating layer formed on at least one surface of the base layer,
wherein the base layer is formed of the polyamide resin composition according to claim 1 .
12. The polyamide resin composition according to claim 1 , the calcium carbonate having an average particle diameter D50 (a diameter at a distribution rate of 50%) of about 0.05 nm to about 6 μm, as measured using a particle size analyzer.
13. The polyamide resin composition according to claim 1 , the polyamide resin composition having a heat deflection temperature (HDT) of about 115° C. to about 135° C., as measured under a load of 18.56 kgf/cm 2 at a heating rate of 120° C./hr in accordance with ASTM D648.