Nanowire stack GAA device with inner spacer and methods for producing the same
A nanowire FET device includes a vertical stack of nanowire strips configured as the semiconductor body. One or more of the top nanowire strips are receded and are shorter than the rest of the nanowire strips stacked lower. Inner spacers are uniformly formed adjacent to the receded nanowire strips and the rest of the nanowire strips. Source/drain structures are formed outside the inner spacers and a gate structure is formed inside the inner spacers, which wraps around the nanowire strips.
1. A device, comprising:
a substrate;
a stack of nanowire structures over the substrate, the stack of nanowire structures including a topmost nanowire structure and a lower nanowire structure stacked lower than the topmost nanowire with respect to the substrate, a length of the topmost nanowire structure being less than a length of the lower nanowire structure;
a source/drain structure adjacent the topmost nanowire structure and wrapping around a first portion of the lower nanowire structure;
a gate structure wrapping around the topmost nanowire structure and wrapping around a second portion of the lower nanowire structure; and
an inner spacer structure laterally between the source/drain structure and the gate structure, the inner spacer structure including a first inner spacer segment adjacent to the topmost nanowire structure and a second inner spacer segment adjacent to the lower nanowire structure.
2. The device of claim 1 , wherein each of the first inner spacer segment and the second inner spacer segment includes a recessed profile toward the gate structure.
3. The device of claim 1 , wherein the source/drain structure includes a recessed edge portion adjacent to each of the first inner spacer segment and the second inner spacer segment.
4. The device of claim 1 , further comprising a first void region between the source/drain structure and the first inner spacer segment and a second void region between the source/drain structure and the second inner spacer segment.
5. The device of claim 4 , wherein the first void region and the second void region have substantially a same shape.
6. The device of claim 1 , wherein the substrate includes a fin structure below the stack of the nanowire structures.
7. The device of claim 1 , wherein the source/drain structure contacts an edge surface of the topmost nanowire structure.
8. The device of claim 1 , further comprising an outer spacer structure adjacent to the gate structure and over the stack of the nanowire structures, and
wherein an outer sidewall of the outer spacer structure substantially overlaps with an edge surface of the topmost nanowire structure.
9. The device of claim 1 , further comprising an outer spacer structure adjacent to the gate structure and over the stack of the nanowire structures, and
wherein the topmost nanowire structure extends below the outer spacer, an edge surface of the topmost nanowire structure overlapping a point between an outer sidewall and an inner sidewall of the outer spacer.
10. The device of claim 1 , wherein the source/drain structure includes one of silicon carbide, silicon carbon phosphide, silicon phosphide, silicon germanium or silicon-germanium-boron.
11. The device of claim 1 , wherein, the first inner spacer segment and the second inner spacer segment include substantially a same shape with respect to the adjacent gate structure.
12. A device, comprising:
a substrate; and
a first transistor and a second transistor over the substrate, each of the first transistor and the second transistor including:
a stack of nanowire structures over the substrate, the stack of nanowire structures including a topmost nanowire structure and a lower nanowire structure stacked lower than the topmost nanowire with respect to the substrate, a length of the topmost nanowire structure being less than a length of the lower nanowire structure;
a source/drain structure adjacent the topmost nanowire structure and wrapping around a first portion of the lower nanowire structure; and
a gate structure wrapping around the topmost nanowire structure and wrapping around a second portion of the lower nanowire structure;
wherein the topmost nanowire structure of the first transistor is at a different level from the topmost nanowire structure of the second transistor.
13. The device of claim 12 , wherein the stack of the nanowire structures of the first transistor includes silicon and the stack of the nanowire structures of the second transistor includes silicon germanium.
14. The device of claim 12 , wherein the source/drain structure of the first transistor contacts the substrate and the source/drain structure of the second transistor is separated from the substrate by a dielectric layer.
15. The device of claim 12 , wherein at least one of the first transistor and the second transistor includes a first inner spacer between the respective source/drain structure and the respective topmost nanowire structure and a second inner spacer between the respective source/drain structure and the respective lower nanowire structure.
16. The device of claim 15 , wherein the first inner spacer and the second inner spacer include substantially a same shape.
17. A method, comprising:
receiving a wafer, the wafer including a stack of epitaxy layers over a substrate, the stack of epitaxy layers including a plurality of semiconductor epitaxy layers and a plurality of sacrificial epitaxy layers stacked in an alternating sequence;
forming a fin structure including a stack of strips orientated in a first direction by patterning the stack of epitaxy layers, the stack of strips including a plurality of semiconductor strips and a plurality of sacrificial strips;
forming a gate structure over the fin structure;
forming a receded semiconductor strip by removing portions of a topmost semiconductor strip of the semiconductor strips such that a length of the topmost semiconductor strip is shorter than a length of a bottommost semiconductor strip of the semiconductor strips;
forming receded sacrificial strips by removing portions of the plurality of sacrificial strips, the receded sacrificial strips each including recessed edge surfaces;
forming an inner spacer adjacent to the recessed edge surfaces of the receded sacrificial strips; and
forming a source/drain structure adjacent to the inner spacer and the plurality of semiconductor strips.
18. The method of claim 17 , wherein the forming the inner spacer includes:
forming a dielectric layer adjacent to the receded sacrificial strips;
forming an etch stop layer selectively covering a first portion of the dielectric layer that is adjacent to the receded sacrificial strips;
removing a second portion of the dielectric layer that is exposed from the etch stop layer; and
removing the etch stop layer.
19. The method of claim 17 , wherein the forming the source/drain structure adjacent to the inner spacer including forming a void between the source/drain structure and the inner spacer.
20. The method of claim 17 , further comprising:
forming an open space by removing the gate structure and the receded sacrificial strips; and
forming a replacement gate within the open space.