Systems and methods for forming semiconductor cutting/trimming blades
A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.
1. A method of manufacturing or maintaining a semiconductor dicing or grinding blade, the method comprising:
moving a blade into contact with a grinding surface of a dressing board, the blade comprising:
an axis of rotation;
an annular cutting surface configured to rotate about the axis of rotation; and
a blade body extending between the axis of rotation and the annular cutting surface; and
rotating the annular cutting surface about the axis of rotation while the blade is in contact with the grinding surface of the dressing board, wherein rotation of the annular cutting surface causes the grinding surface of the dressing board to shape the annular cutting surface to a desired shape;
wherein at least a portion of a cross-section of the desired shape, as taken on a cutting plane parallel to the axis of rotation of the blade, is concave and is not parallel to the axis of rotation of the blade.
2. The method of claim 1 , wherein the cross-section of the desired shape, as taken on the cutting plane parallel to the axis of rotation of the blade, comprises a first portion and a second portion, wherein:
a tangent line to the first portion forms a first angle with respect to the axis of rotation of the blade;
a tangent line to the second portion forms a second angle with respect to the axis of rotation of the blade; and
the first angle is not equal to the second angle.
3. The method of claim 2 , wherein neither the first angle nor the second angle is parallel to the axis of rotation of the blade.
4. The method of claim 1 , wherein the cross-section of the desired shape, as taken on the cutting plane parallel to the axis of rotation of the blade, comprises a first portion and a second portion, wherein:
a tangent line or line parallel to two points along the first portion forms a first angle with respect to the axis of rotation of the blade;
a tangent line or line parallel to two points along the second portion forms a second angle with respect to the axis of rotation of the blade; and
the first angle is not equal to the second angle.
5. The method of claim 1 , wherein the cross-section of the desired shape, as taken on the cutting plane parallel to the axis of rotation of the blade, comprises a straight portion extending along at least 10% of the desired shape and a curved portion extending along at least 10% of the desired shape.
6. The method of claim 1 , wherein the cross-section of the desired shape, as taken on the cutting plane parallel to the axis of rotation of the blade, is curved along a majority of the desired shape.
7. The method of claim 1 , wherein moving the blade into contact with the grinding surface of the dressing board comprises moving the blade in a direction that is both perpendicular to the axis of rotation of the blade and parallel to a gravitational pull of the Earth.
8. The method of claim 1 , wherein moving the blade into contact with the grinding surface of the dressing board comprises moving the blade in a direction perpendicular to the axis of rotation of the blade.
9. The method of claim 1 , wherein during rotation of the annular cutting surface while in contact with the grinding surface, the entire annular cutting surface is shaped by the grinding surface without reorientation of the axis of rotation of the blade with respect to the dressing board.