Cooling system
The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.
1. A cooling system, comprising:
a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case;
a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet;
a first heat sink connected to a heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and
the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow,
wherein the first heat sink comprises at least one water cooling device each corresponding to a plurality of heat generating components and comprising a water tank and a water cooling pipe which goes through the plurality of heat generating components,
wherein the water cooling pipe has a water inlet and a water outlet each connected to the water tank, and
wherein the water cooling pipe is structured such to allow water to pass from the water tank to one heat generating component to the second het sink, and then pass from the heat sink to a next heat generating component.
2. The system of claim 1 , wherein the heat generating component has its surface coated with a layer of thermally conductive silicone grease, and
the water cooling pipe is mounted on the thermally conductive silicone grease for the heat generating component via a second mounting device,
wherein the second mounting device comprises a heat pipe base and a heat pipe cover, the heat pipe base being mounted on the thermally conductive silicone grease for the heat generating component and having at least one groove or slot provided on its top for mounting the at least one water cooling pipe, and wherein the water cooling pipe is pressed tightly onto the heat pipe base by the heat pipe cover.
3. The system of claim 1 , wherein the second heat sink comprises at least one set of cooling fins.