Micro LED transferring method, micro LED display panel and micro LED display device

1. A micro light emitting diode (Micro LED) display panel, comprising:

a substrate;

a pixel defining layer located on a surface of the substrate, wherein the pixel defining layer comprises a plurality of openings;

a first conducting layer located in each of the plurality of openings;

a photosensitive conductive bonding layer located on a surface of the first conducting layer facing away from the substrate; and

a Micro LED structure located on a surface of the photosensitive conductive bonding layer facing away from the first conducting layer, wherein at least one electrode of the Micro LED structure is electrically connected with the photosensitive conductive bonding layer, and the Micro LED structure has a vertical structure or an ipsilateral-electrode structure and comprises a first semiconductor layer, an active layer and a second semiconductor layer sequentially stacked, and the Micro LED structure further comprises a first electrode and a second electrode, and wherein

in a case that the Micro LED structure has the vertical structure, the first electrode is located on a surface of the first semiconductor layer facing away from the active layer, and the second electrode is located on a surface of the second semiconductor layer facing away from the active layer, and

in a case that the Micro LED structure has the ipsilateral-electrode structure, the first electrode is located on a surface of the first semiconductor layer facing away from the active layer, and the second electrode is located on a surface of the second semiconductor layer facing toward the active layer.

2. The Micro LED display panel according to claim 1 , wherein the photosensitive conductive bonding layer comprises a photosensitive layer, and the photosensitive layer is doped with metallic balls or nano-silver material.

3. The Micro LED display panel according to claim 2 , wherein a material of the photosensitive layer comprises acrylate pre-polymer, active monomers and photo-initiator, and the photo-initiator is visible light photo-initiator.

4. The Micro LED display panel according to claim 3 , wherein a dominant absorption wavelength of the photo-initiator is the same as a wavelength of light emitted by the Micro LED structure connected with the photosensitive conductive bonding layer.

5. The Micro LED display panel according to claim 1 , wherein in the case that the Micro LED structure has the vertical structure, the first electrode is electrically connected with the first conducting layer through the photosensitive conductive bonding layer.

6. The Micro LED display panel according to claim 5 , further comprising a second conducting layer, wherein the second conducting layer is electrically connected with the second electrode, and the Micro LED structure is controlled to emit light in response to an electrical signal applied to the first conducting layer and the second conducting layer.

7. The Micro LED display panel according to claim 6 , wherein

the Micro LED display panel is a passive matrix light emitting diode display panel; or

the Micro LED display panel is an active matrix light emitting diode display panel, wherein

in a case where the Micro LED display panel is an active matrix light emitting diode display panel, the substrate is provided with a plurality of thin film transistors, at least two of the plurality of thin film transistors are configured to control one Micro LED structure, wherein one of the at least two thin film transistors is configured as a driving transistor, and at least one of the at least two thin film transistors other than the thin film transistor configured as the driving transistor is configured to supply a control voltage to the driving transistor, and wherein

the driving transistor comprises a gate, a source and a drain;

the drain is electrically connected with the first conducting layer; and

the second conducting layers in the plurality of openings are electrically connected to each other.

8. The Micro LED display panel according to claim 1 , wherein in the case that the Micro LED structure has the ipsilateral-electrode structure,

the first conducting layer comprises a first sub conducting layer and a second sub conducting layer insulated from each other; and

the photosensitive conductive bonding layer comprises a first photosensitive conductive bonding layer and a second photosensitive conductive bonding layer, and wherein

the first photosensitive conductive bonding layer is located on a surface of the first sub conducting layer facing away from the substrate;

the second photosensitive conductive bonding layer is located on a surface of the second sub conducting layer facing away from the substrate;

the first electrode is electrically connected with the first sub conducting layer through the first photosensitive conductive bonding layer;

the second electrode is electrically connected with the second sub conducting layer through the second photosensitive conductive bonding layer; and

the Micro LED structure is controlled to emit light in response to an electrical signal applied to the first sub conducting layer and the second sub conducting layer.

9. The Micro LED display panel according to claim 8 , wherein the Micro LED display panel is a passive matrix light emitting diode display panel.

10. The Micro LED display panel according to claim 8 , wherein

the Micro LED display panel is an active matrix light emitting diode display panel,

the substrate further comprises a plurality of thin film transistors, at least two of the plurality of thin film transistors control one Micro LED structure, wherein one of the at least two thin film transistors is configured as a driving transistor, and at least one of the at least two thin film transistors other than the thin film transistor configured as the driving transistor is configured to supply a control voltage to the driving transistor, and wherein

the driving transistor comprises a gate, a source and a drain;

the drain is electrically connected with the first sub conducting layer; and

the second sub conducting layers in the plurality of openings are electrically connected to each other.

11. A Micro LED display device, comprising:

a Micro LED display panel, wherein the Micro LED display panel comprises:

a substrate;

a pixel defining layer located on a surface of the substrate, wherein the pixel defining layer comprises a plurality of openings;

first conducting layers respectively located in the plurality of openings;

a photosensitive conductive bonding layer located on a surface of each of the first conducting layers facing away from the substrate; and

a Micro LED structure located on a surface of the photosensitive conductive bonding layer facing away from the first conducting layer, wherein at least one electrode of the Micro LED structure is electrically connected with the photosensitive conductive bonding layer, and the Micro LED structure has a vertical structure or an ipsilateral-electrode structure and comprises a first semiconductor layer, an active layer and a second semiconductor layer sequentially stacked, and the Micro LED structure further comprises a first electrode and a second electrode, and wherein

in a case that the Micro LED structure has the vertical structure, the first electrode is located on a surface of the first semiconductor layer facing away from the active layer, and the second electrode is located on a surface of the second semiconductor layer facing away from the active layer, and

in a case that the Micro LED structure has the ipsilateral-electrode structure, the first electrode is located on a surface of the first semiconductor layer facing away from the active layer, and the second electrode is located on a surface of the second semiconductor layer facing toward the active layer.

12. A Micro LED transferring method for forming a Micro LED display panel, wherein the Micro LED transferring method comprises:

providing an array substrate, a plurality of Micro LED structures, photosensitive conductive bonding layers and a transferring head, wherein the array substrate comprises a substrate, a pixel defining layer located on the substrate and first conducting layers, the pixel defining layer comprises a plurality of openings, the first conducting layers are respectively located in the plurality of openings;

picking up, by the transferring head, the plurality of Micro LED structures;

bonding each of the picked plurality of Micro LED structures to one first conducting layer via the photosensitive conductive bonding layer;

conducting the Micro LED structure in response to an electrical signal applied to the first conducting layer; and

removing the transferring head, wherein

in a case that the Micro LED structure emits light normally, the Micro LED structure is bonded to the array substrate through the photosensitive conductive layer; and

in a case that the Micro LED structure emits light abnormally, the Micro LED structure is removed away by the transferring head.

13. The Micro LED transferring method according to claim 12 , wherein

the Micro LED structure has a vertical structure and comprises a first electrode and a second electrode located opposite to each other, the first conducting layer and the photosensitive conductive bonding layer are configured as entire layers, and the photosensitive conductive bonding layer is configured to connect with the first electrode, and

the providing a transferring head comprises:

providing a transferring head body; and

forming a second conducting layer on a pickup surface of the transferring head body, wherein the second conducting layer is configured to electrically connect with the second electrode, and wherein

in a case that the photosensitive conductive bonding layer connects the Micro LED structure with the first conducting layer, an electrical signal is applied to the first conducting layer and the second conducting layer to conduct the Micro LED structure.

14. The Micro LED transferring method according to claim 13 , wherein the second conducting layer is a metallic reflecting layer.

15. The Micro LED transferring method according to claim 12 , wherein

the Micro LED structure has an ipsilateral-electrode structure,

the first conducting layer comprises a first sub conducting layer and a second sub conducting layer insulated from each other, and

the photosensitive conductive bonding layer comprises a first photosensitive conductive bonding layer and a second photosensitive conductive bonding layer.

16. The Micro LED transferring method according to claim 15 , wherein the transferring head is capable of reflecting light.

17. The Micro LED transferring method according to claim 15 , wherein the providing a transferring head comprises:

providing a transferring head body; and

forming a reflecting layer on a pickup surface of the transferring head body.

18. The Micro LED transferring method according to claim 12 , wherein the bonding each of the picked plurality of Micro LED structures to one first conducting layer via the photosensitive conductive bonding layer comprises at least one of the following steps:

forming the photosensitive conductive bonding layer on a to-be-bonded surface of the Micro LED structure; and

forming the photosensitive conductive bonding layer on a surface of the first conducting layer.