Circuit carrier board structure and manufacturing method thereof
A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.
1. A circuit carrier board structure, comprising:
a first substrate having a first surface and a second surface opposite to the first surface, comprising:
a plurality of first build-up layers that are sequentially stacked, wherein each of the first build-up layers comprises a first dielectric layer and a first circuit layer, and the first build-up layers are electrically connected to one another;
a second substrate having a third surface and a fourth surface opposite to the third surface, comprising:
a plurality of second build-up layers that are sequentially stacked, wherein each of the second build-up layers comprises a second dielectric layer and a second circuit layer, and the second build-up layers are electrically connected to one another;
an adhesive layer located between the first substrate and the second substrate, wherein the second surface is combined to the third surface; and
a plurality of connection pads located on the first surface and electrically connected to the first circuit layer,
wherein the first substrate is electrically connected to the second substrate,
wherein a linewidth of the first circuit layer is smaller than a linewidth of each of the connection pads,
wherein the linewidth of the first circuit layer is less than or equal to 10 microns.
2. The circuit carrier board structure of claim 1 , wherein the first substrate further comprises a plurality of through-holes passing through the first substrate, the second substrate further comprises a second base and the second build-up layers are disposed on the second base, a plurality of conductive pads are located on the third surface and electrically connected to the second circuit layer, the through-holes expose the conductive pads, and a plurality of conductive structures are filled in the through-holes and electrically connected to the connection pads, the conductive pads, the first circuit layer, and the second circuit layer.
3. The circuit carrier board structure of claim 2 , wherein a top surface of each of the conductive structures is adjacent to the first surface, a bottom surface of each of the conductive structures is adjacent to the second surface, and a diameter of the top surface of each of the conductive structures is greater than a diameter of the bottom surface of each of the conductive structures,
wherein a top surface of the first circuit layer is adjacent to the second surface, a bottom surface of the first circuit layer is adjacent to the first surface, and a diameter of the top surface of the first circuit layer is greater than a diameter of the bottom surface of the first circuit layer.
4. The circuit carrier board structure of claim 3 , wherein each of the conductive structures has a taper-shaped cross section.
5. The circuit carrier board structure of claim 2 ,
wherein the second base comprises a core substrate or a coreless substrate.
6. The circuit carrier board structure of claim 1 , wherein the first substrate further comprises a plurality of conductive pillars located on the second surface and electrically connected to the first circuit layer, the second substrate further comprises a second base and the second build-up layers are disposed on the second base, a plurality of conductive blind vias are located on the third surface and electrically connected to the second circuit layer, the conductive pillars are filled in the conductive blind vias to form a plurality of conductive structures, and the conductive structures are electrically connected to the first circuit layer and the second circuit layer.
7. The circuit carrier board structure of claim 6 , wherein each of the conductive structures has a taper or pillar shaped cross section.
8. The circuit carrier board structure of claim 1 , further comprising:
a solder resist layer covering the first surface and the fourth surface, wherein the solder resist layer exposes a portion of the connection pads, the first circuit layer, and the second circuit layer.
9. The circuit carrier board structure of claim 1 , further comprising:
a plurality of electronic elements located on the first surface of the first substrate, wherein the electronic elements are electrically connected to the connection pads and the first circuit layer; and
a plurality of solder balls electrically connected to the second circuit layer.
10. The circuit carrier board structure of claim 1 , wherein the first circuit layer is embedded in the first dielectric layer, and the second circuit layer is embedded in the second dielectric layer.
11. The circuit carrier board structure of claim 1 , wherein a material of the first dielectric layer, the second dielectric layer, and the adhesive layer comprises one of a PrePreg, a flame-resistant glass fiber, a resin-coated cooper foil, an Ajinomoto Build-up (ABF) film, an adhesive, a solder resist material, or a photosensitive dielectric material.
12. The circuit carrier board structure of claim 1 , wherein the linewidth of the second circuit layer is greater than the linewidth of the first circuit layer.