Method of manufacturing a microstrip circulator
A microstrip circulator includes a carrier and a ferrite slab having a first side and a second side. The circulator further includes a first microwave epoxy positioned between the carrier and the first side of the ferrite slab. The circulator further includes a conductor having a center portion with three legs extending therefrom. The circulator further includes a second microwave epoxy positioned between the second side of the ferrite slab and the conductor. The circulator further includes an insulator and a third microwave epoxy positioned between the conductor and the insulator. The circulator further includes a magnet and a fourth epoxy positioned between the insulator and the magnet.
1. A method of manufacturing a microstrip circulator comprising:
forming a pre-circulator structure by stacking, in order, a carrier, a first microwave epoxy, a ferrite slab, a second microwave epoxy, a conductor having a center portion with three legs extending therefrom, a third microwave epoxy, and an insulator;
applying pressure to the pre-circulator structure and heating the pre-circulator structure with the pressure applied to a first temperature in order to cure the first microwave epoxy, the second microwave epoxy, and the third microwave epoxy;
stacking a fourth epoxy on the insulator and a magnet on the fourth epoxy; and
heating the combination of the pre-circulator structure, the fourth epoxy, and the magnet to a second temperature in order to cure the fourth epoxy.
2. The method of claim 1 wherein:
the pressure is between 15 pounds per square inch (psi) and 25 psi, and the first temperature is between 180 degrees Celsius and 350 degrees Celsius.
3. The method of claim 1 wherein the carrier includes six ground members, and forming the pre-circulator structure further includes a step of positioning each of the three legs of the conductor between a different pair of two of the six ground members.
4. The method of claim 1 wherein the insulator includes a non-conductive spacer having a surface with a metal layer positioned on at least a portion of the surface, and forming the pre-circulator structure includes orienting the surface with the metal layer away from the third microwave epoxy such that the surface with the metal layer faces the magnet in the completed microstrip circulator.
5. The method of claim 1 further comprising plating each of the carrier and the conductor with at least one of gold or silver.
6. The method of claim 1 further comprising forming the first microwave epoxy, the second microwave epoxy, and the third microwave epoxy by cutting each of the first microwave epoxy, the second microwave epoxy, and the third microwave epoxy in a desired shape from a sheet of microwave epoxy that has insulating properties, has a thickness between 0.0005 inches and 0.003 inches, and has a melting temperature of at least 175 degrees Celsius.
7. The method of claim 1 further comprising bending the three legs of the conductor to be at least partially flush with a plane of the carrier.
8. The method of claim 1 further comprising placing the completed microstrip circulator on a tape to be used in a tape and reel packaging.
9. A method of manufacturing a microstrip circulator comprising:
forming a pre-circulator structure by stacking, in order, a carrier, a first microwave epoxy, a ferrite slab, a second microwave epoxy, a conductor having a center portion with three legs extending therefrom, a third microwave epoxy, and an insulator;
bending the three legs of the conductor to be at least partially flush with a plane of the carrier;
applying pressure of between 15 pounds per square inch (psi) and 25 psi to the pre-circulator structure and heating the pre-circulator structure with the pressure applied to a first temperature of between 180 degrees Celsius and 350 degrees Celsius in order to cure the first microwave epoxy, the second microwave epoxy, and the third microwave epoxy;
stacking a fourth epoxy on the insulator and a magnet on the fourth epoxy; and
heating the combination of the pre-circulator structure, the fourth epoxy, and the magnet to a second temperature in order to cure the fourth epoxy.
10. The method of claim 9 wherein the carrier includes six ground members, and forming the pre-circulator structure further includes a step of positioning each of the three legs of the conductor between a different pair of two of the six ground members.
11. The method of claim 9 wherein the insulator includes a non-conductive spacer having a surface with a metal layer positioned on at least a portion of the surface, and forming the pre-circulator structure includes orienting the surface with the metal layer away from the third microwave epoxy such that the surface with the metal layer faces the magnet in the completed microstrip circulator.