Force sensor and manufacturing method thereof
There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed.
1. A force sensor, comprising:
a substrate laid with a drive electrode and a sensing electrode thereon;
a polymer material layer covering on the drive electrode and the sensing electrode;
an adhesive layer configured to adhere the polymer material layer to the substrate; and
a bump arranged on a surface of the polymer material layer, the surface not facing the substrate.
2. The force sensor as claimed in claim 1 , wherein the adhesive layer is arranged at an edge area of the polymer material layer.
3. The force sensor as claimed in claim 1 , wherein a further surface of the polymer material layer does not contact the substrate or other circuits disposed on the substrate, the further surface facing the substrate.
4. The force sensor as claimed in claim 1 , wherein a cross sectional area of the bump is equal to or smaller than the polymer material layer.
5. The force sensor as claimed in claim 1 , wherein the substrate is further laid with a metal layer configured to be adhered with the adhesive layer.
6. The force sensor as claimed in claim 1 , wherein
the polymer material layer is repeatedly attachable and detachable with the substrate via the adhesive layer, and
the polymer material layer further covers on a space between the drive electrode and the sensing electrode.
7. The force sensor as claimed in claim 1 , wherein the substrate further comprising a plurality of traces respectively connecting to the drive electrode and the sensing electrode.
8. The force sensor as claimed in claim 1 , further comprising a carrying layer attached to the surface of the polymer material layer not facing the substrate, and an area of the carrying layer is larger than the polymer material layer.
9. The force sensor as claimed in claim 8 , wherein the adhesive layer is arranged on the carrying layer.
10. A manufacturing method of a force sensor, the manufacturing method comprising:
providing a circuit board;
forming a drive electrode, a sensing electrode and traces respectively connecting to the drive electrode and the sensing electrode on the circuit board;
providing a polymer material layer;
overlapping the polymer material layer on the drive electrode and the sensing electrode and adhering to the circuit board; and
attaching a bump to a surface of the polymer material layer, the surface not facing the circuit board.
11. The manufacturing method as claimed in claim 10 , wherein when the polymer material layer is pressed, a dielectric constant of the polymer material layer is changed.
12. A force sensor, comprising:
a substrate laid with multiple sets of drive electrodes and sensing electrodes;
a polymer material layer adhering to the substrate and covering on the multiple sets of drive electrodes and sensing electrodes; and
multiple bumps arranged on a surface of the polymer material layer not facing the substrate, and each of the multiple bumps corresponding to one set of drive electrode and sensing electrode.
13. The force sensor as claimed in claim 12 , further comprising an adhesive layer configured for adhering the polymer material layer to the substrate.
14. The force sensor as claimed in claim 12 , wherein the substrate is a printed circuit board or a flexible circuit board.
15. The force sensor as claimed in claim 12 , wherein the polymer material layer is repeatedly attachable and detachable with the substrate.
16. The force sensor as claimed in claim 12 , wherein the substrate is further laid with a plurality of traces respectively connecting to the drive electrodes and the sensing electrodes.
17. The force sensor as claimed in claim 12 , further comprising a carrying layer arranged at the surface of the polymer material layer not facing the substrate.