IP Library Granted Patent US 11,132,033
Granted Patent B2
US 11,132,033 · App. 16/249,564 · Granted Sep 28, 2021

Modular controllers

Inventors: Conner Duva (Enfield, CT); Chi Wan (South Windsor, CT); Kevin Cremona (Westfield, MA)
Assignee: HAMILTON SUNDSTRAND CORPORATION
G06F1/182G06F13/4027H05K5/0026H05K7/1459H05K9/0022
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,132,033
App. No.
16/249,564
Granted
Sep 28, 2021
Kind
B2
Abstract

A modular controller includes an enclosure having an interior, a motherboard with a signal trace and a power trace supported within the interior of the enclosure, and one or more control section. The control section includes one or more of an input power section, an electromagnetic interference section, a logic section, a control section, a output power section, and a signal section that is supported by the motherboard to selectively flow of electrical power through the power trace using a control signal carried by the signal trace. Electrical systems and methods of making modular controllers are also described.

Claims (31)

1. A modular controller, comprising:

an enclosure having an interior;

a motherboard with a signal trace and a power trace supported within the interior of the enclosure; and

device sections, including:

(a) an input power section, including: an input power connector seated in the enclosure; an input power section pin seat, of a plurality of pin seats having a common number of pins, wherein each of the plurality of pin seats is supported by the motherboard and connected to the signal trace and the power trace; and an input power cable connecting the input power connector to pins of the pin seat;

(b) an electromagnetic interference (EMI) section, including: EMI circuitry; and an EMI section pin seat of the plurality of pin seats;

(c) a logic section, including: logic circuitry, and a logic section pin seat of the plurality of pin seats;

(d) a control section, including: power switching circuitry, and a control section pin seat of the plurality of pin seats;

(e) an ouput power section, including: an output power connector seated in the enclosure; an output power pin seat of the plurality of pin seats; and an output power cable connecting the output power connector to pins of the pin seat; and

(f) a signal section, including: a signal connector seated in the enclosure; a signal section pin seat of the plurality of pin seats; and a signal cable connecting the signal connector to pins of the pin seat;

the device sections being supported by the motherboard to selectively flow electrical power through the power trace using a control signal carried by the signal trace; and

wherein: each of the plurality of pin seats is arranged to receive a respective one of a plurality of daughterboards.

2. The modular controller as recited in claim 1 , wherein the EMI section comprises:

EMI circuitry comprising one or more of (a) an EMI protection circuit element, (b) a filter, and (c) a transformer;

the EMI section pin seat supported by the motherboard and connected to the signal trace and the power trace; and

the EMI section daughterboard seated in the EMI section pin seat and supporting the EMI circuitry, wherein the EMI circuitry is connected to the power trace by pins of the EMI section pin seat.

3. The modular controller as recited in claim 2 , further comprising an EMI gasket separating the EMI section daughterboard from the enclosure.

4. The modular controller as recited in claim 2 , wherein the motherboard comprises a chassis ground strap, the chassis ground strap electrically connected to the EMI section daughterboard.

5. The modular controller as recited in claim 1 , wherein the logic section comprises:

logic circuitry comprising one or more of (a) a field programmable gate array (FPGA) device, (b) a processor device, and (c) an application-specific integrated circuit (ASIC) device;

the logic section pin seat supported by the motherboard and connected to the signal trace and the power trace; and

the logic section daughterboard seated in the logic section pin seat and supporting the logic circuitry, wherein the logic circuitry is connected to the signal trace by pins of the logic section pin seat.

6. The modular controller as recited in claim 1 , wherein the control section comprises:

power switching circuitry comprising a solid-state switch device and a pulse width modular operatively connected to the solid-state switch device,

a pin seat supported by the motherboard and connected to the signal trace and the power trace; and

a daughterboard seated in the pin seat and supporting the power switching circuitry, wherein the power switching circuitry is connected to the signal trace by pins of the pin seat, wherein the power switching circuitry is connected to the power trace by pins of the pin seat.

7. The modular controller as recited in claim 1 , wherein the device section is peculiar to an electrical device operatively associated with the modular controller.

8. An electrical system, comprising:

a modular controller as recited in claim 1 ; and

a power source connected to a motor device by the modular controller, wherein the motherboard is generic, and wherein the device section is peculiar to the motor device and is operatively associated with the motor device.

9. An aircraft with an electrical system having a modular controller as recited in claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2019
From: DUVA, CONNER; WAN, CHI; CREMONA, KEVIN
To: HAMILTON SUNDSTRAND CORPORATION
Reel/Frame 049209/0091 →
Continuity (1)
Related Publication 20200225717A1 · Jul 16, 2020