Light emitting diode panel and method for manufacturing the light emitting diode panel
A light emitting diode (LED) panel is provided. The LED panel includes a thin-film transistor (TFT) backplane which includes a plurality of LED bonding areas, and a plurality of LEDs which are respectively bonded to the plurality of LED bonding areas, wherein the plurality of LED bonding areas are formed to have different heights on the TFT backplane according to an LED type bonded thereto, and wherein a relatively thin LED from among the plurality of LEDs is bonded to an LED bonding area of a relatively low height from among the plurality of LED bonding areas.
1. A light emitting diode (LED) panel comprising:
a thin-film transistor (TFT) backplane comprising:
an insulator film disposed on a top surface of a substrate;
a plurality of organic films disposed on a top surface of the insulator film, the plurality of organic films having different heights from the top surface of the insulator film, each of the plurality of organic films being one among a transparent organic film, an opaque organic film, and a polyimide; and
pixel electrodes disposed on a top surface of each of the plurality of organic films; and
a plurality of LEDs respectively bonded to the pixel electrodes disposed on the top surface of each of the plurality of organic films,
wherein the plurality of organic films has the different heights according to a type of each of the plurality of LEDs respectively bonded to the pixel electrodes disposed on the top surface of each of the plurality of organic films,
wherein a thinnest LED among the plurality of LEDs is bonded to the pixel electrodes disposed on the top surface of organic film having a lowest height among the plurality of organic films,
wherein an additional organic film is formed on an area between the pixel electrodes disposed on the top surface of each of the plurality of orqanic films, the additional organic film having a predetermined height from the top surface of each of the plurality of organic films,
wherein the plurality of LEDs comprises a red LED, a green LED, and a blue LED, and
wherein the red LED is thinner than either one or both of the green LED and the blue LED.
2. The LED panel as claimed in claim 1 , wherein the plurality of LEDs respectively corresponds to a plurality of sub pixels included in one pixel.
3. The LED panel as claimed in claim 1 , wherein the plurality of organic films is a black matrix.
4. The LED panel as claimed in claim 1 , wherein the one organic film is disposed at a predetermined height between the pixel electrodes disposed on the one organic film.
5. A light emitting diode (LED) panel comprising:
a thin-film transistor (TFT) backplane comprising:
an insulator film disposed on a top surface of a substrate;
a plurality of organic films disposed on a top surface of the insulator film, the plurality of organic films having different heights from a top surface of the insulator film, each of the plurality of organic films being one among a transparent organic film, an opaque organic film, and a polyimide; and
pixel electrodes disposed on a top surface of each of the plurality of organic films; and a plurality of LEDs respectively bonded to the pixel electrodes disposed on the top surface of each of the plurality of organic films,
wherein the plurality of organic films has the different heights according to a type of each of the plurality of LEDs respectively bonded to the pixel electrodes disposed on the top surface of each of the plurality of organic films,
wherein a thinnest LED among the plurality of LEDs is bonded to the pixel electrodes disposed on the top surface of organic film having a lowest height among the plurality of organic films,
wherein an additional organic film is formed on an area between the pixel electrodes disposed on the top surface of each of the plurality of organic films, the additional organic film having a predetermined height from the top surface of each of the plurality of organic films,
wherein the plurality of LEDs comprises a red LED, a green LED, and a blue LED, and
wherein the red LED has a smallest thickness among the plurality of LEDs.
6. The LED panel as claimed in claim 5 , wherein one LED having a smallest thickness among the plurality of LEDs is bonded to the pixel electrodes disposed on the top surface of one organic film having a smallest height among the plurality of organic films.
7. The LED panel as claimed in claim 5 , wherein one among the plurality of organic films is disposed at a predetermined height between the pixel electrodes disposed on the one among the plurality of organic films.