IP Library Granted Patent US 11,605,758
Granted Patent B2
US 11,605,758 · App. 16/252,144 · Granted Mar 14, 2023

Display device including nanostructured LEDs connected in parallel

Inventors: Steven Konsek (Alexandria, VA); Jonas Ohlsson (Malmo, SE); Yourii Martynov (Geldrop, NL); Peter Jesper Hanberg (Soborg, DK)
Assignee: NANOSYS, INC.
H01L33/08B82Y20/00F21S41/153H01L33/24H01L33/60H01L33/62F21S41/663F21Y2105/10F21Y2115/10H01L27/153H01L27/156H01L33/18H01L33/20H01L33/32H01L33/38H01L33/40H01L2924/0002Y10S977/762Y10S977/95
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,605,758
App. No.
16/252,144
Granted
Mar 14, 2023
Kind
B2
Abstract

The device according to the invention comprises a nanostructured LED with a first group of nanowires protruding from a first area of a substrate and a contacting means in a second area of the substrate. Each nanowire of the first group of nanowires comprises a p-i-n-junction and a top portion of each nanowire or at least one selection of nanowires is covered with a light-reflecting contact layer. The contacting means of the second area is in electrical contact with the bottom of the nanowires, the light-reflecting contact layer being in electrical contact with the contacting means of the second area via the p-i-n-junction. Thus when a voltage is applied between the contacting means of the second area and the light-reflecting contact layer, light is generated within the nanowire. On top of the light-reflecting contact layer, a first group of contact pads for flip-chip bonding can be provided, distributed and separated to equalize the voltage across the layer to reduce the average serial resistance.

Claims (16)

1. A light emitting diode (LED) display device comprising:

LED die comprising red LEDs, green LEDs, and blue LEDs each comprising a respective GaN buffer layer, and that each comprise pixels of a red-green-blue display device; and

a sub-mount comprising transistors for driving the pixels and contact pads attached to p-contact pads and n-contact pads of the LED die,

wherein:

the red LEDs are configured to emit red light through the buffer layer upon application of voltage thereto, the red LEDs comprise a gallium nitride or an indium gallium nitride layer;

the green LEDs are configured to emit green light through the buffer layer upon application of voltage thereto;

the blue LEDs are configured to emit blue light through the buffer layer upon application of voltage thereto;

the red LEDs, the green LEDs and the blue LEDs comprise a semiconductor material core of a first conductivity type, a semiconductor material active region located radially outward of the semiconductor material core, and a semiconductor material shell of a second conductivity type located radially outward of the semiconductor material active region; and

the red LEDs, the green LEDs and the blue LEDs comprise a plurality of contact groups of red LEDs, green LEDs and blue LEDs, respectively, wherein each of the red LEDs, the green LEDs and the blue LEDs within a contact group are electrically connected in parallel, and the plurality of contact groups of red LEDs, green LEDs and blue LEDs are arranged in a two-dimensional array on the sub-mount and each contact group of red LEDs, green LEDs and blue LEDs is individually and exclusively addressable based on a column and row location of the respective contact group within the two-dimensional array.

2. The LED display device of claim 1 , wherein the red LEDs, the green LEDs and the blue LEDs comprise nanowires.

3. The LED display of claim 2 , further comprising an electrically conductive material that extends down the sidewalls of at least a portion of the nanowires of the red LEDs, the green LEDs and the blue LEDs.

4. The LED display device of claim 1 , wherein the red LEDs, the green LEDs and the blue LEDs comprise pn or p-i-n junctions.

5. The LED display device of claim 1 , wherein the gallium nitride or the indium gallium nitride layer in the red LEDs comprises the GaN buffer layer.

6. The LED display device of claim 1 , wherein the red LEDs comprise an active layer which is the indium gallium nitride layer.

7. The LED display device of claim 1 , further comprising a transparent contact layer or a light-reflecting layer covering at least a portion of the red LEDs, the green LEDs and the blue LEDs.

8. The LED display device of claim 1 , wherein each of the red LEDs, the green LEDs and the blue LEDs within the contact group are electrically connected in parallel via a first contact pad to a same row line and a same column line, and are electrically connected via a second contact pad to a common contact of a plurality of contact groups.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2024
From: GLO TECHNOLOGIES LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 068297/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2023
From: SYSONAN, INC.
To: GLO TECHNOLOGIES LLC
Reel/Frame 065178/0210 →
CHANGE OF NAME Recorded Oct 5, 2023
From: NANOSYS, INC.
To: SYSONAN, INC.
Reel/Frame 065156/0416 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 059569 / FRAME 0840 Recorded Sep 7, 2023
From: FORTRESS CREDIT CORP.,
To: NANOSYS, INC.
Reel/Frame 064836/0263 →
SECURITY INTEREST Recorded Apr 1, 2022
From: NANOSYS, INC.
To: FORTRESS CREDIT CORP., AS AGENT
Reel/Frame 059569/0840 →
NUNC PRO TUNC ASSIGNMENT Recorded Aug 13, 2021
From: GLO AB
To: NANOSYS, INC.
Reel/Frame 057184/0564 →