Method for producing circuit board and method for producing integrated circuit including the same
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
1. A method for producing a circuit board, comprising:
providing a substrate;
forming a toner image on the substrate using a thermoplastic toner, wherein the thermoplastic toner contains toner articles in which a volume ratio of particles having a particle diameter of 16 μm or more is 1% or less relative to a total volume of the toner particles; and
forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the formed toner image on the substrate and simultaneously heating the formed toner image and the conductive foil layer to form a conductive wire constituted by the conductive foil layer.
2. The method for producing a circuit board according to claim 1 , wherein the thermoplastic toner has a flow-start temperature of 80° C. or lower and a half-fall temperature of 95° C. or lower under heating.
3. The method for producing a circuit board according to claim 2 , wherein the flow-start temperature of the thermoplastic toner is 50° C. to 75° C. and the half-fall temperature of the thermoplastic toner is 60° C. to 86° C.
4. The method for producing a circuit board according to claim 1 , wherein the thermoplastic toner contains an amorphous resin and a crystalline resin.
5. The method for producing a circuit board according to claim 4 , wherein a toner particle of the thermoplastic toner includes a core containing the amorphous resin and the crystalline resin and a coating portion containing an amorphous resin.
6. The method for producing a circuit board according to claim 5 , wherein in the core containing the amorphous resin and the crystalline resin, a lower limit of content of the crystalline resin is 15 mass % or more relative to a total amount of resin contained in the core.
7. The method for producing a circuit board according to claim 6 , wherein in the core containing the amorphous resin and the crystalline resin, an upper limit of the content of the crystalline resin is 50 mass % or less relative to the total amount of resin contained in the core.
8. The method for producing a circuit board according to claim 1 , wherein the heating the formed toner image and the conductive foil layer comprises heating the formed toner image and the conductive foil layer at a temperature of 60° C. or higher, the method further comprising applying a pressure of 1 MPa or less to the formed toner image and the conductive foil layer while the formed toner image and the conductive foil layer are heated.
9. The method for producing a circuit board according to claim 1 , wherein the forming the conductive foil layer having a thickness of 0.1 μm to 2 μm on the formed toner image comprising transferring the conductive foil layer having a thickness of 0.1 μm to 2 μm on a film support onto the formed toner image.
10. The method for producing a circuit board according to claim 9 , further comprising separating a release layer from the conductive foil layer when the conductive foil layer is transferred, wherein the release layer is disposed between the conductive foil layer and the film support.
11. The method for producing a circuit board according to claim 1 , wherein the forming the toner image on the substrate comprises: transferring the toner image on the substrate and fixing the toner image to the substrate.
12. The method for producing a circuit board according to claim 1 , wherein a volume average particle diameter (D50v) of the toner particles is 2 micrometers or more and 10 micrometers or less.
13. The method for producing a circuit board according to claim 1 , wherein the conducive foil layer comprises gold, silver, copper, or aluminum.
14. A method for producing an integrated circuit, comprising:
producing a circuit board, comprising:
providing a substrate;
forming a toner image on the substrate using a thermoplastic toner, wherein the thermoplastic toner contains toner particles in which a volume ratio of particles having a particle diameter of 16 μm or more is 1% or less relative to a total volume of the toner particles; and
forming a conductive foil layer having a thickness of 0.1 μM to 2 μm on the formed toner image on the substrate and simultaneously heating the formed toner image and the conductive foil layer to form a conductive wire constituted by the conductive foil layer; and
attaching a semiconductor device to the produced circuit board.