Advanced solder alloys for electronic interconnects
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
1. A lead-free solder alloy consisting of:
(a) from greater than 3.6 to 10 wt. % silver;
(b) from greater than 0 to 10 wt. % bismuth;
(c) from greater than 0 to 3 wt. % copper;
(d) from greater than 0 to 1.4 wt. % antimony;
(e) from greater than 0 to 1 wt. % nickel;
(f) the balance tin, together with any unavoidable impurities.
2. A soldered joint comprising a lead-free solder alloy consisting of:
(a) from greater than 3.6 to 10 wt. % of silver;
(b) from greater than 0 to 10 wt. % of bismuth;
(c) from greater than 0 to 3 wt. % of copper;
(d) from greater than 0 to 1.4 wt. % of antimony;
(e) from greater than 0 to 1 wt. % of nickel;
(f) the balance tin, together with any unavoidable impurities.
3. A method of soldering, the method comprising the steps of:
a) applying a solder alloy to a substrate, wherein the solder is a lead free solder alloy according to claim 1 ;
wherein the solder can be applied by wave soldering, Surface Mount Technology (SMT) soldering, die attach soldering, thermal interface soldering, hand soldering, laser and RF induction soldering, rework soldering, lamination, and combinations thereof.
4. The method according to claim 3 , wherein the substrate is a printed circuit board, flexible substrate, a metal core circuit board, a leadframe, a direct bond copper on Al 2 O 3 or AlN.
5. The method according to claim 3 , wherein the substrate is an LED component, LED die, and LED package, a high power switch, a high power amplifier or any other electronic component.
6. The method according to claim 5 , wherein the LED component exhibits less than 5% change in CCT over 1500 temperature cycles.
7. The method according to claim 3 , wherein the solder alloy has a thermal conductivity drop of less than 10% when the temperature of the alloy reaches 150° C.
8. The method according to claim 3 , wherein the electrical resistivity of the solder alloy increases less than 20% when the temperature of the alloy reaches 85° C.
9. The method according to claim according to claim 5 , wherein the LED with the solder alloy applied exhibits at least 10% higher luminous efficacy compared to an LED with SAC305.
10. The method according to claim 5 wherein the LED with the solder alloy applied shows a smaller drop in luminous flux during temperature cycling compared to an LED with SAC305.
11. The method according to claim 5 , wherein the solder is applied to the LED using die attach.
12. The lead-free solder alloy of claim 1 , wherein the alloy has melting point of 200 to 222 ° C.
13. The solder alloy of claim 1 , wherein the alloy is in the form of a stick, a solid or flux cored wire, a foil or strip, or a powder or paste (powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, with or without a flux core or a flux coating.