Semiconductor device and manufacturing method thereof
A method includes forming a semiconductor fin over a substrate; forming a plurality of isolation structures adjacent to the semiconductor fin; etching the semiconductor fin to form a recess between the isolation structures; forming a first epitaxy layer in the recess; forming a second epitaxy layer over the first epitaxy layer; forming a third epitaxy layer over the second epitaxy layer, in which the first epitaxy layer has a higher germanium (Ge) concentration than the second and third epitaxy layers; etching the third epitaxy layer; and forming a dielectric layer in contact with the third epitaxy layer after etching the third epitaxy layer.
1. A method, comprising:
forming a semiconductor fin over a substrate;
forming a plurality of isolation structures adjacent to the semiconductor fin;
etching the semiconductor fin to form a recess between the isolation structures;
forming a first epitaxy layer in the recess;
forming a second epitaxy layer over the first epitaxy layer;
forming a third epitaxy layer over the second epitaxy layer, wherein the first epitaxy layer has a higher germanium (Ge) concentration than the second and third epitaxy layers;
etching the third epitaxy layer; and
forming a dielectric layer in contact with the third epitaxy layer after etching the third epitaxy layer.
2. The method of claim 1 , further comprising rounding corners of the semiconductor fin prior to etching the semiconductor fin to form the recess.
3. The method of claim 1 , further comprising etching the second epitaxy layer prior to forming the third epitaxy layer.
4. The method of claim 1 , further comprising:
forming a fourth epitaxy layer over the second epitaxy layer; and
etching the fourth epitaxy layer prior to forming the third epitaxy layer.
5. The method of claim 1 , wherein an etchant of etching the third epitaxy layer comprises hydrochloric acid (HCl).
6. The method of claim 1 , further comprising etching the isolation structures to enlarge the recess prior to forming the first epitaxy layer.
7. The method of claim 1 , wherein a top surface of the third epitaxy layer has (001) crystalline orientation, and a sidewall of the third epitaxy layer has (111) crystalline orientation.
8. The method of claim 1 , wherein the first epitaxy layer is made of silicon germanium, and the second and third epitaxy layers are made of pure silicon.
9. The method of claim 1 , further comprising doping a p-type dopant into the third epitaxy layer during forming the third epitaxy layer, wherein the second epitaxy layer is free from the p-type dopant.
10. A method, comprising:
forming a semiconductor fin over a substrate;
forming a gate stack across the semiconductor fin;
etching the semiconductor fin to form a recess therein;
performing a first epitaxy process to grow a first epitaxy layer in the recess, wherein the first epitaxy layer has a first portion in the recess and a second portion protruding above the recess;
performing a second epitaxy process to grow a second epitaxy layer over the first epitaxy layer, wherein no etching is performed between the first and second epitaxy processes;
forming a third epitaxy layer over the second epitaxy layer, wherein the third epitaxy layer comprises a top surface having (001) crystalline orientation and a sidewall having (111) crystalline orientation, and the top surface and the sidewall form a first corner therebetween;
rounding the first corner; and
forming a dielectric layer in contact with the third epitaxy layer after rounding the first corner.
11. The method of claim 10 , wherein the sidewall of the second epitaxy layer comprises a first facet and a second facet forming a second corner therebetween, and the method further comprises rounding the second corner.
12. The method of claim 10 , further comprising etching the semiconductor fin prior to forming the gate stack to enlarge a top surface of the semiconductor fin.
13. The method of claim 12 , wherein forming the gate stack is performed such that an interface between the gate stack and the semiconductor fin has rounded profile.
14. The method of claim 10 , wherein the second epitaxy layer comprises a top surface having (001) crystalline orientation and a sidewall having (111) crystalline orientation, and the top surface and the sidewall form a second corner therebetween, and the method further comprises rounding the second corner.
15. The method of claim 14 , further comprising:
forming a fourth epitaxy layer over the second epitaxy layer prior to forming the third epitaxy layer, wherein the fourth epitaxy layer comprises a top surface having (001) crystalline orientation and a sidewall having (111) crystalline orientation, and the top surface and the sidewall form a third corner therebetween; and
rounding the third corner.
16. A device, comprising:
a substrate having a semiconductor fin;
a gate stack over the semiconductor fin;
a first epitaxy layer over the semiconductor fin;
a second epitaxy layer over the first epitaxy layer; and
a third epitaxy layer over the second epitaxy layer, wherein the third epitaxy layer has a rounded top surface vertically over a rounded top surface of the second epitaxy layer, and wherein the first epitaxy layer has a higher germanium (Ge) concentration than the second and third epitaxy layers.
17. The device of claim 16 , wherein the third epitaxy layer comprises a sidewall having (111) crystalline orientation.
18. The device of claim 17 , wherein the sidewall comprises a first facet and a second facet, and the first and second facets have (111) crystalline orientation.
19. The device of claim 16 , wherein the first epitaxy layer is made of silicon germanium and the third epitaxy layer is made of pure silicon.
20. The device of claim 16 , wherein the semiconductor fin has rounded top corners.