IP Library › Granted Patent US 10,998,376
Granted Patent B2
US 10,998,376 · App. 16/261,158 · Granted May 4, 2021

Qubit-optical-CMOS integration using structured substrates

Inventors: Jason S. Orcutt (Katonah, NY); Devendra K. Sadana (Pleasantville, NY)
Assignee: International Business Machines Corporation
H01L27/18G02B6/29341G06N10/00H01L39/025H01L39/223
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Quick Facts
Patent No.
US 10,998,376
App. No.
16/261,158
Granted
May 4, 2021
Kind
B2
Abstract

Techniques for the integration of SiGe/Si optical resonators with qubit and CMOS devices using structured substrates are provided. In one aspect, a waveguide structure includes: a wafer; and a waveguide disposed on the wafer, the waveguide having a SiGe core surrounded by Si, wherein the wafer has a lower refractive index than the Si (e.g., sapphire, diamond, SiC, and/or GaN). A computing device and a method for quantum computing are also provided.

Claims (30)

1. A waveguide structure, comprising:

a wafer;

a waveguide disposed on the wafer, the waveguide comprising a silicon germanium (SiGe) core surrounded by silicon (Si), wherein the wafer has a lower refractive index than the Si, wherein the waveguide has a ring shape, wherein the waveguide comprises a resonator-based microwave-to-optical transducer; and

at least one quantum bit (qubit) disposed on the wafer.

2. The waveguide structure of claim 1 , wherein the wafer comprises a material selected from the group consisting of: sapphire, diamond, silicon carbide (SiC), gallium nitride (GaN), and combinations thereof.

3. The waveguide structure of claim 1 , further comprising:

a top electrode disposed on the waveguide.

4. The waveguide structure of claim 3 , wherein the top electrode has a crescent shape.

5. The waveguide structure of claim 1 , further comprising:

a bottom electrode disposed on a side of the wafer opposite the waveguide.

6. The waveguide structure of claim 1 , further comprising:

bias electrodes disposed on the wafer on opposite sides of the waveguide.

7. The waveguide structure of claim 1 , wherein the at least one qubit comprises:

a superconducting bottom electrode on an Si layer; and

a superconducting top electrode separated from the superconducting bottom electrode by an insulator.

8. The waveguide structure of claim 7 , wherein the Si layer is undercut beneath the superconducting bottom electrode such that the at least one qubit is suspended over the wafer.

9. The waveguide structure of claim 1 , further comprising:

at least one superconducting bus path between the waveguide and the at least one qubit.

10. The waveguide structure of claim 9 , further comprising:

at least one field effect transistor (FET) disposed on the wafer connecting the at least one superconducting bus path between the waveguide and the at least one qubit.

11. A computing device, comprising:

a waveguide structure comprising a wafer, and a waveguide disposed on the wafer, the waveguide comprising a resonator-based microwave-to-optical transducer having a silicon germanium core surrounded by silicon (Si), wherein the wafer has a lower refractive index than the Si;

quantum bits (qubits) disposed on the wafer;

superconducting bus paths between the waveguide and the qubits; and

field effect transistors disposed on the wafer connecting the superconducting bus paths between the waveguide and the qubits.

12. The computing device of claim 11 , wherein the wafer comprises a material selected from the group consisting of: sapphire, diamond, SiC, GaN, and combinations thereof.

13. The computing device of claim 11 , wherein each of the qubits comprises:

a superconducting bottom electrode on an Si layer; and

a superconducting top electrode separated from the superconducting bottom electrode by an insulator.

14. The computing device of claim 13 , wherein the Si layer is undercut beneath the superconducting bottom electrode such that at least one qubit is suspended over the wafer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2019
From: ORCUTT, JASON S.; SADANA, DEVENDRA K.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 048170/0329 →
Continuity (1)
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